公开(公告)号：US5046384A

公开(公告)日：1991-09-10

申请号：US475273

申请日：1990-02-05

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: F16H61/06 ,  F16H61/08

CPC classification number: F16H61/061 ,  F16H61/08 ,  Y10T477/69383 ,  Y10T477/69387

Abstract: A shift control system for an automatic power transmission employs an electrically operable timing control valve. The timing control valve is disposed in a second pressure line connected to a second frictional element, which second pressure line is connected to a first pressure line connected to a first frictional element. The timing control valve is designed to be switched between a first position for shutting-off the fluid communication between the first pressure line to the second frictional element and a second position for establishing fluid communication therebetween. The timing control valve is operated by a control signal from an electric or electronic control unit which provides the control signal for the timing control valve for operating the latter with a given lag time from starting of variation of pressure in the first frictional element.

Abstract translation: 用于自动动力传递的变速控制系统采用电动可操作的定时控制阀。 定时控制阀设置在连接到第二摩擦元件的第二压力线中，该第二压力线连接到连接到第一摩擦元件的第一压力线。 定时控制阀设计成在用于关闭第一压力管线与第二摩擦元件之间的流体连通的第一位置和用于在其之间建立流体连通的第二位置之间切换。 定时控制阀由来自电气或电子控制单元的控制信号操作，该控制信号为从第一摩擦元件中的压力变化开始的给定滞后时间为定时控制阀提供控制信号。

公开(公告)号：US4989414A

公开(公告)日：1991-02-05

申请号：US425229

申请日：1989-10-23

Applicant: Akira Murayama ,  Hiroaki Kuno ,  Naoshi Uchikawa ,  Jyoji Okamoto ,  Hiroyuki Imamura

Inventor： Akira Murayama ,  Hiroaki Kuno ,  Naoshi Uchikawa ,  Jyoji Okamoto ,  Hiroyuki Imamura

IPC: F04C28/08 ,  F04C18/02 ,  F04C28/16 ,  F24F11/00 ,  F25B1/00 ,  F25B1/04 ,  F25B13/00 ,  F25B41/04 ,  F25B49/02

CPC classification number: F04C28/16 ,  F04C28/08 ,  F24F11/00 ,  F25B1/04 ,  F25B13/00 ,  F25B41/04 ,  F25B49/025 ,  F04C2240/403 ,  F24F2011/0046 ,  F24F2203/021 ,  F24F2221/54 ,  F24F2221/56 ,  F25B2313/023 ,  F25B2600/021 ,  Y02B30/741

Abstract: An air conditioner provided with a refrigerant circuit formed by connecting with piping a refrigerant compressor, a condenser, an expansion means and an evaporator, an inverter power supply means for controlling the rotational speed of an electric motor for driving the refrigerant compressor, a load detector, and a controller for controlling the inverter power supply means on the basis of an output from the load detector. A refrigerant flow passage controlling mechanism is provided to change the rate at which the refrigerant flows through the condenser on the basis of a control command from the controller, thereby making it possible to reduce or increase the discharge rate without extending the range of changes in the rotational speed of the compressor. The compressor can be controlled according to a wide range of changes in the load to operate with an operation range which ensures high efficiency of the compressor operation.

Abstract translation: 一种设置有制冷剂回路的空气调节器，其通过制冷剂压缩机，冷凝器，膨胀装置和蒸发器与管道连接而形成，用于控制用于驱动制冷剂压缩机的电动机的转速的逆变器电源装置，负载检测器 以及控制器，用于根据来自负载检测器的输出来控制逆变器电源装置。 设置制冷剂流路控制机构，根据来自控制器的控制指令，使制冷剂流过冷凝器的速度变化，从而可以在不扩大排出量的范围的情况下降低或提高排出速度 压缩机的转速。 压缩机可以根据负载变化的大范围进行控制，以保证压缩机运行的高效率的运行范围。

公开(公告)号：US07833910B2

公开(公告)日：2010-11-16

申请号：US12230511

申请日：2008-08-29

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: H01L21/311

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/243 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0574 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract translation: 在薄膜基材（1）和形成在薄膜基材（1）上的导体布线（23）的薄膜基板（FB）中，导体布线（23）布置成使外部的导体布线厚度 连接另一面板或基板的薄膜基板上的连接部分比其他位置的导体布线部分（弯曲部分）（25）的导体布线厚度厚。

公开(公告)号：US20100265665A1

公开(公告)日：2010-10-21

申请号：US12760219

申请日：2010-04-14

Applicant: Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

Inventor： Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

IPC: H05K7/20

CPC classification number: H05K7/20963 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/00

Abstract: The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.

Abstract translation: 电子设备包括：散热器，其包括具有凹部的前表面; 放置在所述凹部中的与所述散热器接触的导热部件; 放置在所述凹部中的与所述导热部件接触的半导体元件; 电连接到半导体元件并放置在散热器的表面上的柔性基板; 以及底板部件，其具有前表面，散热器固定在该前表面上，以便在与前表面相对的后表面与散热器接触。

公开(公告)号：US07758326B2

公开(公告)日：2010-07-20

申请号：US11698865

申请日：2007-01-29

Applicant: Kazuyuki Fujimura ,  Takeshi Tsuchiya ,  Yuichi Yanagase ,  Makoto Aoki ,  Masashi Miyake ,  Mutsunori Matsunaga ,  Satoshi Nakamura ,  Masaru Ohtahara ,  Syuuji Hasegawa ,  Hiroyuki Imamura ,  Yoshinobu Yosuke ,  Kenji Tojo

