GATE DRIVER CIRCUIT FOR INDUCTIVE LOAD, INVERTER MODULE, AND INVERTER APPARATUS HAVING THE SAME
    11.
    发明申请
    GATE DRIVER CIRCUIT FOR INDUCTIVE LOAD, INVERTER MODULE, AND INVERTER APPARATUS HAVING THE SAME 有权
    用于感应负载的门极驱动电路,逆变器模块和具有该负载的逆变器装置

    公开(公告)号:US20140003107A1

    公开(公告)日:2014-01-02

    申请号:US13620488

    申请日:2012-09-14

    Abstract: A gate driver circuit applicable to an inductive load, an inverter module, and an inverter apparatus are provided. The gate driver circuit includes a high side driver having a first output side and a first control side and generating a high side gate signal; and a low side driver generating a low side gate signal, wherein the high side driver includes a first VS pad formed on the first output side; a first output pad formed on the first output side, a first VB pad formed on the first control side; and a second VB pad formed to be adjacent to the first VB pad on the first control side and electrically connected to the first VS pad; and a first circuit unit connected to the plurality of pads to provide the high side gate signal through the first output pad.

    Abstract translation: 提供了适用于电感负载的栅极驱动电路,逆变器模块和逆变器装置。 栅极驱动器电路包括具有第一输出侧和第一控制侧并产生高侧栅极信号的高侧驱动器; 以及产生低侧栅极信号的低侧驱动器,其中所述高侧驱动器包括形成在所述第一输出侧的第一VS焊盘; 形成在第一输出侧的第一输出焊盘,形成在第一控制侧的第一VB焊盘; 以及第二VB焊盘,其形成为与所述第一控制侧上的所述第一VB焊盘相邻并且电连接到所述第一VS焊盘; 以及连接到所述多个焊盘以通过所述第一输出焊盘提供所述高侧栅极信号的第一电路单元。

    MOBILE SYSTEM INCLUDING FIRMWARE VERIFICATION FUNCTION AND FIRMWARE UPDATE METHOD THEREOF
    13.
    发明申请
    MOBILE SYSTEM INCLUDING FIRMWARE VERIFICATION FUNCTION AND FIRMWARE UPDATE METHOD THEREOF 审中-公开
    包括固件功能的移动系统及其更新方法

    公开(公告)号:US20150261521A1

    公开(公告)日:2015-09-17

    申请号:US14644864

    申请日:2015-03-11

    Abstract: Provided are a method of updating firmware of a device, a device, and a mobile system including the device. The method includes: receiving, from a host, a first hash value and a signature, the first hash value corresponding to a firmware image at the host; performing a pre-verify operation for at least one of integrity verification and signature certification on the firmware image using the received first hash value and the received signature; receiving the firmware image from the host according to a result of the pre-verify operation; and obtaining a second hash value from the received firmware image to perform a post-verify operation for at least one of integrity verification and signature certification on the received firmware image.

    Abstract translation: 提供了一种更新设备,设备和包括该设备的移动系统的固件的方法。 该方法包括:从主机接收第一哈希值和签名,所述第一哈希值对应于所述主机处的固件图像; 使用所接收的第一哈希值和所接收的签名对所述固件图像上的完整性验证和签名认证中的至少一个进行预验证操作; 根据预验证操作的结果从主机接收固件图像; 以及从所接收的固件图像获得第二哈希值,以对所接收的固件图像进行完整性验证和签名认证中的至少一个执行后验证操作。

    INTERNAL VOLTAGE GENERATION CIRCUIT AND METHOD
    14.
    发明申请
    INTERNAL VOLTAGE GENERATION CIRCUIT AND METHOD 审中-公开
    内部电压发生电路及方法

    公开(公告)号:US20130093490A1

    公开(公告)日:2013-04-18

    申请号:US13333043

    申请日:2011-12-21

    CPC classification number: H02M3/07 H02M3/1584

    Abstract: An internal voltage generation method includes the steps of: setting first to third sections by using a reference voltage; determining to which section an internal voltage level corresponds, among the first to third sections; and generating the internal voltage by controlling a voltage pumping amount according to a section corresponding to the internal voltage level.

    Abstract translation: 内部电压产生方法包括以下步骤:通过使用参考电压来设置第一至第三部分; 在第一至第三部分中确定内部电压电平对应于哪个部分; 以及通过根据对应于内部电压电平的部分控制电压抽取量来产生内部电压。

    WI-FI SERVICE METHOD AND SYSTEM FOR WI-FI DEVICES
    15.
    发明申请
    WI-FI SERVICE METHOD AND SYSTEM FOR WI-FI DEVICES 有权
    用于WI-FI设备的WI-FI服务方法和系统

    公开(公告)号:US20110280233A1

    公开(公告)日:2011-11-17

    申请号:US13107489

    申请日:2011-05-13

    CPC classification number: H04W8/005 H04L63/0853 H04L63/20 H04W12/06

    Abstract: A Wireless-Fidelity (Wi-Fi) service method and system are provided. A beacon message and probe response message may contain a service information field storing device information. Wi-Fi devices can exchange information on supported functions with each other and one Wi-Fi device may identify functions supported by another Wi-Fi device. Hence, a Wi-Fi connection can be set up through automatic provisioning. The method includes receiving, by a first Wi-Fi device in non-Access Point (AP) mode, messages from nearby Wi-Fi devices operating in AP mode, analyzing a service information field of each received message, determining a second Wi-Fi device that is manufactured by the same manufacturer as the first Wi-Fi device and is capable of supporting a requested service, establishing a connection with the second Wi-Fi device through Wi-Fi Protected Setup (WPS) based on automatic provision, and sending data associated with the requested service to the second Wi-Fi device for a Wi-Fi service.

    Abstract translation: 提供无线保真(Wi-Fi)服务方法和系统。 信标消息和探测响应消息可以包含存储设备信息的服务信息字段。 Wi-Fi设备可以互相交换支持的功能信息,一个Wi-Fi设备可以识别另一个Wi-Fi设备支持的功能。 因此,可以通过自动配置设置Wi-Fi连接。 该方法包括以非接入点(AP)模式的第一Wi-Fi设备接收来自在AP模式下操作的附近Wi-Fi设备的消息,分析每个接收到的消息的服务信息字段,确定第二Wi-Fi 设备由与第一Wi-Fi设备相同的制造商制造并且能够支持所请求的服务,通过基于自动提供的Wi-Fi保护设置(WPS)建立与第二Wi-Fi设备的连接,以及发送 与针对Wi-Fi服务的第二Wi-Fi设备的所请求服务相关联的数据。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE
    16.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE 有权
    半导体发光器件封装

    公开(公告)号:US20160351767A1

    公开(公告)日:2016-12-01

    申请号:US15056117

    申请日:2016-02-29

    Abstract: A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.

    Abstract translation: 一种半导体发光器件封装,包括:发光结构,具有第一表面,与第一表面相对的第二表面和设置在第一和第二表面之间的侧表面,发光结构包括第一发光 层叠体和第二发光层叠体,第一发光层叠体和第二发光层叠体各自包括:第一导电型半导体层; 有源层和第二导电型半导体层,设置在发光结构的第二表面上并被配置为电连接第一和第二发光层压板的互连器; 围绕发光结构的侧表面的金属引导件; 以及围绕所述金属引导件和所述发光结构的所述第二侧面和所述侧表面的密封剂,并且暴露所述发光结构的所述第一表面。

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