公开(公告)号：US20080099931A1

公开(公告)日：2008-05-01

申请号：US11969300

申请日：2008-01-04

申请人： Chin Chong ,  Choon Lee ,  David Corisis

发明人： Chin Chong ,  Choon Lee ,  David Corisis

IPC分类号： H01L23/49 ,  H05K1/11

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.

摘要翻译： 用于安装微电子管芯的基板，在这种基板中形成通孔的方法，以及用于封装微电子器件的方法。 根据本发明的一个实施例的制造基板的方法包括在非导电材料片的第一侧上形成导电迹线，并且从片材的第二面通过非导电材料形成通孔， 导电迹线。 该方法还包括去除非导电材料的一部分以形成穿过通孔的至少一部分延伸的非导电材料的边缘。 在一个实施例中，跨过通孔形成边缘暴露出第二导电迹线的至少一部分，以便随后连接到微电子管芯上的端子。

公开(公告)号：US20060046537A1

公开(公告)日：2006-03-02

申请号：US10927760

申请日：2004-08-27

申请人： Chin Chong ,  Choon Lee

发明人： Chin Chong ,  Choon Lee

IPC分类号： H01R12/00

CPC分类号： H01R12/526 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09836 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/4922

摘要： Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

公开(公告)号：US20050109623A1

公开(公告)日：2005-05-26

申请号：US10939093

申请日：2004-09-10

申请人： Choon Lee

发明人： Choon Lee

IPC分类号： C25D11/12 ,  C25D11/14 ,  C25D11/22

CPC分类号： C25D11/12 ,  C25D11/14 ,  C25D11/22

摘要： Anodizing processes are provided for coloring a metal component in a random pattern with one or more colors. Positive effect anodizing process advantageously includes steps of preparing the metal component, repeatedly coloring the metal component, sealing the color(s) and stripping the sealant, followed by application of UV coating. Negative effect anodizing process advantageously includes steps of preparing the metal component, repeatedly sealing the metal component, stripping the sealant, and coloring the metal component, followed by application of UV coating.

摘要翻译： 提供阳极氧化工艺用于以一种或多种颜色着色随机图案中的金属组分。 正效应阳极氧化方法有利地包括制备金属组分，重复着色金属组分，密封颜色和剥离密封剂，然后施加UV涂层的步骤。 负效应阳极氧化方法有利地包括制备金属组分，反复密封金属组分，剥离密封剂和着色金属组分，然后施加UV涂层的步骤。

公开(公告)号：US5987212A

公开(公告)日：1999-11-16

申请号：US343194

申请日：1994-11-22

申请人： Seung Il Kim ,  Choon Lee ,  Ki Dong Lee ,  Ho Won Lee

发明人： Seung Il Kim ,  Choon Lee ,  Ki Dong Lee ,  Ho Won Lee

IPC分类号： G11B15/02 ,  H04N5/7826 ,  H04N5/783 ,  H04N9/804 ,  H04N9/82

CPC分类号： H04N9/8042 ,  H04N5/78263 ,  H04N5/783 ,  H04N9/8227

摘要： A variable-speed reproducing method for DVCR comprising the steps of: (1) converting a transported signal into a transport stream (TS) signal; (2) storing the converted TS signal as normal play data; (3) detecting trick play data from the converted TS signal; (4) separately recording the trick play data and normal play data formed in the steps 2 and 3; and (5 and 6) if a trick play signal is input, reading and reproducing only the recorded trick play data at a corresponding speed, thereby facilitating trick play by DVCR.

摘要翻译： 一种用于DVCR的可变速再现方法，包括以下步骤：（1）将传送的信号转换成传输流（TS）信号; （2）将转换的TS信号存储为正常播放数据; （3）从转换的TS信号中检测特技播放数据; （4）分别记录在步骤2和3中形成的特技播放数据和正常播放数据; 和（5和6）如果输入特技播放信号，则以相应的速度仅读取和再现所记录的特技播放数据，从而促进DVCR的特技播放。

