公开(公告)号：US10707186B1

公开(公告)日：2020-07-07

申请号：US16125261

申请日：2018-09-07

申请人： Intel Corporation

发明人： Mauro J. Kobrinsky ,  Jasmeet S. Chawla ,  Stefan Meister ,  Myra McDonnell ,  Chytra Pawashe ,  Daniel Pantuso

IPC分类号： B32B37/02 ,  H01L23/00

摘要： Techniques and mechanisms for forming a bond between wafers using a compliant layer. In an embodiment, a layer or layers of one or more compliant materials is provided on a first surface of a first wafer, and the one or more compliant layers are subsequently bonded to a second surface of a second wafer. The bonded wafers are heated to an elevated temperature at which a compliant layer exhibits non-elastic deformations to facilitate relaxation of stresses caused by wafer distortions. In another embodiment, a material of the compliant layer exhibits viscoelastic behavior at room temperature, wherein stress is mitigated by allowing wafer distortion to relax at room temperature.

公开(公告)号：US10032643B2

公开(公告)日：2018-07-24

申请号：US15528736

申请日：2014-12-22

申请人： Intel Corporation

发明人： Jasmeet S. Chawla ,  Ruth A. Brain ,  Richard E. Schenker ,  Kanwal Jit Singh ,  Alan M. Myers

IPC分类号： H01L21/311 ,  H01L21/768 ,  H01L21/48 ,  H01L23/522

摘要： Interconnect structures having alternating dielectric caps and an etchstop liner for semiconductor devices and methods for manufacturing such devices are described. According to an embodiment, an interconnect structure may include an interlayer dielectric (ILD) with a first hardmask layer over a top surface of the ILD. The interconnect structure may also include one or more first interconnect lines in the ILD. A first dielectric cap may be positioned above a top surface of each of the first interconnect lines. Additional embodiments include one or more second interconnect lines in the ILD that are arranged in an alternating pattern with the first interconnect lines. A second dielectric cap may be formed above a top surface of each of the second interconnect lines. Embodiments may also include an etchstop liner that is formed over top surfaces of the first dielectric caps.

公开(公告)号：US11380617B2

公开(公告)日：2022-07-05

申请号：US15903304

申请日：2018-02-23

申请人： Intel Corporation

发明人： Christopher J. Jezewski ,  Jasmeet S. Chawla

IPC分类号： H01L23/528 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/033 ,  H01L21/02 ,  H01L21/311

摘要： Embodiments of the invention describe low capacitance interconnect structures for semiconductor devices and methods for manufacturing such devices. According to an embodiment of the invention, a low capacitance interconnect structure comprises an interlayer dielectric (ILD). First and second interconnect lines are disposed in the ILD in an alternating pattern. The top surfaces of the first interconnect lines may be recessed below the top surfaces of the second interconnect lines. Increases in the recess of the first interconnect lines decreases the line-to-line capacitance between neighboring interconnects. Further embodiments include utilizing different dielectric materials as etching caps above the first and second interconnect lines. The different materials may have a high selectivity over each other during an etching process. Accordingly, the alignment budget for contacts to individual interconnect lines is increased.

公开(公告)号：US11107908B2

公开(公告)日：2021-08-31

申请号：US16306540

申请日：2016-07-01

申请人： Intel Corporation

发明人： Sasikanth Manipatruni ,  Anurag Chaudhry ,  Dmitri E. Nikonov ,  Jasmeet S. Chawla ,  Christopher J. Wiegand ,  Kanwaljit Singh ,  Uygar E. Avci ,  Ian A. Young

IPC分类号： H01L29/66 ,  H01L29/45 ,  H01L29/775 ,  H01L29/10 ,  H01L29/739 ,  H01L29/06 ,  B82Y10/00 ,  H01L29/786 ,  H01L29/423 ,  H01L29/417 ,  H01L21/285 ,  H01L29/16 ,  H01L29/20 ,  H01L29/24 ,  H01L29/47 ,  H01L29/78

摘要： Embodiments herein describe techniques for a semi-conductor device comprising a channel having a first semiconductor material; a source contact coupled to the channel, comprising a first Heusler alloy; and a drain contact coupled to the channel, comprising a second Heusler alloy. The first Heusler alloy is lattice-matched to the first semiconductor material within a first predetermined threshold. A first Schottky barrier between the channel and the source contact, and a second Schottky barrier between the channel and the drain contact are negative, or smaller than another predetermined threshold. The source contact and the drain contact can be applied to a strained silicon transistor, an III-V transistor, a tunnel field-effect transistor, a dichalcogenide (MX2) transistor, and a junctionless nanowire transistor.

公开(公告)号：US10256141B2

公开(公告)日：2019-04-09

申请号：US15744018

申请日：2015-09-23

申请人： Intel Corporation

发明人： Manish Chandhok ,  Todd R. Younkin ,  Eungnak Han ,  Jasmeet S. Chawla ,  Marie Krysak ,  Hui Jae Yoo ,  Tristan A. Tronic

IPC分类号： H01L21/331 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

摘要： A first etch stop layer is deposited on a plurality of conductive features on an insulating layer on a substrate. A second etch stop layer is deposited over an air gap between the conductive features. The first etch stop layer is etched to form a via to at least one of the conductive features.

