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公开(公告)号:US12106818B2
公开(公告)日:2024-10-01
申请号:US17133484
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Aiswarya M. Pious , Raji James , Phani K. Alaparthi , George Vergis , Bill Nale , Konika Ganguly
IPC: G11C5/14 , G06F1/3225 , G06F1/3228 , G06F1/3234 , G06F1/3296 , G11C11/4074
CPC classification number: G11C5/148 , G06F1/3225 , G06F1/3228 , G06F1/3243 , G06F1/3296 , G11C5/141 , G11C5/147 , G11C11/4074 , G11C2207/2227
Abstract: Examples described herein relate to a device that includes: a first power rail to provide a signal from a power source to a reference supply voltage pin of a memory controller; a second power rail to provide a signal from the power source to an output buffer pin of the memory controller and to an output buffer pin of a central processing unit (CPU). In some examples, the second power rail is separate from the first power rail, during a high power state, the power source is to supply a same voltage to each of the reference supply voltage pin, the output buffer pin of the memory controller, and the output buffer pin of the CPU, and during a connected standby state, the power source is to reduce voltage provided to the output buffer pin of the memory controller and the output buffer pin of the CPU using the second power rail and maintain a voltage provided to the reference supply voltage pin.
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公开(公告)号:US11699471B2
公开(公告)日:2023-07-11
申请号:US17030107
申请日:2020-09-23
Applicant: Intel Corporation
Inventor: Duane E. Galbi , Bill Nale
CPC classification number: G11C7/222 , G06F13/1684 , G06F13/287 , G11C7/1012 , G11C8/18
Abstract: An apparatus is described. The apparatus includes logic circuitry to multiplex on a data bus a first data burst, a second data burst, a third data burst and a fourth data burst having different respective base target addresses that respectively target a first memory rank, a second memory rank, a third memory rank and a fourth memory rank. A first data transfer for the first data burst occurs on a first edge of a first pulse of a data strobe signal for the data bus and a second data transfer for the second data burst occurs on a second edge of the first pulse of the data strobe signal. A third data transfer for the third data burst occurs on a first edge of a second pulse of the data strobe signal for the data bus and a fourth data transfer for the fourth data burst occurs on a second edge of the second pulse. The second pulse immediately follows the first pulse on the data strobe signal. The first memory rank, the second memory rank, the third memory rank and the fourth memory rank are on a same memory module.
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公开(公告)号:US11688452B2
公开(公告)日:2023-06-27
申请号:US17686287
申请日:2022-03-03
Applicant: Intel Corporation
Inventor: Bill Nale , Christopher E. Cox
IPC: G11C11/406 , G11C11/4096 , G06F3/06
CPC classification number: G11C11/40611 , G06F3/0619 , G06F3/0659 , G06F3/0673 , G11C11/4096 , G11C11/40618
Abstract: A memory device with internal row hammer mitigation couples to a memory controller. The memory controller or host can assist with row hammer mitigation by sending additional refresh cycles or refresh commands. In response to an extra refresh command the memory device can perform refresh for row hammer mitigation instead of refresh for standard data integrity. The memory controller can keep track of the number of activate commands sent to the memory device, and in response to a threshold number of activate commands, the memory controller sends the additional refresh command. With the extra refresh command the memory device can refresh the potential victim rows of a potential aggressor row, instead of simply refreshing a row that has not been accessed for a period of time.
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公开(公告)号:US11335395B2
公开(公告)日:2022-05-17
申请号:US17062420
申请日:2020-10-02
Applicant: Intel Corporation
Inventor: Christopher E. Cox , Kuljit S. Bains , Christopher P. Mozak , James A. McCall , Akshith Vasanth , Bill Nale
IPC: G11C11/4072 , G11C11/4096 , G11C11/4076 , G11C11/4093 , G11C11/4074 , G11C11/406
Abstract: A memory subsystem triggers entry and exit of a memory device from low power mode with a chip select (CS) signal line. For a system where the command bus has no clock enable (CKE) signal line, the system can trigger low power modes with CS instead of CKE. The low power mode can include a powerdown state. The low power mode can include a self-refresh state. The memory device includes an interface to the command bus, and receives a CS signal combined with command encoding on the command bus to trigger a low power mode state change. The memory device can be configured to monitor the CS signal and selected other command signals while in low power mode. The system can send an ODT trigger while the memory device is in low power mode, even without a dedicated ODT signal line.
