公开(公告)号：US09930453B2

公开(公告)日：2018-03-27

申请号：US15119116

申请日：2014-07-15

申请人： GOERTEK INC.

发明人： Quanbo Zou ,  Zhe Wang

IPC分类号： H04R7/14 ,  H04R19/01 ,  B81C1/00 ,  B81B3/00 ,  H04R1/04 ,  H04R19/04

CPC分类号： H04R7/14 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/019 ,  B81C1/0023 ,  B81C2201/115 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15192 ,  H04R1/04 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003 ,  H04R2307/027 ,  H01L2924/00014

摘要： The present invention provides a silicon microphone with a high-aspect-ratio corrugated diaphragm and a microphone package including the same. The microphone comprises the corrugated diaphragm on which at least one ring-shaped corrugation is formed in the vicinity of the edge of the diaphragm which is fixed to the substrate, the corrugated diaphragm is flexible, wherein the ratio of the depth of the corrugation to the thickness of the diaphragm is larger than 5:1, preferably 20:1, and the walls of the corrugation are inclined to the surface of the diaphragm at an angle in the range of 80° to 100°. The microphone with the high-aspect-ratio corrugated diaphragm can achieve a consistent and optimal sensitivity and greatly reduce impact applied thereto in a drop test so that the performances, the reproducibility, the reliability and the yield can be improved. The microphone package of the present invention further provides a simplified processing, an improved sensitivity and an improved SNR.

公开(公告)号：US09866971B2

公开(公告)日：2018-01-09

申请号：US15305089

申请日：2014-08-26

申请人： GOERTEK INC.

发明人： Quanbo Zou ,  Zhe Wang ,  Jifang Tao ,  Guanxun Qiu

IPC分类号： H04R25/00 ,  H04R19/02 ,  H04R7/06 ,  H04R31/00 ,  H04R19/01 ,  B81B7/00 ,  B81C1/00

CPC分类号： H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

摘要： The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.

公开(公告)号：US11128957B2

公开(公告)日：2021-09-21

申请号：US15769798

申请日：2015-10-21

申请人： Goertek Inc.

发明人： Quanbo Zou ,  Zhe Wang ,  Jun Li

IPC分类号： H04R17/00 ,  H04R31/00 ,  H01L41/083 ,  H01L41/29 ,  H04R1/02

摘要： A micro-speaker, the manufacturing method thereof, a speaker device and an electronic apparatus are described herein. The micro-speaker comprises a case, wherein the case has an opening; and a piezoelectric layer, wherein one or more electrodes are provided on the piezoelectric layer, and wherein the piezoelectric layer is pre-buckled in its rest position, wherein the piezoelectric layer covers the opening and is bonded onto the case, to form a speaker rear cavity together with the case. The micro-speaker of the present invention has a relatively low speaker profile.

公开(公告)号：US10937924B2

公开(公告)日：2021-03-02

申请号：US16339482

申请日：2016-10-08

申请人： GOERTEK. INC

发明人： Quanbo Zou ,  Zhe Wang ,  Peixuan Chen ,  Xiangxu Feng

IPC分类号： H01L33/00 ,  H01L33/08 ,  G09F9/33 ,  H01L25/075 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54

摘要： A display device and an electronics apparatus, the display device comprises: a display substrate; and at least two stacked layers on the display substrate, wherein each stacked layer includes one micro-LED array.

公开(公告)号：US20190386454A1

公开(公告)日：2019-12-19

申请号：US16465745

申请日：2016-12-05

申请人： Goertek, Inc.

发明人： Quanbo Zou ,  Zhe Wang

IPC分类号： H01S5/02 ,  H01S5/183 ,  H01S5/042

摘要： A micro laser diode transfer method and a manufacturing method comprise: forming a bonding layer (515) on a receiving substrate (513), wherein first type electrodes (514) are connected to the bonding layer (515); bringing a first side of the micro laser diodes (500r) on a carrier substrate (520) into contact with the bonding layer (515), wherein the carrier substrate (520) is laser-transparent; and irradiating selected micro laser diodes (500r) with laser from the side of the carrier substrate (520) to lift-off the selected micro laser diodes (500r) from the carrier substrate (520). This method may improve yield.

公开(公告)号：US10319697B2

公开(公告)日：2019-06-11

申请号：US15535683

申请日：2015-05-21

申请人： Goertek, Inc.

