公开(公告)号：US20110260296A1

公开(公告)日：2011-10-27

申请号：US12994211

申请日：2009-11-23

申请人： Florian Bieck ,  Carolinda Sukmadevi Asfhandy ,  Sven-Manfred Spiller

发明人： Florian Bieck ,  Carolinda Sukmadevi Asfhandy ,  Sven-Manfred Spiller

IPC分类号： H01L29/06 ,  H01L21/768

摘要： A semiconductor wafer (12) with a thinned central portion (2) has a first side (3) and a second side (4) and at least one reinforcement structure for increasing the radial bending resistance of the semiconductor wafer (12). The reinforcement structure provides at least one passage (10) for a fluid flow between an inner face (9) of said one reinforcement structure towards an outer face (8) of the reinforcement structure. The passages (10) are manufactured in a z-direction coming from above the semiconductor wafer (12) in a direction which is essentially perpendicular to the surface, e.g. to the first side (3), of the semiconductor wafer (12).

摘要翻译： 具有变薄的中心部分（2）的半导体晶片（12）具有第一侧面（3）和第二侧面（4）以及用于增加半导体晶片（12）的径向抗弯曲性的至少一个加强结构。 加强结构提供至少一个通道（10），用于在所述一个加强结构的内表面（9）之间朝向加强结构的外表面（8）流动。 通道（10）沿着基本上垂直于表面的方向例如半导体晶片（12）的上方沿z方向制造。 到半导体晶片（12）的第一侧（3）。

公开(公告)号：US07071521B2

公开(公告)日：2006-07-04

申请号：US10994659

申请日：2004-11-22

申请人： Jürgen Leib ,  Florian Bieck

发明人： Jürgen Leib ,  Florian Bieck

IPC分类号： H01L27/14 ,  H01L21/00 ,  H01L21/302

CPC分类号： B81C1/00301 ,  B81B2201/047 ,  B81B2207/096

摘要： A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

摘要翻译： 一种方法从基板产生微电子机械部件，该基板具有与第一侧基本相反的第一侧和第二侧，并且至少第一侧具有至少一个微机电元件。 该方法包括以下步骤：将至少一个导电通道提供到基板中，将第一侧连接到第二侧，并将至少一个支撑件固定到基板的第一侧，其中至少一个导电通道被薄化覆盖 具有机械稳定性的基板材料由支撑件确保。

公开(公告)号：US09063407B2

公开(公告)日：2015-06-23

申请号：US13814882

申请日：2011-08-10

申请人： Florian Bieck ,  Sven Spiller

发明人： Florian Bieck ,  Sven Spiller

IPC分类号： G03F1/50 ,  G03F1/00

CPC分类号： G03F1/00 ,  G03F1/14 ,  G03F1/50 ,  G03F1/60

摘要： A photolithography mask for a semiconductor wafer. The mask includes a protrusion section that protrudes from a handling section of the mask. An outer shape of the handling section enables handling by a mask aligner device. The protrusion includes a face surface provided at a level which is different from a face surface area of the handling section.

摘要翻译： 一种用于半导体晶片的光刻掩模。 掩模包括从掩模的处理部分突出的突出部分。 处理部的外形能够通过掩模对准装置进行处理。 突出部包括设置在与处理部的面部表面不同的水平面的面。

公开(公告)号：US07285834B2

公开(公告)日：2007-10-23

申请号：US11378962

申请日：2006-03-18

申请人： Jürgen Leib ,  Florian Bieck

发明人： Jürgen Leib ,  Florian Bieck

IPC分类号： H01L27/14 ,  H01L21/00

CPC分类号： B81C1/00301 ,  B81B2201/047 ,  B81B2207/096

摘要： A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

摘要翻译： 一种方法从基板产生微电子机械部件，该基板具有与第一侧基本相反的第一侧和第二侧，并且至少第一侧具有至少一个微机电元件。 该方法包括以下步骤：将至少一个导电通道提供到衬底中，将第一侧连接到第二侧，以及将至少一个支撑件固定到衬底的第一侧，其中至少一个导电通道被薄化覆盖 具有机械稳定性的基板材料由支撑件确保。

公开(公告)号：US07160478B2

公开(公告)日：2007-01-09

申请号：US10487604

申请日：2002-08-26

申请人： Jürgen Leib ,  Florian Bieck

发明人： Jürgen Leib ,  Florian Bieck

IPC分类号： B29D11/00 ,  H01B13/00

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.

摘要翻译： 提供一种电子部件的制造方法。 该方法包括在晶片上提供至少一个管芯，所述至少一个管芯至少在第一侧上具有至少一个传感器技术有源和/或发射器件; 产生至少一个具有至少一个可用于至少一个传感器技术活动和/或发射装置的结构的图案化载体; 将所述晶片与所述至少一个图案化支撑件接合，使得所述第一侧面向所述至少一个图案化支撑件; 以及将所述至少一个管芯与所述晶片分离。

公开(公告)号：US06911392B2

公开(公告)日：2005-06-28

申请号：US10228699

申请日：2002-08-26

申请人： Florian Bieck ,  Jürgen Leib

发明人： Florian Bieck ,  Jürgen Leib

IPC分类号： H01L23/52 ,  H01L20060101 ,  H01L21/00 ,  H01L21/3205 ,  H01L21/44 ,  H01L21/76 ,  H01L21/768 ,  H01L23/00 ,  H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L25/16 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203

CPC分类号： H01L21/76877 ,  H01L21/76898 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2221/68363 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014

摘要： The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the to the terminal contact [sic] and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.

