Abstract:
A brushless motor is provided with: a tubular stator case; a stator core; a rotor rotatably supported via a bearing inside the stator core; a bracket which closes an opening at one end of the stator case; a coil bobbin around which a coil is wound is mounted on an inner peripheral surface of the stator core; a lead wire which feeds power to the coil; and a wiring substrate which relays a connection between one end of the lead wire and the coil, wherein: a drawn-out hole is formed on the bracket at the position corresponding to the connection point of said one end of the lead wire and the wiring substrate such that the other end of the lead wire is drawn outward; and a harness guide is provided on a peripheral edge of the drawn-out hole such that the drawn lead wire is bent and fixed.
Abstract:
A brushless motor according to the present invention is provided with: a tubular stator case; a stator core fitted into the stator case; and a rotor rotatably supported via a bearing inside the stator core, wherein: an inner flange portion which extends radially inward is formed at a peripheral edge of an opening of one end of the stator case; and a bracket is fixed to the inner flange portion while contacting therewith so as to close the opening.
Abstract:
A card-mounting rack for electronic part-mounting cards is disclosed by which a housing of a rack or the like produced in accordance with standard specifications can be used to mount a plurality of large cards in high density therein to achieve overall densification and miniaturization of a system such as a computer system. Cooling fans are provided on a front and rear faces of a housing of a rack. A mother board is horizontally placed at the center of the inside of the housing. A plurality of cards are mounted perpendicularly on top and bottom faces of the mother board using gondolas and driving mechanisms having a function for moving the cards upwardly or downwardly through a plurality of connector provided on the top and bottom faces of the motherboard. Further, spacers for stabilizing the cards are inserted on rear faces of the cards.
Abstract:
There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.
Abstract:
There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.
Abstract:
A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.
Abstract:
Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage. This allows a faulty circuit to be replaced with the corresponding redundancy circuit.
Abstract:
A power supply circuit design system according to an exemplary aspect of the invention includes: a power supply voltage fluctuation deriving means for deriving a power supply voltage fluctuation characteristic as a voltage fluctuation characteristic in a semiconductor integrated circuit on the basis of design information about a power supply circuit for connecting the semiconductor integrated circuit and other components mounted on a substrate; a determination reference database including a power supply voltage fluctuation condition as a condition for which the power supply voltage fluctuation characteristic is allowed in the power supply circuit, and a change indicator for at least one of a circuit structure and operation of the semiconductor integrated circuit; a power supply voltage fluctuation determination means for comparing the power supply voltage fluctuation characteristic and the power supply voltage fluctuation condition, and determining whether the power supply voltage fluctuation characteristic satisfies the power supply voltage fluctuation condition; and a circuit structure changing means for changing at least one of the structure and the operation of the semiconductor integrated circuit in accordance with the change indicator if the power supply voltage fluctuation characteristic does not satisfy the power supply voltage fluctuation condition, and outputting design information about the changed semiconductor integrated circuit to the power supply voltage fluctuation deriving means; wherein the change indicator does not entail a change in size of the semiconductor integrated circuit.
Abstract:
When soldering is performed, heat transferred from through hole 6b is caused to bypass a mesh-like copper foil region between non-copper-foil regions and thus the transfer of heat to a solid pattern region around thermal land 13b is delayed. Signal wirings 8e, 8f and signal wirings 8g, 8 are formed along the arrangement directions of non-copper-foil regions 15b, 16b respectively keeping a predetermined spacing between them and disposed to overlap copper foil regions, thus ensuring a current return path by means of opposing ground layer 11.
Abstract:
When soldering is performed, heat transferred from through hole 6b is caused to bypass a mesh-like copper foil region between non-copper-foil regions and thus the transfer of heat to a solid pattern region around thermal land 13b is delayed. Signal wirings 8e, 8f and signal wirings 8g, 8 are formed along the arrangement directions of non-copper-foil regions 15b, 16b respectively keeping a predetermined spacing between them and disposed to overlap copper foil regions, thus ensuring a current return path by means of opposing ground layer 11.