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    ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD FOR A PRINTED CIRCUIT BOARD (PCB)
    12.
    发明申请
    ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD FOR A PRINTED CIRCUIT BOARD (PCB) 审中-公开

    公开(公告)号：US20190037683A1

    公开(公告)日：2019-01-31

    申请号：US15660481

    申请日：2017-07-26

    Applicant: Intel Corporation

    Inventor： Dong-Ho Han ,  Timothy Swettlen

    IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  G06F1/16

    Abstract: Embodiments herein disclose techniques for electronic apparatuses including a printed circuit board (PCB) and an electromagnetic interference (EMI) shield for the PCB. An electronic apparatus may include a PCB with a plurality of layers including a ground layer. The PCB may include a cutout through the plurality of layers of the PCB. An EMI shield may be mounted to a bottom side of the PCB along an edge of the cutout, where the EMI shield may be coupled to the ground layer through an ohmic contact. The EMI shield may be flat. Other embodiments may also be described and claimed.

    Embedded bridge substrate having an integral device
    16.
    发明授权
    Embedded bridge substrate having an integral device 有权

    公开(公告)号：US11133256B2

    公开(公告)日：2021-09-28

    申请号：US16446920

    申请日：2019-06-20

    Applicant: Intel Corporation

    Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Chin Lee Kuan ,  Kevin Joseph Doran ,  Dong-Ho Han

    IPC: H01L23/538 ,  H01L49/02 ,  H01L23/00

    Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

    Radiation shield around a component on a substrate
    17.
    发明授权
    Radiation shield around a component on a substrate 有权

    公开(公告)号：US11081450B2

    公开(公告)日：2021-08-03

    申请号：US16585052

    申请日：2019-09-27

    Applicant: Intel Corporation

    Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

    IPC: H01L23/552 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

    Package-level noise filtering for EMI RFI mitigation
    18.
    发明授权
    Package-level noise filtering for EMI RFI mitigation 有权

    公开(公告)号：US10991665B2

    公开(公告)日：2021-04-27

    申请号：US16326084

    申请日：2016-09-29

    Applicant: Intel Corporation

    Inventor： Hao-Han Hsu ,  Dong-Ho Han ,  Steven C. Wachtman ,  Ryan K. Kuhlmann

    IPC: H01L23/64 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552 ,  H01P1/20

    Abstract: A semiconductor package and a packaged electronic device are described. The semiconductor package has a foundation layer and a planar filtering circuit. The circuit is formed in the foundation layer to provide EMI/RFI mitigation. The circuit has one or more conductive traces that are patterned to form an equivalent circuit of inductors and capacitors. The one or more conductive traces include planar metal shapes, such as meanders, loops, inter-digital fingers, and patterned shapes, to reduce the z-height of the package. The packaged electronic device has a semiconductor die, a foundation layer, a motherboard, a package, and the circuit. The circuit removes undesirable interferences generated from the semiconductor die. The circuit has a z-height that is less than a z-height of solder balls used to attach the foundation layer to the motherboard. A method of forming a planar filtering circuit in a foundation layer is also described.

    RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE
    19.
    发明申请
    RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE 审中-公开

    公开(公告)号：US20200027844A1

    公开(公告)日：2020-01-23

    申请号：US16585052

    申请日：2019-09-27

    Applicant: Intel Corporation

    Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

    IPC: H01L23/552 ,  H01L23/498 ,  H01L23/367 ,  H01L21/48

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

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