公开(公告)号：US10763216B2

公开(公告)日：2020-09-01

申请号：US16677533

申请日：2019-11-07

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US10734236B2

公开(公告)日：2020-08-04

申请号：US16399703

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Sasha N. Oster ,  Fay Hua ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01L21/4763 ,  H01L21/285 ,  H01L21/768 ,  H01L21/033 ,  B82Y40/00 ,  H01L23/66 ,  H01L25/16 ,  H05K1/16 ,  H05K3/28 ,  H01L23/538 ,  H01L21/48 ,  H05K1/02 ,  H05K3/34

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US10651525B2

公开(公告)日：2020-05-12

申请号：US15997644

申请日：2018-06-04

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Mathew Manusharow ,  Krishna Bharath ,  Zhichao Zhang ,  Yidnekachew S. Mekonnen ,  Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Javier Soto

IPC: H01P3/06 ,  H01P3/02 ,  H05K1/02 ,  H01P3/08

Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

公开(公告)号：US20200021330A1

公开(公告)日：2020-01-16

申请号：US16483019

申请日：2017-03-01

Applicant: Intel Corporation

Inventor： Yidnekachew S. Mekonnen ,  Kemal Aygun ,  Henning Braunisch

IPC: H04B3/32 ,  H04L25/08 ,  H04B3/487

Abstract: Technology for simplified multimode signaling includes determining first and second self α-terms, cross coupling α-terms, and a delay skew term. For each communication link bundled in groups, the signals can be modulated as a superposition of the signals delayed and weighted based on the first and second self α-terms, the cross coupling α-terms and the delay skew term.

公开(公告)号：US10510669B2

公开(公告)日：2019-12-17

申请号：US15876080

申请日：2018-01-19

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US20190252321A1

公开(公告)日：2019-08-15

申请号：US16335029

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Kemal Aygun ,  Yidnekachew S. Mekonnen

IPC: H01L23/538 ,  H01L23/66 ,  H01L25/065

CPC classification number: H01L23/5381 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/66 ,  H01L25/065 ,  H01L25/18 ,  H01L2224/16235 ,  H01L2924/15192

Abstract: Disclosed is a signaling system. The signaling system may comprise a transmitter, a receiver, and a package interconnect. The transmitter may be configured to transmit M signals. The receiver may be configured to receive the M signals. The package interconnect may include a bundle of N wires electrically connecting the transmitter and the receiver. During operation, the N wires may be electromagnetically coupled with each other and the M signals may travel between the transmitter and the receiver on the bundle of N wires.

公开(公告)号：US20190149243A1

公开(公告)日：2019-05-16

申请号：US16224008

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Hyung-Jin Lee ,  Cho-ying Lu ,  Henning Braunisch ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Richard Dischler

IPC: H04B10/516 ,  H04B10/61 ,  H04B10/2575

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, where the transceiver is configured to receive a data stream, convert the data stream to a quadrature amplitude modulation (QAM) mapping/shaping signal, where the QAM mapping/shaping signal is a frequency component of the data stream, convert the QAM mapping/shaping signal to a Hilbert transform signal, where the Hilbert transform signal includes a reverse order of an in-phase component of the QAM mapping/shaping signal and a reverse order of a quadrature component of the QAM mapping/shaping signal, convert the Hilbert transform signal to a QAM mapping/shaping signal, where the QAM mapping/shaping signal is a single sideband (SSB) time domain mm wave signal, where the SSB time domain mm wave signal is the Hilbert transform signal converted to a time domain signal, and communicate the SSB time domain mm wave signal over a waveguide using a waveguide interconnect.

公开(公告)号：US20190115951A1

公开(公告)日：2019-04-18

申请号：US16206919

申请日：2018-11-30

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Jeff C. Morriss ,  Hyung-Jin Lee ,  Richard Dischler ,  Ajay Balankutty ,  Telesphor Kamgaing ,  Said Rami

IPC: H04B3/52 ,  H04L27/36

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.

公开(公告)号：US20190081705A1

公开(公告)日：2019-03-14

申请号：US16179215

申请日：2018-11-02

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H04B10/2581 ,  G02B6/43 ,  H04B10/50

Abstract: There is disclosed in one example a communication apparatus, including: a local data interface; a data encoder to encode a transmission into n millimeter to terahertz-band transmission components, wherein n≥2, each transmission component having an independent mode of each other transmission component; and a plurality of n launchers to launch the transmission components onto n closely-bundled waveguides, wherein the closely-bundled waveguides are not shielded from one another.

公开(公告)号：US10186465B2

公开(公告)日：2019-01-22

申请号：US15748138

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Feras Eid ,  Adel A. Elsherbini ,  Henning Braunisch ,  Yidnekachew S. Mekonnen ,  Krishna Bharath ,  Mathew J. Manusharow ,  Aleksandar Aleksov ,  Nathan Fritz

IPC: H01L23/14 ,  H01L23/12 ,  H01L23/473 ,  H01L21/48 ,  H01L23/538 ,  H01L23/492

Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.