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    Multiple Input and Multiple Output Switch Networks
    13.
    发明申请
    Multiple Input and Multiple Output Switch Networks 有权
    多输入和多输出交换网络

    公开(公告)号：US20160359504A1

    公开(公告)日：2016-12-08

    申请号：US15241736

    申请日：2016-08-19

    Applicant: Infineon Technologies AG

    Inventor： Daniel Kehrer

    IPC: H04B1/00 ,  H04B7/04 ,  H04B1/10

    CPC classification number: H04B1/006 ,  H04B1/1027 ,  H04B7/0452

    Abstract: According to an embodiment, a circuit package includes a programmable switch component having a plurality of input terminals arranged on the programmable switch component, a plurality of output terminals arranged on the programmable switch component and configured to be coupled to a plurality of amplifiers, and a plurality of switches. Each switch of the plurality of switches is coupled between an input terminal of the plurality of input terminals and an output terminal of the plurality of output terminals. Each switch of the plurality of switches includes a radio frequency (RF) switch and is configured to pass an RF signal when closed. Each input terminal of the plurality of input terminals is coupled to two switches of the plurality of switches.

    Abstract translation: 根据实施例，电路封装包括具有布置在可编程开关组件上的多个输入端的可编程开关组件，布置在可编程开关组件上并被配置为耦合到多个放大器的多个输出端子，以及 多个开关。 多个开关的每个开关耦合在多个输入端子的输入端子和多个输出端子的输出端子之间。 多个开关的每个开关包括射频（RF）开关，并且被配置为在关闭时传递RF信号。 多个输入端子的每个输入端子耦合到多个开关的两个开关。

    System and method for a low noise amplifier module
    14.
    发明授权
    System and method for a low noise amplifier module 有权
    低噪声放大器模块的系统和方法

    公开(公告)号：US09337775B1

    公开(公告)日：2016-05-10

    申请号：US14561789

    申请日：2014-12-05

    Applicant: Infineon Technologies AG

    Inventor： Nikolay Ilkov ,  Paulo Oliveira ,  Daniel Kehrer

    IPC: H03F3/181 ,  H03F1/02 ,  H03F3/19

    CPC classification number: H03F3/19 ,  H03F1/0261 ,  H03F3/191 ,  H03F2200/111 ,  H03F2200/249 ,  H03F2200/294 ,  H03F2200/39 ,  H03F2200/451 ,  H04B1/10

    Abstract: In accordance with an embodiment, a circuit includes a low noise amplifier transistor disposed on a first integrated circuit, a single pole multi throw (SPMT) switch disposed on a second integrated circuit, and a bypass switch coupled between a control node of the low noise amplifier transistor and an output node of the low noise amplifier transistor. The SPMT switch couples a plurality of module input terminals to a control node of the low noise amplifier transistor, and the bypass switch including a first switch coupled between the control node of the low noise amplifier transistor and an intermediate node, a second switch coupled between the intermediate node and the output node of the low noise amplifier transistor, and a third switch coupled between the intermediate node and a first reference node. The first integrated circuit and the second integrated circuit are disposed on a substrate.

    Abstract translation: 根据实施例，电路包括设置在第一集成电路上的低噪声放大器晶体管，设置在第二集成电路上的单极多掷（SPMT）开关，以及耦合在低噪声控制节点之间的旁路开关 放大器晶体管和低噪声放大器晶体管的输出节点。 SPMT开关将多个模块输入端子耦合到低噪声放大器晶体管的控制节点，并且旁路开关包括耦合在低噪声放大器晶体管的控制节点和中间节点之间的第一开关，第二开关耦合在 低噪声放大器晶体管的中间节点和输出节点，以及耦合在中间节点和第一参考节点之间的第三开关。 第一集成电路和第二集成电路设置在基板上。

    System and Method for a Low Noise Amplifier
    15.
    发明申请
    System and Method for a Low Noise Amplifier 有权
    低噪声放大器的系统和方法

    公开(公告)号：US20160056774A1

    公开(公告)日：2016-02-25

    申请号：US14462793

    申请日：2014-08-19

    Applicant: Infineon Technologies AG

    Inventor： Nikolay Ilkov ,  Paulo Oliveira ,  Winfried Bakalski ,  Daniel Kehrer

    IPC: H03F1/56 ,  H03F3/19

    CPC classification number: H03F1/565 ,  H03F1/0205 ,  H03F3/19 ,  H03F2200/213 ,  H03F2200/222 ,  H03F2200/252 ,  H03F2200/294 ,  H03F2200/421 ,  H03F2200/451

    Abstract: In accordance with an embodiment, a circuit includes a first signal path coupled between an input port and an output port, and a second coupled between the input port and the output port in parallel with the first signal path. The first signal path includes a low noise amplifier (LNA) having an input node coupled to the input port, and the second signal path includes a switch coupled between the input port and the output port.