公开(公告)号：US5897219A

公开(公告)日：1999-04-27

申请号：US725268

申请日：1996-10-02

申请人： Byoung Koo Yoo ,  Choon Lee

发明人： Byoung Koo Yoo ,  Choon Lee

IPC分类号： G11B20/10 ,  G11B27/032 ,  G11B27/10 ,  H04N5/926 ,  H04N5/917

CPC分类号： G11B27/032 ,  G11B27/107 ,  H04N5/9261 ,  G11B2220/90

摘要： A recording and playback apparatus for a digital video cassette recorder is provided with a data conversion unit for recording a compressed video signal in a more compressed format on a digital recording medium and a data inverse recording unit for playing out the recorded video signal. The data conversion unit includes a controller, encoder and multiplexer. The controller has for its inputs ID information decoded from the compressed video data signal by a decoder and a recording signal instructing the recording of the compressed video signal on a recording medium. At the start of picture recording the controller provides a selection signal to a multiplexer and a decoding instruction to an encoder to enable the encoder to recode the entire picture region of the decoded video data in an intraframe manner with a header which contains the decoding instruction information. The data inverse conversion unit includes a header decoder, a buffer controller, and a buffer. The buffer controller has as inputs the decoded instruction information output from the header decoder and a playback signal instructing the playback of compressed video data from the digital recording medium. Thus, both intraframe and interframe coded pictures can be viewed without degradation, even when playout is begun from a stopped position in the middle of a program.

摘要翻译： 一种用于数字录像机的记录和重放装置设置有数据转换单元，用于在数字记录介质上以更压缩的格式记录压缩视频信号，以及用于播放所记录的视频信号的数据逆记录单元。 数据转换单元包括控制器，编码器和多路复用器。 控制器具有通过解码器从压缩视频数据信号解码的输入ID信息和指示将压缩视频信号记录在记录介质上的记录信号。 在图像记录开始时，控制器向多路复用器提供选择信号，并向编码器提供解码指令，使得编码器能够以包含解码指令信息的标题的帧内方式对解码的视频数据的整个图像区域进行重新编码 。 数据逆转换单元包括头解码器，缓冲器控制器和缓冲器。 缓冲器控制器具有从头部解码器输出的解码指令信息和指示从数字记录介质再现压缩视频数据的重放信号作为输入。 因此，即使从程序中间的停止位置开始播放，也可以不降级地观看帧内和帧间编码图像。

公开(公告)号：US5543931A

公开(公告)日：1996-08-06

申请号：US238313

申请日：1994-05-05

申请人： Je H. Lee ,  Choon Lee

发明人： Je H. Lee ,  Choon Lee

IPC分类号： G11B20/10 ,  H04N5/783 ,  H04N5/926 ,  H04N7/54 ,  H04N5/765

CPC分类号： H04N7/54 ,  H04N5/9261 ,  H04N5/783

摘要： An apparatus for, and a method of, reproducing digital video signals at a varied speed, adapted to insert information about the maximum coded lengths of digital video signals in slices resulting from encoding and compressing of the digital video signals by a digital video signal transmitter so that the inserted information can be transmitted together with the compressed digital video signal, and to insert slice condition information and slice length information in slice headers of slices upon reproducing the digital video signals recorded on a tape at a varied speed so that the inserted slice condition information and slice length information can be deformatted together with the slices. The apparatus and method is thus capable of decoding the digital video signals for macroblocks preceding the macroblock involving a discontinuous interval based on the maximum coded length information, slice condition information and slice length information.

摘要翻译： 一种用于以变化的速度再现数字视频信号的装置和方法，其适于在由数字视频信号发射机对数字视频信号的编码和压缩所产生的切片中插入关于数字视频信号的最大编码长度的信息 插入的信息可以与压缩的数字视频信号一起发送，并且在以变化的速度再现记录在磁带上的数字视频信号时，将切片条件信息和切片长度信息插入切片的切片标题中，使得插入的切片条件 信息和切片长度信息可以与切片一起去格式化。 因此，该装置和方法能够基于最大编码长度信息，切片条件信息和切片长度信息来解码涉及不连续间隔的宏块之前的宏块的数字视频信号。

公开(公告)号：US20080064891A1

公开(公告)日：2008-03-13

申请号：US11827937

申请日：2007-07-12

申请人： Choon Lee

发明人： Choon Lee

IPC分类号： C11B3/02 ,  C07C69/74

CPC分类号： C07C67/343 ,  C07C29/32 ,  C07C67/475 ,  C07C2601/08 ,  C08G61/08 ,  C11C3/00 ,  C11C3/003 ,  C07C33/02 ,  C07C69/753 ,  C07C69/587 ,  C07C69/732 ,  C07C69/602

摘要： This invention relates generally to olefin metathesis, and more particularly relates to the ring-opening, ring insertion cross-metathesis of cyclic olefins with internal olefins such as seed oils and the like. In one embodiment, a method is provided for carrying out a catalytic ring-opening cross-metathesis reaction, comprising contacting at least one olefinic substrate with at least one cyclic olefin as a cross metathesis partner, in the presence of a ruthenium alkylidene olefin metathesis catalyst under conditions effective to allow ring insertion cross metathesis whereby the cyclic olefin is simultaneously opened and inserted into the olefinic substrate. The invention has utility in the fields of catalysis, organic synthesis, and industrial chemistry.

