公开(公告)号：US07291866B2

公开(公告)日：2007-11-06

申请号：US11149461

申请日：2005-06-10

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Takeshi Miyakawa ,  Hatsuo Takezawa

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Takeshi Miyakawa ,  Hatsuo Takezawa

IPC分类号： H01L29/22

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.

摘要翻译： 一种半导体发光器件包括：嵌入树脂; 第一引线，其具有嵌入在嵌入树脂中的第一内部引线部分和从嵌入树脂的一个侧面突出的第一外部引线部分; 第二引线，其具有嵌入在嵌入树脂中的第二内引线部分和从与嵌入树脂的一个侧面相对的侧面突出的第二外引线部分; 半导体发光芯片，安装在所述第一内引线部分的暴露于设置在所述嵌入树脂的上表面上的凹部中的部分上; 以及将半导体发光芯片与第二引线连接的线。 第一和第二内部引线部分以及第一和第二外部引线部分各自具有基本共面的后表面。 第一内引线部分的后表面的至少一部分和第二内引线部分的后表面的至少一部分未被嵌入树脂覆盖，但是露出。

公开(公告)号：US08637892B2

公开(公告)日：2014-01-28

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US08487418B2

公开(公告)日：2013-07-16

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L23/495

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US20110186902A1

公开(公告)日：2011-08-04

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US20080054287A1

公开(公告)日：2008-03-06

申请号：US11765077

申请日：2007-06-19

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Mitsuhiro Nawashiro

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Mitsuhiro Nawashiro

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/46 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.

摘要翻译： 一种半导体发光器件，包括：具有凹部的主体，设置在所述凹部的侧壁上的台阶; 安装在所述凹部中的半导体发光元件; 和树脂层。 树脂层覆盖主体的凹部的内表面的至少一部分。 树脂层的反射率比身体的凹部的内表面高。

公开(公告)号：US06274890B1

公开(公告)日：2001-08-14

申请号：US09006233

申请日：1998-01-13

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Tsuguo Uchino ,  Hiroshi Nagasawa ,  Tadashi Umegi ,  Satoshi Komoto

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Tsuguo Uchino ,  Hiroshi Nagasawa ,  Tadashi Umegi ,  Satoshi Komoto

IPC分类号： H01L3300

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a semiconductor light emitting element (1), a resin stem (10) having a recess (7), and a projection (9) made of a light-transmissive thermosetting resin on the resin stem so as to cover the entire upper surface and continuous upper part of side surfaces of the resin stem to a predetermined depth. The recess is filled with a light-transmissive resin encapsulating element (5) to embed the semiconductor light emitting element, one end of an externally extended first lead (21) and one end of an externally extended second lead (22) electrically connected to first and second electrodes of the semiconductor light emitting element, and a bonding wires (4) connecting the second lead to the second electrode. The projection functions as a lens and is made by hardening a fluid-state resin in an encapsulating case mold. Since the projection extends over the upper surface and upper part of side surfaces continuous from the upper surface, it is firmly bonded to the resin stem with a high adherability.

公开(公告)号：US5386347A

公开(公告)日：1995-01-31

申请号：US271582

申请日：1994-07-07

申请人： Iwao Matsumoto

发明人： Iwao Matsumoto

IPC分类号： F21V8/00 ,  G02B6/00 ,  G09F13/18 ,  F21V5/02

CPC分类号： G02B6/0038 ,  G02B6/0036 ,  G02B6/005 ,  G02B6/0061 ,  G02B6/0065 ,  G09F2013/1813 ,  G09F2013/1831

摘要： An illuminating apparatus has a transparent or semitransparent optical medium in the form of an acrylic plate, two fluorescent tubes for emitting light into the acrylic plate through opposite end surfaces thereof, and a reflecting plate disposed under a lower surface of the acrylic plate for upwardly reflecting the light. The lower surface of the acrylic plate defines a diffusing plane including a plurality of irregular reflector regions distributed thereon. The irregular reflector regions comprise ship-shape patterns arranged in juxtaposition longitudinally of the fluorescent tubes. The diffusing plane further includes modified irregular reflector regions formed where the irregular reflector regions are absent. The modified irregular reflector regions irregularly reflect a less quantity of light than the irregular reflector regions.

