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公开(公告)号:US11616130B2
公开(公告)日:2023-03-28
申请号:US16363632
申请日:2019-03-25
Applicant: Intel Corporation
Inventor: Seung Hoon Sung , Jack Kavalieros , Ian Young , Matthew Metz , Uygar Avci , Devin Merrill , Ashish Verma Penumatcha , Chia-Ching Lin , Owen Loh
Abstract: Techniques and mechanisms to provide electrical insulation between a gate and a channel region of a non-planar circuit device. In an embodiment, the gate structure, and insulation spacers at opposite respective sides of the gate structure, each extend over a semiconductor fin structure. In a region between the insulation spacers, a first dielectric layer extends conformally over the fin, and a second dielectric layer adjoins and extends conformally over the first dielectric layer. A third dielectric layer, adjoining the second dielectric layer and the insulation spacers, extends under the gate structure. Of the first, second and third dielectric layers, the third dielectric layer is conformal to respective sidewalls of the insulation spacers. In another embodiment, the second dielectric layer is of dielectric constant which is greater than that of the first dielectric layer, and equal to or less than that of the third dielectric layer.
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公开(公告)号:US11594270B2
公开(公告)日:2023-02-28
申请号:US16141827
申请日:2018-09-25
Applicant: Intel Corporation
Inventor: Tanay Gosavi , Sasikanth Manipatruni , Chia-Ching Lin , Dmitri Nikonov , Christopher Wiegand , Ian Young
Abstract: An apparatus is provided which comprises: a magnetic junction having a magnet with perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device. In some embodiments, the apparatus comprises an interconnect partially adjacent to the structure of the magnetic junction, wherein the interconnect comprises a spin orbit material, wherein the interconnect has a pocket comprising non-spin orbit material, wherein the pocket is adjacent to the magnet of the magnetic junction. In some embodiments, the non-spin orbit material comprises metal which includes one or more of: Cu, Al, Ag, or Au.
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13.
公开(公告)号:US20230058938A1
公开(公告)日:2023-02-23
申请号:US17409483
申请日:2021-08-23
Applicant: Intel Corporation
Inventor: Punyashloka Debashis , Dmitri Evgenievich Nikonov , Hai Li , Chia-Ching Lin , Raseong Kim , Tanay A. Gosavi , Ashish Verma Penumatcha , Uygar E. Avci , Marko Radosavljevic , Ian Alexander Young
IPC: G11C11/22 , H01L27/1159
Abstract: A pbit device, in one embodiment, includes a first field-effect transistor (FET) that includes a source region, a drain region, a source electrode on the source region, a drain electrode on the drain region, a channel region between the source and drain regions, a dielectric layer on a surface over the channel region, an electrode layer above the dielectric layer, and a ferroelectric (FE) material layer between the dielectric layer and the electrode layer. The pbit device also includes a second FET comprising a source electrode, a drain electrode, and a gate electrode. The drain electrode of the second FET is connected to the drain electrode of the first FET.
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公开(公告)号:US11574666B2
公开(公告)日:2023-02-07
申请号:US16246362
申请日:2019-01-11
Applicant: Intel Corporation
Inventor: Tanay Gosavi , Sasikanth Manipatruni , Chia-Ching Lin , Kaan Oguz , Ian Young
Abstract: A memory device includes a spin orbit electrode structure having a dielectric structure including a first sidewall, a second sidewall opposite to the first sidewall, a top surface. The spin orbit electrode structure further includes an electrode having a spin orbit material adjacent to the dielectric structure, where the electrode has a first electrode portion on the top surface, a second electrode portion adjacent to the first sidewall and a third electrode portion adjacent to the second sidewall. The first electrode portion, the second electrode portion and the third electrode portion are contiguous. The spin orbit electrode structure further includes a conductive interconnect in contact with the second electrode portion or the third electrode portion. The memory device further includes a magnetic junction device on a portion of the top surface of the first electrode portion.
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15.
公开(公告)号:US11557717B2
公开(公告)日:2023-01-17
申请号:US16193599
申请日:2018-11-16
Applicant: Intel Corporation
Inventor: Chia-Ching Lin , Tanay Gosavi , Sasikanth Manipatruni , Dmitri Nikonov , Ian Young
Abstract: A memory apparatus is provided which comprises: a stack comprising a magnetic insulating material and a transition metal dichalcogenide (TMD), wherein the magnetic insulating material has a first magnetization. The stack behaves as a free magnet. The apparatus includes a fixed magnet with a second magnetization. An interconnect is further provided which comprises a spin orbit material, wherein the interconnect is adjacent to the stack.