发明人： Quanbo Zou ,  Zhe Wang

IPC分类号： H01L23/00 ,  H01L33/00 ,  H01L25/075 ,  H01L33/62

摘要： A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED, comprises: forming micro-LEDs (202) on a laser-transparent original substrate (201), providing an anisotropic conductive layer (203) on a receiving substrate (204), bringing the micro-LEDs (202) into contact with the anisotropic conductive layer (203) on the receiving substrate (204), irradiating the original substrate (201) with laser from the original substrate side to lift-off the micro-LEDs (202) from the original substrate (201), and processing the anisotropic conductive layer (203), to electrically connect the micro-LEDs (202) with the pads (205′) on the receiving substrate (204).

公开(公告)号：US10158951B2

公开(公告)日：2018-12-18

申请号：US15307301

申请日：2014-06-27

申请人： GOERTEK INC.

发明人： Zhe Wang

IPC分类号： B81B3/00 ,  H04R19/04 ,  H04R19/00

摘要： A silicon microphone with a suspended diaphragm and a system with the same are provided, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm disposed above the back hole of the silicon substrate and separated from the silicon substrate; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between; and a precisely defined support mechanism, disposed between the diaphragm and the backplate with one end thereof fixed to the edge of the diaphragm and the other end thereof fixed to the backplate, wherein the diaphragm and the backplate are used to form electrode plates of a variable condenser. The microphone with a suspended diaphragm can improve the repeatability and reproducibility in performance and can reduce the diaphragm stress induced by the substrate.

公开(公告)号：US10141287B2

公开(公告)日：2018-11-27

申请号：US15531194

申请日：2015-07-14

申请人： Goertek, Inc.

发明人： Quanbo Zou ,  Zhe Wang

IPC分类号： H01L25/075 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62 ,  H01L33/20

摘要： The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate, wherein the micro-LEDs are lateral micro-LEDs whose P electrodes and N electrodes are located on one side; bringing the P electrodes and N electrodes of the lateral micro-LEDs into contact with pads preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the lateral micro-LEDs from the original substrate. A technical effect of using lateral micro-LEDs lies in that the processing for N metal electrode after the micro-LED transfer can be omitted.

公开(公告)号：US20170330867A1

公开(公告)日：2017-11-16

申请号：US15531194

申请日：2015-07-14

申请人： Goertek, Inc.

发明人： Quanbo Zou ,  Zhe Wang

IPC分类号： H01L25/075 ,  H01L33/52 ,  H01L33/00 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/83192 ,  H01L2933/005 ,  H01L2933/0066

摘要： The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate, wherein the micro-LEDs are lateral micro-LEDs whose P electrodes and N electrodes are located on one side; bringing the P electrodes and N electrodes of the lateral micro-LEDs into contact with pads preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the lateral micro-LEDs from the original substrate. A technical effect of using lateral micro-LEDs lies in that the processing for N metal electrode after the micro-LED transfer can be omitted.

公开(公告)号：US09462389B2

公开(公告)日：2016-10-04

申请号：US14395787

申请日：2013-08-06

申请人： GOERTEK INC.

发明人： Zhe Wang

IPC分类号： H04R7/16 ,  H04R19/00 ,  H04R19/04

CPC分类号： H04R7/16 ,  H04R19/005 ,  H04R19/04 ,  H04R2307/023

摘要： The present invention relates to an anti-impact silicon based MEMS microphone, a system and a package with the same, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm supported on the silicon substrate and disposed above the back hole thereof; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between, and further provided with one or more first thorough holes therein; and a stopper mechanism, including one or more T-shaped stoppers corresponding to the one or more first thorough holes, each of which has a lower part passing through its corresponding first thorough hole and connecting to the diaphragm and an upper part being apart from the perforated backplate and free to vertically move, wherein the diaphragm and the perforated backplate are used to form electrode plates of a variable condenser.

摘要翻译： 本发明涉及一种抗冲击硅基MEMS麦克风，一种系统及其封装，麦克风包括：在其中设置有后孔的硅基板; 支撑在硅衬底上并配置在其后孔上方的柔性膜片; 设置在隔膜上方的穿孔背板，其间夹有气隙，并且还在其中设置有一个或多个第一通孔; 以及止动机构，其包括一个或多个对应于所述一个或多个第一通孔的T形挡块，每个所述一个或多个第一通孔具有穿过其对应的第一通孔并连接到所述隔膜的下部， 穿孔背板并自由垂直移动，其中隔膜和多孔背板用于形成可变冷凝器的电极板。