摘要翻译： 本发明一般涉及烯烃复分解，更具体地涉及环烯烃与内烯烃如种油等的开环，环插交换复分解。 在一个实施方案中，提供了一种用于进行催化开环交叉复分解反应的方法，包括在钌亚烷基烯烃复分解催化剂存在下使至少一种烯属底物与至少一种环状烯烃作为交叉复分解配对物接触 在有效地允许环插入交错复分解的条件下，其中环烯烃同时打开并插入烯属底物。 本发明可用于催化，有机合成和工业化学领域。

公开(公告)号：US20070181989A1

公开(公告)日：2007-08-09

申请号：US11414864

申请日：2006-05-01

申请人： David Corisis ,  Chin Chong ,  Choon Lee

发明人： David Corisis ,  Chin Chong ,  Choon Lee

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L23/053 ,  H01L21/56 ,  H01L21/561 ,  H01L22/10 ,  H01L23/3128 ,  H01L23/3178 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/105 ,  H01L25/117 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06503 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can include a first known good packaged microelectronic device including a first interposer substrate. A first die and a first through-casing interconnects are electrically coupled to the first interposer substrate. A first casing at least partially encapsulates the first device such that a portion of each first interconnect is accessible at a top portion of the first casing. A second known good packaged microelectronic device is coupled to the first device in a stacked configuration. The second device can include a second interposer substrate having a plurality of second interposer pads and a second die electrically coupled to the second interposer substrate. The exposed portions of the first interconnects are electrically coupled to corresponding second interposer pads.

摘要翻译： 本文公开了堆叠的微电子器件和用于制造这种器件的方法。 在一个实施例中，堆叠的微电子器件组件可以包括包括第一插入器衬底的第一已知的良好封装的微电子器件。 第一管芯和第一穿通管互连件电耦合到第一插入器衬底。 第一壳体至少部分地封装第一装置，使得每个第一互连件的一部分在第一壳体的顶部可接近。 第二已知的良好封装的微电子器件以堆叠配置耦合到第一器件。 第二器件可以包括具有多个第二插入器焊盘的第二插入器衬底和与第二插入器衬底电耦合的第二管芯。 第一互连的暴露部分电耦合到对应的第二插入器焊盘。

公开(公告)号：US20070139516A1

公开(公告)日：2007-06-21

申请号：US11537998

申请日：2006-10-02

申请人： Choon Lee ,  Su Mun

发明人： Choon Lee ,  Su Mun

IPC分类号： H04N7/14

CPC分类号： H04N7/147 ,  H04N2007/145

摘要： A mobile communication terminal and method of displaying an icon using the same are displayed, by which icons can be displayed on screens of calling and called parties, respectively in the course of video communications. The present invention includes entering an icon input mode in performing the video communications with at least one terminal using the mobile communication terminal, receiving a signal for selecting an icon and a position of the icon, and transmitting image control signal including the selected icon and position information of the selected icon.

摘要翻译： 显示使用其的图标的移动通信终端和方法，通过该移动通信终端和图标可以在视频通信过程中分别显示在呼叫和被叫方的屏幕上。 本发明包括：使用移动通信终端进行与至少一个终端的视频通信的图标输入模式，接收用于选择图标的信号和图标的位置，以及发送包括所选择的图标和位置的图像控制信号 所选图标的信息。

公开(公告)号：US20070045834A1

公开(公告)日：2007-03-01

申请号：US11217152

申请日：2005-08-31

申请人： Chin Chong ,  Choon Lee ,  David Corisis

发明人： Chin Chong ,  Choon Lee ,  David Corisis

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.

摘要翻译： 用于安装微电子管芯的基板，在这种基板中形成通孔的方法，以及用于封装微电子器件的方法。 根据本发明的一个实施例的制造基板的方法包括在非导电材料片的第一侧上形成导电迹线，并且从片材的第二面通过非导电材料形成通孔， 导电迹线。 该方法还包括去除非导电材料的一部分以形成穿过通孔的至少一部分延伸的非导电材料的边缘。 在一个实施例中，跨过通孔形成边缘暴露出第二导电迹线的至少一部分，以便随后连接到微电子管芯上的端子。