Diazo ester of a benzolactone ring compound and positive photoresist
composition and element utilizing the diazo ester
    11.
    发明授权
    Diazo ester of a benzolactone ring compound and positive photoresist composition and element utilizing the diazo ester 失效
    苯并内酯环化合物的重氮酯和使用重氮酯的正性光致抗蚀剂组合物和元素

    公开(公告)号:US5221592A

    公开(公告)日:1993-06-22

    申请号:US847527

    申请日:1992-03-06

    IPC分类号: G03F7/022

    CPC分类号: G03F7/022 Y10S430/168

    摘要: A photosensitizer comprising a diazo ester of benzolactone ring compound, such as phenolphthalein or cresolphthalein as the backbone, where at least one of the hydroxy groups on the benzolactone ring compound has been esterified with diazo-sulfonyl chloride consisting of 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride or a mixture thereof, and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitize the photoresist composition; a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition and a suitable solvent.

    摘要翻译: 一种光敏剂,其包含苯并内酯环化合物的重氮酯,例如酚酞或甲酚酞作为主链,其中苯并内酯环化合物上的至少一个羟基已用由60至100摩尔%2的重氮磺酰氯酯化, 1,4或2,1,5-重氮磺酰氯或其混合物,以及光致抗蚀剂,其包含光致抗蚀剂组合物中以足以使光致抗蚀剂组合物均匀光敏的量的光敏剂的混合物; 水不溶性的碱溶性酚醛清漆树脂,酚醛清漆树脂以足以形成基本均匀的光致抗蚀剂组合物和合适溶剂的量存在于光致抗蚀剂组合物中。

    Photoresist compositions containing polyamides polybenzoxa from
bis((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ethers
    13.
    发明授权
    Photoresist compositions containing polyamides polybenzoxa from bis((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ethers 失效
    含有二((氨基羟基苯基)六氟异丙基)二苯基醚的聚酰胺聚苯并恶唑的光致抗蚀剂组合物

    公开(公告)号:US5011753A

    公开(公告)日:1991-04-30

    申请号:US476332

    申请日:1990-02-07

    摘要: Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.

    摘要翻译: 衍生自至少一种选自未取代的和取代的4,4'-双[2-(4-氨基-3-羟基苯基)六氟异丙基)]二苯基醚4,4'-二胺的二胺的耐热,可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-(3-氨基-4-羟基苯基)六氟异丙基]二苯醚和二羧酸或其衍生物例如 其酸卤素或酯。 本发明的聚酰胺可以被热固化以形成对于水解,化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。 本发明的聚酰胺可以通过模制,挤出和溶剂浇铸方法形成成型制品,优选在溶剂或稀释剂的存在下,然后任选地转化成耐热不溶性聚苯并恶唑。 这些成型制品在飞机,电子和其他商业应用中是有用的,其中需要耐热,耐化学性和耐辐射性以及良好的机械和电学性能。

    Polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide
polymer having at least one fluorine-containing linking group
    14.
    发明授权
    Polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymer having at least one fluorine-containing linking group 失效
    具有至少一个含氟连接基团的聚酰胺 - 聚酰胺 - 聚酰亚胺和聚苯并恶唑 - 聚酰胺 - 聚酰亚胺聚合物

    公开(公告)号:US4978733A

    公开(公告)日:1990-12-18

    申请号:US321024

    申请日:1989-03-09

    申请人: Dinesh N. Khanna

    发明人: Dinesh N. Khanna

    IPC分类号: C08G73/14 C08G73/22 C08J3/09

    摘要: The present invention provides polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkylene, perfluoroalkylene or perfluoroarylalkylene having from 1 to 10 carbon atoms and a bond directly linking the two aromatic groups, and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The PA-PA-PI polymers of this invention are prepared by reacting compounds of the above formula alone or admixed with other aromatic diamines, with carboxyphenyl trimellitimide or the acid halide or ester derivatives thereof, alone or admixed with one or more aromatic diacid chlorides and/or one or more aromatic tetracarboxylic acids or anhydrides thereof. Polybenzoxazole-polyamide-polyimide derivatives of such polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C.sub.1 to C.sub.4 alkoxy, and by subjecting the resulting alkoxy or hydroxy-substituted polyamide-polyamide-polyimide to a dehydrating and cyclizing reaction to form the oxazole linkage which gives rise to polybenzoxazole-polyamide-polyimide polymers.

