Abstract:
A gate driver circuit applicable to an inductive load, an inverter module, and an inverter apparatus are provided. The gate driver circuit includes a high side driver having a first output side and a first control side and generating a high side gate signal; and a low side driver generating a low side gate signal, wherein the high side driver includes a first VS pad formed on the first output side; a first output pad formed on the first output side, a first VB pad formed on the first control side; and a second VB pad formed to be adjacent to the first VB pad on the first control side and electrically connected to the first VS pad; and a first circuit unit connected to the plurality of pads to provide the high side gate signal through the first output pad.
Abstract:
A semiconductor integrated circuit apparatus includes a semiconductor substrate, a plurality of through-silicon vias (TSVs) formed in the semiconductor substrate, and an impedance path blocking unit located between the plurality of TSVs.
Abstract:
Provided are a method of updating firmware of a device, a device, and a mobile system including the device. The method includes: receiving, from a host, a first hash value and a signature, the first hash value corresponding to a firmware image at the host; performing a pre-verify operation for at least one of integrity verification and signature certification on the firmware image using the received first hash value and the received signature; receiving the firmware image from the host according to a result of the pre-verify operation; and obtaining a second hash value from the received firmware image to perform a post-verify operation for at least one of integrity verification and signature certification on the received firmware image.
Abstract:
An internal voltage generation method includes the steps of: setting first to third sections by using a reference voltage; determining to which section an internal voltage level corresponds, among the first to third sections; and generating the internal voltage by controlling a voltage pumping amount according to a section corresponding to the internal voltage level.
Abstract:
A Wireless-Fidelity (Wi-Fi) service method and system are provided. A beacon message and probe response message may contain a service information field storing device information. Wi-Fi devices can exchange information on supported functions with each other and one Wi-Fi device may identify functions supported by another Wi-Fi device. Hence, a Wi-Fi connection can be set up through automatic provisioning. The method includes receiving, by a first Wi-Fi device in non-Access Point (AP) mode, messages from nearby Wi-Fi devices operating in AP mode, analyzing a service information field of each received message, determining a second Wi-Fi device that is manufactured by the same manufacturer as the first Wi-Fi device and is capable of supporting a requested service, establishing a connection with the second Wi-Fi device through Wi-Fi Protected Setup (WPS) based on automatic provision, and sending data associated with the requested service to the second Wi-Fi device for a Wi-Fi service.
Abstract:
A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.
Abstract:
A semiconductor integrated circuit apparatus includes a semiconductor substrate, a plurality of signal lines, and at least one interface member. The signal lines are disposed on the semiconductor substrate. The interface member is disposed in the semiconductor substrate between the adjacent signal lines among the signal lines to pierce the semiconductor substrate.
Abstract:
Provided are a method for fabricating a capacitor and a semiconductor device using the same. The semiconductor device includes a MOS transistor capacitor, first and second plate capacitors, and a metal interconnection. The MOS transistor capacitor is arranged between a power supply and a ground. The first and second plate capacitors are arranged between the power supply and the ground. The metal interconnection is configured to connect the first and second plate capacitors.
Abstract:
A semiconductor device includes a MOS capacitor including a gate, a source, and a drain, a cylinder capacitor including a top electrode, a dielectric layer, and a bottom electrode, and a metal interconnection that connects the gate to the bottom electrode.
Abstract:
A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass has a resistivity that is decreased when the metallic glass is heat treated at a temperature that is higher than a glass transition temperature of the metallic glass.