Inventor： Kazuyuki Fujimura ,  Takeshi Tsuchiya ,  Yuichi Yanagase ,  Makoto Aoki ,  Masashi Miyake ,  Mutsunori Matsunaga ,  Satoshi Nakamura ,  Masaru Ohtahara ,  Syuuji Hasegawa ,  Hiroyuki Imamura ,  Yoshinobu Yosuke ,  Kenji Tojo

IPC: F01C1/02

CPC classification number: F04C27/005 ,  F04C18/0215 ,  F04C23/008

Abstract: A scroll fluid machine comprises compression chambers defined with an orbiting scroll orbiting relative to a fixed scroll, and a back pressure chamber provided on the face opposite from a wrap of the orbiting scroll. A back pressure port is provided, which is formed in an end-plate of the orbiting scroll and connects from a compression chamber side opening opened to a compression chamber side and to a back pressure chamber side opening opened to a back pressure chamber side. The compression chamber side opening is opened and closed by an end-plate of the fixed scroll according as the orbiting motion of the orbiting scroll to perform connection and blockage of the back pressure port. The flow resistance of fluid flowing in and out between the back pressure chamber and the compression chamber is reduced and the compression efficiency and reliability are improved.

Abstract translation: 涡旋流体机器包括压缩室，该压缩室限定有相对于固定涡旋件运动的绕动涡旋件，以及设置在与绕动涡旋件的涡卷相反的面上的背压室。 设置有背压端口，其形成在动涡旋盘的端板中，并且从压缩室侧开口与压缩室侧连接，并且向背压室侧开口侧设置背压室侧开口。 根据绕动涡卷的旋转运动，压缩室侧开口由固定涡旋盘的端板打开和关闭，以执行背压端口的连接和阻塞。 在背压室和压缩室之间流入和流出的流体的流动阻力降低，压缩效率和可靠性得到提高。

公开(公告)号：US20090020318A1

公开(公告)日：2009-01-22

申请号：US12283043

申请日：2008-09-09

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

IPC: H05K1/00

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.

Abstract translation: 提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。 电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起， 导电布线。 辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲 在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。 可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

公开(公告)号：US07439611B2

公开(公告)日：2008-10-21

申请号：US11534288

申请日：2006-09-22

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

IPC: H01L23/495

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.

Abstract translation: 提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。 电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起， 导电布线。 辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲 在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。 可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

公开(公告)号：US07285734B2

公开(公告)日：2007-10-23

申请号：US10833972

申请日：2004-04-27

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani

IPC: H01L23/48

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

Abstract translation: 电路板包括薄膜基板，在薄膜基板上依次布置的多个布线层和分别形成在布线层上的凸起。 每个凸块跨越相应的一个布线层的纵向方向设置，以便在绝缘基板上方的布线层的两侧的区域上延伸，并且沿宽度方向的凸起的横截面形状 布线层的中心部分高​​于中央部分两侧的部分。 因此，形成在布线层上的突起可以抵抗在横向施加的力而实际使用的强度。

公开(公告)号：US4126462A

公开(公告)日：1978-11-21

申请号：US660335

申请日：1976-02-23

Applicant: Takaya Endo ,  Shui Sato ,  Shoji Kikuchi ,  Tamotsu Kozima ,  Tugumoto Usui ,  Hiroyuki Imamura ,  Koichi Takabe

Inventor： Takaya Endo ,  Shui Sato ,  Shoji Kikuchi ,  Tamotsu Kozima ,  Tugumoto Usui ,  Hiroyuki Imamura ,  Koichi Takabe

IPC: C07D231/52 ,  C09B26/02 ,  G03C7/305 ,  G03C7/38 ,  G03C7/00 ,  G03C1/40

CPC classification number: C07D231/52 ,  G03C7/30529 ,  G03C7/38

Abstract: The present invention relates to a process for forming photographic images using a 2-equivalent magenta coupler position a radical of the following general formula:--O--SO.sub.2 --Rwhere R is an aliphatic hydrocarbon, aromatic hydrocarbon or heterocyclic residue.

Abstract translation: 本发明涉及一种使用2-当量品红色成色剂位置形成摄影图像的方法，该基团具有以下通式：

公开(公告)号：US20100293739A1

公开(公告)日：2010-11-25

申请号：US12741889

申请日：2008-10-22

Applicant: Hiroyuki Imamura ,  Shunsuke Kubo

Inventor： Hiroyuki Imamura ,  Shunsuke Kubo

IPC: B08B7/00

CPC classification number: B23Q11/005 ,  B23Q2230/002

Abstract: An objective is to provide an automatic cleaning device for machine tool in which cleaning efficiency is improved by performing cleaning for a large range during machining. To achieve this, an air nozzle (21) that removes, by air-blowing, chips (Wa) and cutting oil (C) dispersed while a workpiece is being machined to an outside of the machine is allowed to move not only independently from a movement of a spindle head (16), but also relatively to a workpiece (W) in directions of three orthogonal axes.

Abstract translation: 目的是提供一种用于机床的自动清洁装置，其中通过在加工期间进行大范围的清洁来提高清洁效率。 为了实现这一点，通过吹送将工件加工到机器外部的分散的切屑（Wa）和切削油（C）除去的空气喷嘴（21）不仅可以独立于 主轴头（16）的移动，而且在三个正交轴线的方向上也相对于工件（W）移动。