公开(公告)号：US20230199516A1

公开(公告)日：2023-06-22

申请号：US17560117

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Gregory Chance ,  Ashoke Ravi ,  Benjamin Jann ,  Paolo Madoglio

IPC: H04W16/28 ,  H04W24/10 ,  H04B7/06 ,  H04B17/318 ,  H04W36/00

CPC classification number: H04W16/28 ,  H04B7/0617 ,  H04B17/318 ,  H04W24/10 ,  H04W36/00837

Abstract: A wireless communication device can include an antenna array and processing circuitry coupled to the antenna array to segment antenna elements of an antenna array into a configurable plurality of groups of antenna elements. The circuitry can also activate analog beamforming for at least one group of the plurality of groups of antenna elements. Subsequent to enabling analog beamforming, the processing circuitry can configure digital beamforming for the at !east one group based on a criterion.

公开(公告)号：US20220384956A1

公开(公告)日：2022-12-01

申请号：US17734529

申请日：2022-05-02

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asi ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q5/47 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US11424539B2

公开(公告)日：2022-08-23

申请号：US16472830

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q5/47 ,  H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US11329706B2

公开(公告)日：2022-05-10

申请号：US17054256

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Wayne Ballantyne ,  Gregory Chance ,  Bruce Geren ,  Dror Markovich ,  Peter Pawliuk ,  Nebil Tanzi

IPC: H04B7/06 ,  H04B17/318 ,  H04B17/336 ,  H04W56/00

Abstract: In a communication device and corresponding methods, a hierarchical, reduced power, beam search process includes a hierarchical activation of the radio frequency frontend (RFFE), transceiver, and baseband integrated circuit (BBIC) for a beam searching operations. For example, a first signal metric measurements can be performed to determine signal information. An operating mode can be determined based on the signal information. In a first operating mode, one or more second signal metric measurements can be performed for a subset of beamforming configurations of the wireless communication device to determine beamforming information. In a second operating mode, one or more third signal metric measurements can be performed on the beamforming configurations to determine the beamforming information.

公开(公告)号：US10790332B2

公开(公告)日：2020-09-29

申请号：US15778603

申请日：2015-12-24

Applicant: Intel Corporation

Inventor： Bruce A. Block ,  Paul B. Fischer ,  Nebil Tanzi ,  Gregory Chance ,  Han Wui Then ,  Sansaptak Dasgupta ,  Marko Radosavljevic

IPC: H01L21/50 ,  H01L27/20 ,  H01L23/00 ,  H01L23/48 ,  H01L23/66 ,  H03H3/007 ,  H03H9/05 ,  H01L29/20 ,  H01L29/66 ,  H01L29/778 ,  H03H3/02 ,  H03H9/17 ,  H03H9/56 ,  H03H9/15

Abstract: Techniques to fabricate an RF filter using 3 dimensional island integration are described. A donor wafer assembly may have a substrate with a first and second side. A first side of a resonator layer, which may include a plurality of resonator circuits, may be coupled to the first side of the substrate. A weak adhesive layer may be coupled to the second side of the resonator layer, followed by a low-temperature oxide layer and a carrier wafer. A cavity in the first side of the resonator layer may expose an electrode of the first resonator circuit. An RF assembly may have an RF wafer having a first and a second side, where the first side may have an oxide mesa coupled to an oxide layer. A first resonator circuit may be then coupled to the oxide mesa of the first side of the RF wafer.