公开(公告)号：US08964391B2

公开(公告)日：2015-02-24

申请号：US13788919

申请日：2013-03-07

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  F28D15/00 ,  F28F27/00 ,  F28F9/00 ,  B23P15/26

CPC classification number: B23P15/26 ,  F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/06 ,  H05K7/20809 ,  Y10T29/4935

Abstract: Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract translation: 提供冷却方法以便于电子部件的抽吸浸没冷却。 冷却方法包括：提供围绕一个或多个部件形成隔室的壳体，以及提供供应歧管，回流歧管以及联接冷却剂回路联接器以使供应和返回歧管与壳体流体连通。 流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来冷却部件。 泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。 回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。 冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

公开(公告)号：US08947873B2

公开(公告)日：2015-02-03

申请号：US13684712

申请日：2012-11-26

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K5/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20236 ,  G06F1/20 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/2079 ,  H05K7/20809

Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract translation: 提供了一种冷却的电子系统和冷却方法，其中具有安装到板上的多个电子部件的电子板通过包括浸没冷却电子部件部分和传导冷却电子部件部分的设备来冷却。 浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。 多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。 传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地经由从至少一个 电子元件

公开(公告)号：US08929080B2

公开(公告)日：2015-01-06

申请号：US13788987

申请日：2013-03-07

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20 ,  H05K7/20236 ,  H05K7/20772 ,  Y10T29/49117

Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract translation: 提供了一种用于对诸如多节点机架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却的方法。 该方法包括提供围绕待冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。

公开(公告)号：US20140131008A1

公开(公告)日：2014-05-15

申请号：US13782020

申请日：2013-03-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. Chu ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS ,  Daniel E. ZAMBRANO

IPC: F28D15/00

CPC classification number: F28D15/00 ,  F28F9/00 ,  H05K7/2079 ,  H05K7/20827

Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract translation: 提供了一种方法，其包括提供用于电子机架的冷却装置，其包括构造成耦合到电子机架的空气入口侧的门组件。 门组件包括：一个或多个气流开口，便于气流通过门组件并进入电子机架; 一个或多个空气冷却剂热交换器被设置成使得通过气流开口的气流穿过热交换器，该热交换器被配置为从穿过其的气流中提取热量; 以及一个或多个气流再分布器，其布置在气流通过热交换器的下游并且至少部分对准的气流开口的方向上。 气流再分布器有助于通过空气 - 液体热交换器的气流再次分布到电子机架的空气入口侧的所需气流图案，例如穿过空气入口侧的均匀气流分布 的架子。

公开(公告)号：US08713957B2

公开(公告)日：2014-05-06

申请号：US13692215

申请日：2012-12-03

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F25D23/12

CPC classification number: F25B21/02 ,  F25B2400/17 ,  H01L23/38 ,  H01L23/427 ,  H01L35/30 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.

Abstract translation: 提供冷却方法用于浸入冷却一个或多个电子部件。 冷却方法包括：提供壳体，其至少部分围绕电子部件周围并形成流体密封的隔室，以及设置在流体密封隔室内的介电流体，其中电子部件浸入介电流体 ; 并提供蒸气冷凝器，散热器和导热路径。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且散热器包括第一区域和第二区域，散热片的第一区域与蒸气冷凝器热接触 。 热传导路径以热接触方式将流体密封室和散热器的第二区域耦合，并且包括热电阵列，其有助于将热量从流体密封隔室传导到散热器的第二区域，通过热 传导路径。

公开(公告)号：US10595447B2

公开(公告)日：2020-03-17

申请号：US16005823

申请日：2018-06-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: G05D23/00 ,  H05K7/20 ,  G05D23/19 ,  G05B15/02

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

公开(公告)号：US09750159B2

公开(公告)日：2017-08-29

申请号：US14826421

申请日：2015-08-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K3/36 ,  H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20318 ,  B23P15/26 ,  B23P2700/10 ,  H05K7/203 ,  H05K7/20781 ,  H05K7/2079 ,  Y10T29/49361

Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

公开(公告)号：US09439325B2

公开(公告)日：2016-09-06

申请号：US14058562

申请日：2013-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

公开(公告)号：US09414525B2

公开(公告)日：2016-08-09

申请号：US14827588

申请日：2015-08-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。 该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面 电子组件。 冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过 冷气携带舱。 减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。

公开(公告)号：US09414519B2

公开(公告)日：2016-08-09

申请号：US14063141

申请日：2013-10-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: H05K7/20 ,  F28D1/047 ,  F28F1/12 ,  F28F1/32 ,  F28F17/00 ,  F28D1/053 ,  F28D21/00

CPC classification number: H05K7/202 ,  F28D1/0471 ,  F28D1/0475 ,  F28D1/05366 ,  F28D2021/0038 ,  F28F1/126 ,  F28F1/32 ,  F28F17/005 ,  H05K7/20218 ,  H05K7/20318 ,  H05K7/20572 ,  H05K7/20609 ,  H05K7/20627 ,  H05K7/20645 ,  H05K7/20736 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.