摘要翻译： 本发明提出了一种用于为集成在基底材料中的至少一个部件产生电接触连接的方法，该基底材料具有第一表面区域，并且至少一个末端接触件至少部分地布置在第一表面区域中， 其特征在于通过对第一表面区域施加覆盖物并且产生至少一个接触通道，该接触通道在衬底材料中相对于第一表面区域横向延伸，在该过程中，为了形成 在要提供的第二表面区域中的至少一个接触位置，经由相应的接触通道产生从接触位置到至少一个端子接触件的至少一个电接触连接。 非常有利的是，以这种方式可能在端子接触件上产生接触位置，因此可以在衬底材料的该侧上产生电连接到端子接触件的接触位置，该位置是 远离有源表面，可以分配沿着衬底材料延伸的沟槽和根据现有技术围绕部件引导的侧向接触。

公开(公告)号：US06894358B2

公开(公告)日：2005-05-17

申请号：US10228804

申请日：2002-08-26

申请人： Jūrgen Leib ,  Florian Bieck

发明人： Jūrgen Leib ,  Florian Bieck

IPC分类号： B81C1/00 ,  B81B20060101 ,  B81B7/00 ,  B81B7/02 ,  H01L21/00 ,  H01L21/76 ,  H01L21/8238 ,  H01L21/84 ,  H01L27/14 ,  H01L29/82

CPC分类号： B81C1/00301 ,  B81B2201/047 ,  B81B2207/096

摘要： A microelectromechanical component is produced from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, by introducing at least one conductive passage is introduced into the substrate, connecting the first side to the second side.

摘要翻译： 从具有与第一侧基本相反的第一侧和第二侧的衬底制造微电子机械部件，至少通过引入至少一个导电通道的至少一个微机电元件的第一侧被引入到衬底中， 将第一侧连接到第二侧。

公开(公告)号：US09245765B2

公开(公告)日：2016-01-26

申请号：US13394812

申请日：2010-10-14

申请人： Florian Bieck

发明人： Florian Bieck

IPC分类号： H01L23/48 ,  B32B37/10 ,  B32B38/10 ,  H01L21/31 ,  H01L21/67 ,  H01L21/768

CPC分类号： H01L21/31 ,  H01L21/67132 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/11 ,  H01L2224/13 ,  H01L2924/1461 ,  Y10T156/12 ,  H01L2924/00

摘要： Implementations and techniques for applying a film to a semiconductor wafer and for processing a semiconductor wafer are generally disclosed.

摘要翻译： 通常公开了将膜施加到半导体晶片和用于处理半导体晶片的实施方式和技术。

公开(公告)号：US20130260291A1

公开(公告)日：2013-10-03

申请号：US13814882

申请日：2011-08-10

申请人： Florian Bieck ,  Sven Spiller

发明人： Florian Bieck ,  Sven Spiller

IPC分类号： G03F1/00

CPC分类号： G03F1/00 ,  G03F1/14 ,  G03F1/50 ,  G03F1/60

摘要： A photolithography mask for a semiconductor wafer. The mask includes a protrusion section that protrudes from a handling section of the mask. An outer shape of the handling section enables handling by a mask aligner device. The protrusion includes a face surface provided at a level which is different from a face surface area of the handling section.

摘要翻译： 一种用于半导体晶片的光刻掩模。 掩模包括从掩模的处理部分突出的突出部分。 处理部的外形能够通过掩模对准装置进行处理。 突出部包括设置在与处理部的面部表面不同的水平面的面。

公开(公告)号：US20120299610A1

公开(公告)日：2012-11-29

申请号：US13145109

申请日：2009-11-26

申请人： Florian Bieck

发明人： Florian Bieck

IPC分类号： G01R31/00

CPC分类号： G01R31/2887

摘要： A method for testing a semiconductor wafer comprises providing a semiconductor wafer. The semiconductor wafer comprises a protruding annular rim, a first redistribution structure disposed on the front side of the semiconductor wafer, a second redistribution structure disposed on the rear side of the semiconductor wafer within the protruding annular rim and a plurality of vias extending from the front side to the rear side. A first probe is contacted to the first redistribution structure on the front side and a second probe is contacted to the second redistribution structure on the rear side. The first probe is in contact with the first redistribution structure and the second probe is in contact with the second redistribution structure at the same time.

摘要翻译： 一种用于测试半导体晶片的方法包括提供半导体晶片。 半导体晶片包括突出的环形边缘，设置在半导体晶片的正面上的第一再分配结构，设置在突出环形边缘内的半导体晶片的后侧上的第二再分布结构和从前面延伸的多个通孔 侧到后方 第一探针与前侧上的第一再分布结构接触，并且第二探针与后侧的第二再分配结构接触。 第一探针与第一再分布结构接触，第二探针同时与第二再分布结构接触。