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公开(公告)号:US11282561B2
公开(公告)日:2022-03-22
申请号:US17157826
申请日:2021-01-25
Applicant: Intel Corporation
Inventor: Bill Nale , Christopher E. Cox
IPC: G11C11/406 , G11C11/4096 , G06F3/06
Abstract: A memory device with internal row hammer mitigation couples to a memory controller. The memory controller or host can assist with row hammer mitigation by sending additional refresh cycles or refresh commands. In response to an extra refresh command the memory device can perform refresh for row hammer mitigation instead of refresh for standard data integrity. The memory controller can keep track of the number of activate commands sent to the memory device, and in response to a threshold number of activate commands, the memory controller sends the additional refresh command. With the extra refresh command the memory device can refresh the potential victim rows of a potential aggressor row, instead of simply refreshing a row that has not been accessed for a period of time.
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公开(公告)号:US10691626B2
公开(公告)日:2020-06-23
申请号:US16405524
申请日:2019-05-07
Applicant: Intel Corporation
Inventor: Bill Nale , Raj K. Ramanujan , Muthukumar P. Swaminathan , Tessil Thomas , Taarinya Polepeddi
IPC: G06F13/16 , G06F13/40 , G06F13/42 , G06F12/0804 , G06F9/46 , G06F12/0868 , G06F11/10 , G06F12/02 , G06F12/0802 , G06F12/0897 , G06F12/0811
Abstract: A semiconductor chip comprising memory controller circuitry having interface circuitry to couple to a memory channel. The memory controller includes first logic circuitry to implement a first memory channel protocol on the memory channel. The first memory channel protocol is specific to a first volatile system memory technology. The interface also includes second logic circuitry to implement a second memory channel protocol on the memory channel. The second memory channel protocol is specific to a second non volatile system memory technology. The second memory channel protocol is a transactional protocol.
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公开(公告)号:US20200185052A1
公开(公告)日:2020-06-11
申请号:US16795119
申请日:2020-02-19
Applicant: Intel Corporation
Inventor: Bill Nale , Kuljit Bains , Wei Chen , Rajat Agarwal
IPC: G11C29/00 , G11C29/44 , G11C11/406 , G11C7/10
Abstract: An embodiment of an electronic memory apparatus may include storage media, and logic communicatively coupled to the storage media, the logic to determine if a mode is set to one of a first mode or a second mode, perform a soft post package repair in the first mode, and undo the soft post package repair in the second mode. Other embodiments are disclosed and claimed.
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18.
公开(公告)号:US10310547B2
公开(公告)日:2019-06-04
申请号:US15266991
申请日:2016-09-15
Applicant: Intel Corporation
Inventor: George Vergis , Kuljit S. Bains , Bill Nale
Abstract: Techniques to include a mirror of a command/address at a memory device. Techniques to also include interpretation of command/address logic. A memory device located on a dual in-line memory module (DIMM) includes circuitry having logic capable of receiving a command/address signal and mirror a command/address or interpret command/address logic indicated in the command/address signal based on one or more strap pins for the memory device.
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公开(公告)号:US20190102325A1
公开(公告)日:2019-04-04
申请号:US15720659
申请日:2017-09-29
Applicant: Intel Corporation
Inventor: Mahesh S. Natu , Murugasamy K. Nachimuthu , Bill Nale
IPC: G06F12/14 , G06F12/084
Abstract: Systems, apparatuses and methods may provide for technology that conducts a comparison between an identified capability of a memory device and memory usage rules associated with a processor. The memory usage rules are to identify allowed memory accesses by the processor. The technology further limits access by the processor to the memory device based upon the comparison.
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公开(公告)号:US10241943B2
公开(公告)日:2019-03-26
申请号:US15857992
申请日:2017-12-29
Applicant: Intel Corporation
Inventor: Bill Nale , Raj K. Ramanujan , Muthukumar P. Swaminathan , Tessil Thomas , Taarinya Polepeddi
IPC: G06F13/16 , G06F13/42 , G06F12/0868 , G06F11/10 , G06F12/0802 , G06F12/0804 , G06F12/0897 , G06F9/46 , G06F13/40 , G06F12/02 , G06F12/0811
Abstract: A semiconductor chip comprising memory controller circuitry having interface circuitry to couple to a memory channel. The memory controller includes first logic circuitry to implement a first memory channel protocol on the memory channel. The first memory channel protocol is specific to a first volatile system memory technology. The interface also includes second logic circuitry to implement a second memory channel protocol on the memory channel. The second memory channel protocol is specific to a second non volatile system memory technology. The second memory channel protocol is a transactional protocol
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