摘要:
Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.
摘要:
The present invention provides a light emitting device which comprises a blue light emitting diode, and at least an orthosilicate based phosphor for emitting light ranging from a green to yellow regions and a nitride or oxynitride based phosphor for emitting light in a red region over the light emitting diode. Accordingly, since white light with a continuous spectrum ranging from green to red can be implemented, a light emitting device with improved color rendering can be provided, and the light emitting device can be used for a general illumination or a flash. Further, since the phosphors having stable chemical characteristics against their external environment such as moisture are employed, the stability in optical characteristics of the light emitting device can also be improved.
摘要:
Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.
摘要:
The present invention relates to an LED lamp. In the LED lamp, light may be emitted in lateral and rear directions as well as in a front direction to obtain light distribution characteristics similar to those of an incandescent lamp, and heat generated when the LED emits light may be effectively dissipated.
摘要:
A light emitting module is disclosed. The light emitting module comprises a wafer having first and second surfaces; a light emitting diode chip disposed on the first surface of the wafer; a power supply device for supplying power to the light emitting diode chip; and a photoelectric conversion device for converting sunlight into electricity and providing it to the power supply device, wherein the power supply device is disposed on the second surface of the wafer.
摘要:
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要:
A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.
摘要:
Disclosed herein is a light emitting device. The light emitting device includes a light emitting diode disposed on a substrate to emit light of a first wavelength. A transparent molding part encloses the LED, a lower wavelength conversion material layer is disposed on the transparent molding part, and an upper wavelength conversion material layer is disposed on the lower wavelength conversion material layer. The lower wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a second wavelength longer than the first wavelength, and the upper wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a third wavelength, which is longer than the first wavelength but shorter than the second wavelength. Light produced via wavelength conversion is prevented from being lost by the phosphor. Light emitting devices including a multilayer reflection mirror are also disclosed.
摘要:
A light emitting device capable of emitting light having various color temperatures is disclosed. The light emitting device includes a first light emitting part emitting a daylight color having a color temperature of 6000 K or more, a second light emitting part emitting white light having a color temperature less than 6000 K, and a third light emitting part emitting light in a visible range of 580 nm or more. The second and third light emitting parts are operable independently of the first light emitting part, and realize a warm white color having a color temperature of 3000 K or less with the white light emitted from the second light emitting part and the light emitted from the third light emitting part. The light emitting device realizes white light of various spectra and color temperatures corresponding to desired mood and utility. The light emitting device is controlled to emit light having a suitable wavelength or a suitable color temperature depending on the circadian rhythm of human, thereby enabling improvement of the user's health.
摘要:
Disclosed herein is a light emitting device including: a substrate; a light emitting diode (LED) chip disposed on the substrate; and a phosphor sheet disposed on an upper portion of the LED chip and including alignment members formed on a lower surface thereof. The alignment members contact the LED chip, such that the phosphor sheet is aligned with the LED chip.