公开(公告)号：US20180307275A1

公开(公告)日：2018-10-25

申请号：US15770984

申请日：2015-11-24

Applicant: Nithyananda Siva JEGANATHAN ,  Daria A. LOI ,  James W. EDWARDS ,  Nicholas W. OAKLEY ,  Don J. NGUYEN ,  Brian R. PEIL ,  Aleksander MAGI ,  Russell S. AOKI ,  Meenakshi GUPTA ,  Intel Corporation

Inventor： Brian R. Peil ,  Russell S. Aoki ,  Aleksander Magi ,  James W. Edwards ,  Don J. Nguyen ,  Nicholas W. Oakley ,  Daria A. Loi ,  Meenakshi Gupta ,  Nithyananda S. Jeganathan

IPC: G06F1/16 ,  H02J50/80 ,  H02J7/00 ,  H02J7/02

Abstract: Particular embodiments described herein provide for an electronic system that includes a docking station configured to wirelessly couple to an electronic device and a wireless charging element removably coupled to the docking station. The wireless charging element includes a power receiving unit and is configured to wireless charge the electronic device. In an example, the docking station is configured for high speed input/output.

公开(公告)号：US20180210506A1

公开(公告)日：2018-07-26

申请号：US15689404

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC: G06F1/16

CPC classification number: G06F1/1654 ,  G06F1/1643 ,  G06F1/166 ,  G06F1/1683

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US20170181271A1

公开(公告)日：2017-06-22

申请号：US14975941

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Rashelle Yee ,  Russell S. Aoki ,  Shelby Ferguson ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Kevin J. Ceurter

IPC: H05K1/02 ,  H01L23/498 ,  G06F1/16 ,  B23K1/00 ,  B23K31/02 ,  H05K1/14 ,  H05B1/02

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05B1/0233 ,  H05K1/0212 ,  H05K1/141 ,  H05K2201/041 ,  H05K2201/10378

Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

公开(公告)号：US09300365B1

公开(公告)日：2016-03-29

申请号：US14577428

申请日：2014-12-19

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  John Trevor Morrison ,  Gerald Rene Pelissier

IPC: H04B5/00 ,  H04B10/25

CPC classification number: H04B5/0031 ,  H04B10/25 ,  H04B10/801

Abstract: A computing device includes a head that can be physically attached to a base. The head is capable of functioning independent of the base. The base includes a base transceiver to receive data from a first component of the base, encode the data into a signal, and transmit the signal. The base includes a base waveguide to guide the signal to a head waveguide of the head. The base waveguide includes a first portion that is attached to the base and a second portion that is unattached to the base. The second portion of the base waveguide behaves as a spring to keep the base waveguide within a predetermined distance from the head waveguide. The head includes a head transceiver to receive the signal from the head waveguide, decode the data from the signal, and send the data to a second component of the head.

Abstract translation: 计算设备包括可以物理地附接到基座的头部。 头部能够独立于基座的功能。 基座包括从基座的第一部件接收数据的基本收发器，将数据编码成信号，并发送信号。 底座包括用于将信号引导到头部的头波导的基波导。 基波导包括附接到基座的第一部分和未连接到基座的第二部分。 基波导的第二部分表现为弹簧，以将基波导保持在离波导头的预定距离内。 头部包括用于接收来自头部波导的信号的头部收发器，对来自信号的数据进行解码，并将数据发送到头部的第二部件。

公开(公告)号：US20210120668A1

公开(公告)日：2021-04-22

申请号：US17111424

申请日：2020-12-03

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Jeffory L. Smalley ,  Jonathan W. Thibado

IPC: H05K1/02 ,  G06F1/20 ,  H01L23/498 ,  H01L23/00 ,  H05K1/18 ,  H05K3/34 ,  G06F1/16

Abstract: An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

公开(公告)号：US10541494B2

公开(公告)日：2020-01-21

申请号：US16078613

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Donald T. Tran ,  Thomas A. Boyd ,  Yong Wang ,  Kevin J. Ceurter ,  Srikant Nekkanty ,  Russell S. Aoki ,  FeiFei Cheng

IPC: H01R13/639 ,  H01L23/32 ,  H01R12/71 ,  H01R13/627 ,  H01R13/629 ,  H01R25/00 ,  H01L23/367

Abstract: Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

公开(公告)号：US10481643B2

公开(公告)日：2019-11-19

申请号：US15689404

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC: G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US10211120B2

公开(公告)日：2019-02-19

申请号：US14998123

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Jonathan W. Thibado ,  Jeffory L. Smalley ,  David J. Llapitan ,  Thomas A. Boyd ,  Harvey R. Kofstad ,  Dimitrios Ziakas ,  Hongfei Yan

IPC: H01L23/34 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

公开(公告)号：US20180254237A1

公开(公告)日：2018-09-06

申请号：US15448120

申请日：2017-03-02

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Russell S. Aoki

IPC: H01L23/427 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/30 ,  H01L23/32

CPC classification number: H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/32 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/22 ,  H05K3/303 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10378

Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.

公开(公告)号：US20170187134A1

公开(公告)日：2017-06-29

申请号：US14757915

申请日：2015-12-24

Applicant: INTEL CORPORATION

Inventor： Thomas A. Boyd ,  Jeffory L. Smalley ,  Russell S. Aoki ,  Karumbu Meyyappan

IPC: H01R12/72 ,  H01R43/26 ,  H01R13/635 ,  H01R13/648 ,  H01R12/70 ,  H01R13/631

CPC classification number: H01R12/721 ,  H01R12/7005 ,  H01R12/774 ,  H01R13/508 ,  H01R13/631 ,  H01R13/635 ,  H01R13/6485 ,  H01R43/26

Abstract: An example apparatus for connecting linear edge cards includes a housing to hold at least one set of conductive contacts facing perpendicularly towards a mating plane. The apparatus further includes an activator bar coupled to the housing, the activator bar to hold two parts of the housing apart via two opposing normal forces. The apparatus also includes a contact load spring coupled to the housing, the contact load spring to apply two forces parallel to the direction of the conductive contacts and against the two opposing normal forces of the activator bar. The apparatus further includes an ejector spring coupled to the contact load spring and the activator bar. The ejector spring is to apply a force perpendicular to the two opposing normal forces of the activator bar and in a direction of an opening of the housing.