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公开(公告)号:US20220310147A1
公开(公告)日:2022-09-29
申请号:US17839345
申请日:2022-06-13
Applicant: Intel Corporation
Inventor: Chia-Ching Lin , Sasikanth Manipatruni , Tanay Gosavi , Dmitri Nikonov , Benjamin Buford , Kaan Oguz , John J. Plombon , Ian A. Young
Abstract: An apparatus is provided which comprises: a stack comprising a magnetic insulating material (MI such as EuS, EuO, YIG, TmIG, or GaMnAs) and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, or graphene), wherein the magnetic insulating material has a first magnetization; a magnet with a second magnetization, wherein the magnet is adjacent to the TMD of the stack; and an interconnect comprising a spin orbit material, wherein the interconnect is adjacent to the magnet.
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公开(公告)号:US11316027B2
公开(公告)日:2022-04-26
申请号:US16833375
申请日:2020-03-27
Applicant: Intel Corporation
Inventor: Sou-Chi Chang , Chia-Ching Lin , Nazila Haratipour , Tanay Gosavi , I-Cheng Tung , Seung Hoon Sung , Ian Young , Jack Kavalieros , Uygar Avci , Ashish Verma Penumatcha
Abstract: A capacitor device includes a first electrode having a first metal alloy or a metal oxide, a relaxor ferroelectric layer adjacent to the first electrode, where the ferroelectric layer includes oxygen and two or more of lead, barium, manganese, zirconium, titanium, iron, bismuth, strontium, neodymium, potassium, or niobium and a second electrode coupled with the relaxor ferroelectric layer, where the second electrode includes a second metal alloy or a second metal oxide.
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公开(公告)号:US20220123206A1
公开(公告)日:2022-04-21
申请号:US17565106
申请日:2021-12-29
Applicant: Intel Corporation
Inventor: Chia-Ching Lin , Sasikanth Manipatruni , Tanay Gosavi , Dmitri Nikonov , Benjamin Buford , Kaan Oguz , John J. Plombon , Ian A. Young
Abstract: An apparatus is provided which comprises: a stack comprising a magnetoelectric (ME such as BiFeO3, (LaBi)FeO3, LuFeO3, PMN-PT, PZT, AlN, SmBiFeO3, Cr2O3, etc.) material and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, graphene, etc.); a magnet adjacent to a first portion of the TMD of the stack; a first interconnect adjacent to the magnet; a second interconnect adjacent to the ME material of the stack; and a third interconnect adjacent to a second portion of the TMD of the stack.
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公开(公告)号:US10998495B2
公开(公告)日:2021-05-04
申请号:US16329721
申请日:2016-09-30
Applicant: Intel Corporation
Inventor: Chia-Ching Lin , Sasikanth Manipatruni , Dmitri E. Nikonov , Ian A. Young
IPC: H01L43/10 , H01L41/187 , H01L41/193 , H01L41/20 , G11C11/16 , H01L41/00 , H01L27/22 , H01L43/08 , H01F10/32 , H01L43/02 , H01F10/12
Abstract: An apparatus is provided which comprises: a ferromagnetic (FM) region with magnetostrictive (MS) property; a piezo-electric (PZe) region adjacent to the FM region; and a magnetoelectric region adjacent to the FM region. An apparatus is provided which comprises: a FM region with MS property; a PZe region adjacent to the FM region; and a magnetoelectric region, wherein the FM region is at least partially adjacent to the magnetoelectric region. An apparatus is provided which comprises: a FM region with MS property; a PZe region adjacent to the FM region; a magnetoelectric region being adjacent to the FM and PZe regions; a first electrode adjacent to the FM and PZe regions; a second electrode adjacent to the magnetoelectric region; a spin orbit coupling (SOC) region adjacent to the magnetoelectric region; and a third electrode adjacent to the SOC region.
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公开(公告)号:US10957844B2
公开(公告)日:2021-03-23
申请号:US16346872
申请日:2016-12-23
Applicant: Intel Corporation
Inventor: Jasmeet S. Chawla , Sasikanth Manipatruni , Robert L. Bristol , Chia-Ching Lin , Dmitri E. Nikonov , Ian A. Young
Abstract: Magneto-electric spin orbital (MESO) structures having functional oxide vias, and method of fabricating magneto-electric spin orbital (MESO) structures having functional oxide vias, are described. In an example, a magneto-electric spin orbital (MESO) device includes a source region and a drain region in or above a substrate. A first via contact is on the source region. A second via contact is on the drain region, the second via contact laterally adjacent to the first via contact. A plurality of alternating ferromagnetic material lines and non-ferromagnetic conductive lines is above the first and second via contacts. A first of the ferromagnetic material lines is on the first via contact, and a second of the ferromagnetic material lines is on the second via contact. A spin orbit coupling (SOC) via is on the first of the ferromagnetic material lines. A functional oxide via is on the second of the ferromagnetic material lines.
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