摘要翻译： 照明装置具有丙烯酸板形式的透明或半透明光学介质，用于通过其相对端面将光发射到丙烯酸板中的两个荧光管和设置在丙烯酸板下表面下方的反射板，用于向上反射 光。 丙烯酸板的下表面限定了包括分布在其上的多个不规则反射器区域的漫射平面。 不规则反射器区域包括沿着荧光管的纵向并列布置的船形图案。 漫射平面还包括不规则反射器区域形成的改进的不规则反射区域。 改进的不规则反射区域不规则地反射比不规则反射器区域少的光量。

公开(公告)号：US20120138967A1

公开(公告)日：2012-06-07

申请号：US13189654

申请日：2011-07-25

申请人： Satoshi Shimizu ,  Iwao Matsumoto ,  Kazuhiro Tamura ,  Takayuki Yasuzumi

发明人： Satoshi Shimizu ,  Iwao Matsumoto ,  Kazuhiro Tamura ,  Takayuki Yasuzumi

IPC分类号： H01L33/08

CPC分类号： H01L25/167 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package.

摘要翻译： LED封装包括：2n引线框（n为自然数）; n个LED芯片设置在2n引线框架之上，n个LED芯片中的每一个的一个端子连接到n个引线框架中的每一个，n个LED芯片中的每一个的另一个端子连接到每个其他n个引线框架; 连接在所述端子和所述引线框架中的一个之间的导线; 以及覆盖n个LED芯片，导线以及2n个引线框架中的每一个的一部分的树脂体。 2n引线框架中的每一个包括： 具有上表面和侧面的基部，上表面和侧表面被树脂体覆盖; 以及从所述基部延伸的多个延伸部，所述延伸部中的一个具有在所述树脂体的一个侧面露出的末端面，另一个所述延伸部具有在所述树脂体的另一侧面露出的前端面 ，一侧表面和另一侧表面彼此垂直，并且。 树脂体的外形形成LED封装的外形。

公开(公告)号：US08067779B2

公开(公告)日：2011-11-29

申请号：US12652422

申请日：2010-01-05

申请人： Tetsuya Muranaka ,  Masaki Adachi ,  Iwao Matsumoto ,  Kenji Naito ,  Toshiaki Hosoya

发明人： Tetsuya Muranaka ,  Masaki Adachi ,  Iwao Matsumoto ,  Kenji Naito ,  Toshiaki Hosoya

IPC分类号： H01L33/00 ,  H01R9/00

CPC分类号： H01L33/60 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.

摘要翻译： 发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分 所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

公开(公告)号：US07851044B2

公开(公告)日：2010-12-14

申请号：US10885673

申请日：2004-07-08

申请人： Iwao Matsumoto

发明人： Iwao Matsumoto

IPC分类号： B44F1/00

CPC分类号： G09F13/08 ,  G09F13/04 ,  G09F13/06 ,  G09F13/22 ,  G09F19/12 ,  Y10T428/14 ,  Y10T428/24322 ,  Y10T428/24331

摘要： An image display device is provided that can be reduced in size and weight by using an EL and can display a clear image whose color does not change by any of reflected light or transmitted light. The image display device includes an opaque first image layer on a surface of which a first image is formed, the first image layer being made of a sheet-like material and being provided with a plurality of holes, a second image layer that is placed on a back surface of the first image layer and is made of a transparent sheet on which a second image is formed, the second image being visible through the plural holes, and a lighting system for illuminating the second image from a back, the lighting system being placed on a back surface of the second image layer.

摘要翻译： 提供了可以通过使用EL来减小尺寸和重量的图像显示装置，并且可以显示其颜色不被任何反射光或透射光改变的清晰图像。 图像显示装置包括在其表面上形成第一图像的不透明第一图像层，第一图像层由片状材料制成并且设置有多个孔，第二图像层被放置在 第一图像层的后表面，并且由其上形成有第二图像的透明片形成，第二图像通过多个孔可见;以及照明系统，用于从后面照亮第二图像，照明系统是 放置在第二图像层的后表面上。