    Abstract translation: 根据实施例，电路包括耦合在输入端口和输出端口之间的第一信号路径，以及耦合在输入端口和输出端口之间并与第一信号路径连接的第二信号路径。 第一信号路径包括具有耦合到输入端口的输入节点的低噪声放大器（LNA），并且第二信号路径包括耦合在输入端口和输出端口之间的开关。

    PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME
    16.
    发明申请
    PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME 有权
    包装布置及其形成方法

    公开(公告)号：US20140332936A1

    公开(公告)日：2014-11-13

    申请号：US13889370

    申请日：2013-05-08

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Gottfried Beer ,  Dominic Maier ,  Ulrich Wachter ,  Daniel Kehrer

    IPC: H01L23/552 ,  H01L21/56

    CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

    Abstract: In various embodiments, a package arrangement may be provided. The package arrangement may include at least one chip. The package arrangement may further include encapsulation material at least partially encapsulating the chip. The package arrangement may also include a redistribution structure over a first side of the chip. The package arrangement may further include a metal structure over a second side of the chip. The second side may be opposite the first side. The package arrangement may additionally include at least one of a semiconductor structure and an electrically conductive plastic material structure electrically coupled to the redistribution structure and the metal structure to form a current path between the redistribution structure and the metal structure.

    Abstract translation: 在各种实施例中，可以提供包装布置。 封装结构可以包括至少一个芯片。 封装结构还可以包括至少部分地封装芯片的封装材料。 封装布置还可以包括在芯片的第一侧上的再分布结构。 封装布置还可以包括在芯片的第二侧上的金属结构。 第二面可以与第一面相对。 封装结构可以另外包括半导体结构和导电塑料材料结构中的至少一个，该结构电耦合到再分布结构和金属结构，以形成再分布结构和金属结构之间的电流路径。

    Connectivity of slave devices in mobile devices
    17.
    发明授权
    Connectivity of slave devices in mobile devices 有权

    公开(公告)号：US09886407B2

    公开(公告)日：2018-02-06

    申请号：US14213173

    申请日：2014-03-14

    Applicant: Infineon Technologies AG

    Inventor： Daniel Kehrer

    IPC: G06F13/40 ,  G06F13/38 ,  H04B1/00

    CPC classification number: G06F13/4022 ,  H04B1/005

    Abstract: In accordance with an embodiment of the present invention, a chip set for a mobile device includes a slave device chip and an interface circuit chip that includes a slave bus interface for controlling the slave device chip through an analog bus. The slave bus interface is coupled to a master bus interface via a digital bus of the mobile device. The slave bus interface is configured to be driven by the master bus interface.

    Multiple input and multiple output switch network
    18.
    发明授权
    Multiple input and multiple output switch network 有权
    多输入多输出交换网络

    公开(公告)号：US09490852B2

    公开(公告)日：2016-11-08

    申请号：US14252322

    申请日：2014-04-14

    Applicant: Infineon Technologies AG

    Inventor： Daniel Kehrer

    IPC: H03K9/00 ,  H04L27/00 ,  H04B1/00 ,  H04B1/10

    CPC classification number: H04B1/006 ,  H04B1/1027 ,  H04B7/0452

    Abstract: According to an embodiment, a circuit package includes a programmable switch component having a plurality of input terminals arranged on the programmable switch component, a plurality of output terminals arranged on the programmable switch component and configured to be coupled to a plurality of amplifiers, and a plurality of switches. Each switch of the plurality of switches is coupled between an input terminal of the plurality of input terminals and an output terminal of the plurality of output terminals. Each switch of the plurality of switches includes a radio frequency (RF) switch and is configured to pass an RF signal when closed. Each input terminal of the plurality of input terminals is coupled to two switches of the plurality of switches.

    Abstract translation: 根据实施例，电路封装包括具有布置在可编程开关组件上的多个输入端的可编程开关组件，布置在可编程开关组件上并被配置为耦合到多个放大器的多个输出端子，以及 多个开关。 多个开关的每个开关耦合在多个输入端子的输入端子和多个输出端子的输出端子之间。 多个开关的每个开关包括射频（RF）开关，并且被配置为在关闭时传递RF信号。 多个输入端子的每个输入端子耦合到多个开关的两个开关。

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