Copper termination inks containing lead free and cadmium free glasses for capacitors
    14.
    发明授权
    Copper termination inks containing lead free and cadmium free glasses for capacitors 有权
    铜终端油墨含有无铅和无镉电容的玻璃

    公开(公告)号:US07339780B2

    公开(公告)日:2008-03-04

    申请号:US11201278

    申请日:2005-08-10

    IPC分类号: H01G4/228

    CPC分类号: H01G4/232 H01G4/2325 H01G4/30

    摘要: A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass component, which may include ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

    摘要翻译: 公开了一种特别适用于导电油墨应用的耐还原性无铅和无镉玻璃组合物。 本发明包括电容器,其包括导电铜端接件。 铜终端是通过焙烧包括玻璃组分的油墨制成的,该玻璃组分可以包括ZnO,只要该量不超过约65摩尔%; B 2 O 3 3,条件是该量不超过约61摩尔%; 和SiO 2,条件是该量不超过约63摩尔%。 B 2 O 3 O 3与SiO 2的摩尔比为约0.05至约3。

    Copper termination inks containing lead free and cadmium free glasses for capacitors
    16.
    发明申请
    Copper termination inks containing lead free and cadmium free glasses for capacitors 有权
    铜终端油墨含有无铅和无镉电容的玻璃

    公开(公告)号:US20060028788A1

    公开(公告)日:2006-02-09

    申请号:US11201278

    申请日:2005-08-10

    IPC分类号: H01G9/00

    CPC分类号: H01G4/232 H01G4/2325 H01G4/30

    摘要: A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a conductive copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

    摘要翻译: 特别适用于导电油墨应用的抗还原性无铅和无镉玻璃组合物。 本发明包括一种包括导电铜端接件的电容器,铜端接件是通过烧制包括玻璃组分的油墨制成的,该玻璃组分可以包含ZnO,只要该量不超过约65摩尔%; B 2 O 3 3,条件是该量不超过约61摩尔%; 和SiO 2,条件是该量不超过约63摩尔%。 B 2 O 3 O 3与SiO 2的摩尔比为约0.05至约3。