公开(公告)号：US11056593B2

公开(公告)日：2021-07-06

申请号：US16631059

申请日：2017-09-12

申请人： INTEL CORPORATION

发明人： Sasikanth Manipatruni ,  Dmitri E. Nikonov ,  Uygar E. Avci ,  Christopher J. Wiegand ,  Anurag Chaudhry ,  Jasmeet S. Chawla ,  Ian A Young

IPC分类号： H01L29/78 ,  H01L21/28 ,  H01L29/08 ,  H01L29/10 ,  H01L29/417 ,  H01L29/49 ,  H01L29/51 ,  H01L29/66 ,  H01L29/18 ,  H01L21/3105 ,  H01L21/8252

摘要： Techniques are disclosed for forming semiconductor integrated circuits including one or more of source and drain contacts and gate electrodes comprising crystalline alloys including a transition metal. The crystalline alloys help to reduce contact resistance to the semiconductor devices. In some embodiments of the present disclosure, this reduction in contact resistance is accomplished by aligning the work function of the crystalline alloy with the work function of the source and drain regions such that a Schottky barrier height associated with an interface between the crystalline alloys and the source and drain regions is in a range of 0.3 eV or less.

公开(公告)号：US10957844B2

公开(公告)日：2021-03-23

申请号：US16346872

申请日：2016-12-23

申请人： Intel Corporation

发明人： Jasmeet S. Chawla ,  Sasikanth Manipatruni ,  Robert L. Bristol ,  Chia-Ching Lin ,  Dmitri E. Nikonov ,  Ian A. Young

IPC分类号： H01L43/02 ,  H01L43/10 ,  H01L43/12 ,  H01L43/00 ,  H03K19/18

摘要： Magneto-electric spin orbital (MESO) structures having functional oxide vias, and method of fabricating magneto-electric spin orbital (MESO) structures having functional oxide vias, are described. In an example, a magneto-electric spin orbital (MESO) device includes a source region and a drain region in or above a substrate. A first via contact is on the source region. A second via contact is on the drain region, the second via contact laterally adjacent to the first via contact. A plurality of alternating ferromagnetic material lines and non-ferromagnetic conductive lines is above the first and second via contacts. A first of the ferromagnetic material lines is on the first via contact, and a second of the ferromagnetic material lines is on the second via contact. A spin orbit coupling (SOC) via is on the first of the ferromagnetic material lines. A functional oxide via is on the second of the ferromagnetic material lines.

公开(公告)号：US20190074217A1

公开(公告)日：2019-03-07

申请号：US16072145

申请日：2016-02-25

申请人： Intel Corporation

发明人： Christopher J. Jezewski ,  Ramanan V. Chebiam ,  Jasmeet S. Chawla ,  Mauro J. Kobrinsky ,  James S. Clarke

IPC分类号： H01L21/768 ,  H01L21/288 ,  H01L23/532 ,  C23C18/40

摘要： A conductive connector for a microelectronic structure may be formed in an opening in a dielectric layer, wherein a ruthenium/aluminum-containing liner is disposed between the dielectric layer and a substantially aluminum-free copper fill material within the opening. The ruthenium/aluminum-containing liner may be formed by depositing a ruthenium-containing liner and migrating aluminum into the ruthenium-containing liner with an annealing process. The aluminum may be presented as a layer formed either before or after the deposition of a copper fill material, or may be presented within a copper/aluminum alloy fill material wherein the annealing process migrates the aluminum out of the copper/aluminum alloy and into the ruthenium-containing liner.

公开(公告)号：US11069609B2

公开(公告)日：2021-07-20

申请号：US16647691

申请日：2017-11-03

申请人： INTEL CORPORATION

发明人： Sasikanth Manipatruni ,  Jasmeet S. Chawla ,  Chia-Ching Lin ,  Dmitri E. Nikonov ,  Ian A. Young ,  Robert L. Bristol

IPC分类号： H01L23/522 ,  H01F10/32 ,  H01L21/768 ,  H01L23/528 ,  H01L27/22 ,  H01L43/02

摘要： Techniques are disclosed for forming vias for integrated circuit structures. During an additive via formation process, a dielectric material is deposited, an etch stop layer is deposited, a checkerboard pattern is deposited on the etch stop layer, regions in the checkerboard pattern are removed where it is desired to have vias, openings are etched in the dielectric material through the removed regions, and the openings are filled with a first via material. This is then repeated for a second via material. During the subtractive via formation process, a first via material is deposited, an etch stop layer is deposited, a checkerboard pattern is deposited on the etch stop layer, regions in the checkerboard pattern are removed where it is not desired to have vias, openings are etched in the first via material through the removed regions. This is then repeated for a second via material.

公开(公告)号：US10971394B2

公开(公告)日：2021-04-06

申请号：US16284568

申请日：2019-02-25

申请人： Intel Corporation

发明人： Manish Chandhok ,  Todd R. Younkin ,  Eungnak Han ,  Jasmeet S. Chawla ,  Marie Krysak ,  Hui Jae Yoo ,  Tristan A. Tronic

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

摘要： A first etch stop layer is deposited on a plurality of conductive features on an insulating layer on a substrate. A second etch stop layer is deposited over an air gap between the conductive features. The first etch stop layer is etched to form a via to at least one of the conductive features.