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公开(公告)号:US11424539B2
公开(公告)日:2022-08-23
申请号:US16472830
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q5/47 , H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US20240243477A1
公开(公告)日:2024-07-18
申请号:US18442331
申请日:2024-02-15
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Marian Verhelst , Yossi Tsfati , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC classification number: H01Q9/0414 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US20230145401A1
公开(公告)日:2023-05-11
申请号:US18089220
申请日:2022-12-27
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q5/47 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC classification number: H01Q9/0414 , H01Q5/47 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US20190013924A1
公开(公告)日:2019-01-10
申请号:US16127800
申请日:2018-09-11
Applicant: Intel Corporation
Inventor: Georgios C. Dogiamis , Telesphor Kamgaing , Emanuel Cohen , Sasha N. Oster
Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.
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公开(公告)号:US10079668B2
公开(公告)日:2018-09-18
申请号:US15388204
申请日:2016-12-22
Applicant: Intel Corporation
Inventor: Georgios C. Dogiamis , Telesphor Kamgaing , Emanuel Cohen , Sasha N. Oster
Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.
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公开(公告)号:US20180183522A1
公开(公告)日:2018-06-28
申请号:US15388564
申请日:2016-12-22
Applicant: Intel Corporation
Inventor: Georgios C. Dogiamis , Emanuel Cohen , Sasha N. Oster , Telesphor Kamgaing
IPC: H04B10/2525 , H04B10/2575 , H04L25/03 , H04J14/00
CPC classification number: H04L25/03834 , H04B10/90 , H04L25/03343
Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.
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公开(公告)号:US09960849B1
公开(公告)日:2018-05-01
申请号:US15388383
申请日:2016-12-22
Applicant: Intel Corporation
Inventor: Georgios C. Dogiamis , Sasha N. Oster , Telesphor Kamgaing , Emanuel Cohen
IPC: H04B10/00 , H04B10/2575 , H04J14/00
CPC classification number: H04B10/2575
Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.
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