    Image formation utilizing photosensitive compositions containing low
metal content p-cresol oligomers
    16.
    发明授权
    Image formation utilizing photosensitive compositions containing low metal content p-cresol oligomers 失效
    使用含有低金属含量对甲酚低聚物的光敏组合物的图像形成

    公开(公告)号:US5858627A

    公开(公告)日:1999-01-12

    申请号:US920564

    申请日:1997-08-29

    CPC分类号: G03F7/023 G03F7/0236

    摘要: Process for producing a photosensitizer comprising a diazo ester of a p-cresol oligomer where at least one of the hydroxy groups on the p-cresol ring has been esterified with diazo-sulfonyl chloride comprising from about 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride, or a mixture thereof; and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitive the photoresist composition, a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition, and a suitable solvent.

    摘要翻译: 制备包含对甲酚低聚物的重氮酯的光敏剂的方法,其中对甲酚环上的至少一个羟基已用重氮磺酰氯酯化,包括约60-100摩尔%2,1,4 或2,1,5-重氮磺酰氯,或其混合物; 以及光致抗蚀剂,其包含光致抗蚀剂组合物中以足以使光致抗蚀剂组合物均匀感光的量的光敏剂的混合物,水不溶性的碱溶性酚醛清漆树脂,酚醛清漆树脂以光致抗蚀剂组合物的量存在 足以形成基本均匀的光致抗蚀剂组合物和合适的溶剂。

    Base developable negative acting photoresists
    19.
    发明授权
    Base developable negative acting photoresists 失效
    基础可显影负性光致抗蚀剂

    公开(公告)号:US5106720A

    公开(公告)日:1992-04-21

    申请号:US405493

    申请日:1989-09-11

    IPC分类号: C08G73/10 G03F7/023 G03F7/038

    摘要: A base developable negative acting photoresist composition which is thermally stable, provides high resolution at short exposure times and is capable of development by means of conventional aqueous alkaline developers. The present compositions comprise an alkali soluble hydroxylated polyamide and/or polyimide binder material, a photopolymerizable compound containing at least two ethylenically-unsaturated double bonds, and a light-sensitive photoinitiator.

    摘要翻译: 具有热稳定性的基底显影负性光致抗蚀剂组合物在短曝光时间下提供高分辨率,并且能够通过常规水性碱性显影剂显影。 本发明的组合物包含碱溶性羟基化聚酰胺和/或聚酰亚胺粘合剂材料,含有至少两个烯键式不饱和双键的光聚合化合物和光敏光引发剂。

    Polyamide-polyimide and polybenzoxazole-polyimide polymer
    20.
    发明授权
    Polyamide-polyimide and polybenzoxazole-polyimide polymer 失效
    聚酰胺 - 聚酰亚胺和聚苯并恶唑 - 聚酰亚胺聚合物

    公开(公告)号:US5071948A

    公开(公告)日:1991-12-10

    申请号:US558739

    申请日:1990-07-26

    申请人: Dinesh N. Khanna

    发明人: Dinesh N. Khanna

    IPC分类号: C08G73/10 C08G73/14 C08G73/22

    摘要: The present invention provides polyamide-polyimide and polybenzoxazole-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkyl, perfluoroalkyl or perfluoroarylalkyl having from 1 to 10 carbon atoms and a carbon-carbon double bond directly linking the two aromatic groups, and R is hydrogen.The polyamide-polyimide polymers of this invention are prepared by reacting compounds of the above formula, alone or admixed with other aromatic diamines, with one or more aromatic tetracarboxylic acids or anhydrides thereof. Polybenzoxazole-polyimide derivatives of such polyamide-polyimide.

    摘要翻译: 本发明提供了聚酰胺 - 聚酰亚胺和聚苯并恶唑 - 聚酰亚胺聚合物,其具有改进的加工和膜特性,其结合到聚合物主链中,具有下式的新型芳族二氨基化合物的聚合物冷凝残留物:其中A选自 的SO 2,O,S,CO,C 1至C 6烷基,具有1至10个碳原子的全氟烷基或全氟芳基烷基和直接连接两个芳族基团的碳 - 碳双键,R为氢。 本发明的聚酰胺 - 聚酰亚胺聚合物通过使单独或与其它芳族二胺混合的上述化合物与一种或多种芳族四羧酸或其酸酐反应来制备。 这种聚酰胺 - 聚酰亚胺的聚苯并恶唑 - 聚酰亚胺衍生物。