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    MOTOR COIL
    11.
    发明申请
    MOTOR COIL 审中-公开

    公开(公告)号：US20190074745A1

    公开(公告)日：2019-03-07

    申请号：US16124246

    申请日：2018-09-07

    Applicant: IBIDEN CO. , LTD.

    Inventor： Haruhiko MORITA ,  Shinobu KATO ,  Hitoshi MIWA ,  Hisashi KATO ,  Toshihiko YOKOMAKU

    IPC: H02K3/26 ,  H02K3/28

    CPC classification number: H02K3/26 ,  H02K3/28 ,  H02K2203/03 ,  H02K2213/03

    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.

    PRINTED WIRING BOARD
    12.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20160374192A1

    公开(公告)日：2016-12-22

    申请号：US15189221

    申请日：2016-06-22

    Applicant: IBIDEN CO., LTD.

    Inventor： Haruhiko MORITA ,  Shinobu KATO

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03

    CPC classification number: H05K1/0251 ,  H05K1/0213 ,  H05K1/0242 ,  H05K1/036 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/096

    Abstract: A printed wiring board includes conductive layers, resin insulation layers, a through-hole conductor penetrating through one or more insulation layers and having a first-surface-side and second-surface-side lands, a first-surface-side signal line formed on one of the insulation layers and connecting the first-surface-side land and a conductive layer on the insulation layer, and a second-surface-side signal line formed on one of the insulation layers and connecting the second-surface-side land and a conductive layer on the insulation layer. The conductive layers include a first-surface-side conductive layer formed over the first-surface-side land such that the first-surface-side conductive layer has a solid pattern having an opening corresponding to the first-surface-side land and formed concentric with the first-surface-side land, and a second-surface-side conductive layer formed over the second-surface-side land such that the second-surface-side conductive layer has a solid pattern having an opening corresponding to the second-surface-side land and formed concentric with the second-surface-side land.

    Abstract translation: 印刷电路板包括导电层，树脂绝缘层，穿透一个或多个绝缘层的通孔导体，并具有第一表面侧和第二表面侧焊盘，第一表面侧信号线形成在 绝缘层之一和绝缘层上的第一表面侧焊盘和导电层之间的一个以及形成在绝缘层之一上并连接第二表面侧焊盘和第二表面侧焊盘的第二表面侧信号线 绝缘层上的导电层。 导电层包括在第一表面侧焊盘上形成的第一表面侧导电层，使得第一表面侧导电层具有与第一表面侧焊盘相对应的开口的固体图案，并且形成为同心 以及形成在所述第二表面侧焊盘上的第二表面侧导电层，使得所述第二表面侧导电层具有具有对应于所述第二表面侧焊盘的第二表面的开口的实心图案 并与第二面侧地面同心。

    PRINTED WIRING BOARD
    13.
    发明申请
    PRINTED WIRING BOARD 审中-公开
    印刷线路板

    公开(公告)号：US20160042861A1

    公开(公告)日：2016-02-11

    申请号：US14820666

    申请日：2015-08-07

    Applicant: IBIDEN CO., LTD.

    Inventor： Yasuhiko MANO ,  Toshihiko ONOGI ,  Kazuhiro YOSHIKAWA ,  Yuki TANAKA ,  Haruhiko MORITA ,  Takashi KARIYA

    IPC: H01F27/28 ,  H01F27/245

    CPC classification number: H01F27/2804 ,  H01F27/245 ,  H01F2027/2809

    Abstract: A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.

    Abstract translation: 印刷布线板包括具有空腔的芯基板，位于基板的空腔中的电感器部件，形成在基板的第一表面上的第一累积层和形成在基板的第二表面上的第二累积层。 电感器部件包括具有第一开口的绝缘层和形成在第一开口之间的第二开口，分别形成在第一开口中的导电通孔，形成在第二开口中的磁体，形成在绝缘体的第一表面上的第一互连 并且连接绝缘层的第一表面上的导电通孔，以及形成在绝缘层的第二表面上并连接绝缘层的第二表面上的导电通孔的第二互连和第一互连，第二互连 并且导电通孔被定位成形成螺旋结构。

    COIL SUBSTRATE AND MOTOR COIL SUBSTRATE
    15.
    发明申请
    COIL SUBSTRATE AND MOTOR COIL SUBSTRATE 有权

    公开(公告)号：US20220069657A1

    公开(公告)日：2022-03-03

    申请号：US17407900

    申请日：2021-08-20

    Applicant: IBIDEN CO., LTD.

    Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

    IPC: H02K3/26

    Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.

    COIL SUBSTRATE AND MOTOR COIL SUBSTRATE
    16.
    发明申请
    COIL SUBSTRATE AND MOTOR COIL SUBSTRATE 有权

    公开(公告)号：US20220060074A1

    公开(公告)日：2022-02-24

    申请号：US17386957

    申请日：2021-07-28

    Applicant: IBIDEN CO., LTD.

    Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

    IPC: H02K3/26

    Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.

    MOTOR COIL SUBSTRATE AND MOTOR
    17.
    发明申请
    MOTOR COIL SUBSTRATE AND MOTOR 审中-公开

    公开(公告)号：US20200287452A1

    公开(公告)日：2020-09-10

    申请号：US16804026

    申请日：2020-02-28

    Applicant: IBIDEN CO., LTD.

    Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

    IPC: H02K23/30 ,  H02K3/26 ,  H02K3/28

    Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.

    PLANAR TRANSFORMER
    19.
    发明申请
    PLANAR TRANSFORMER 审中-公开

    公开(公告)号：US20200075224A1

    公开(公告)日：2020-03-05

    申请号：US16555194

    申请日：2019-08-29

    Applicant: IBIDEN CO., LTD.

    Inventor： Haruhiko MORITA ,  Hitoshi MIWA ,  Shinobu KATO ,  Toshihiko YOKOMAKU ,  Hisashi KATO ,  Takahisa HIRASAWA ,  Tetsuya MURAKI ,  Takayuki FURUNO

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/06

    Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.

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