摘要:
A via transmission line for a multilayer printed circuit board (PCB) in which a wave guiding channel is formed by a signal via or a number of signal vias, an assembly of ground vias surrounding the signal via or corresponding number of coupled signal vias, a set of ground plates from conductor layers of the multilayer PCB, and a clearance hole. In this via transmission line, the signal via, or the number of signal vias forms an inner conductive boundary, ground vias and ground plates from conductor layers of the multilayer PCB form an outer conductive boundary, and the clearance hole provides both isolation of the inner conductive boundary from the outer conductive boundary and high-performance broadband operation of the via transmission line by means of the predetermined clearance hole cross-sectional shape and dimensions where the cross-sectional shape of the clearance hole is defined by the arrangement of ground vias in the outer conductive boundary and dimensions of the clearance hole are determined according to a method to minimize frequency-dependent return losses caused by specific corrugations of the outer conductive boundary formed by ground plates in the wave guiding channel of the via transmission line.
摘要:
A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.
摘要:
In a semiconductor device including a semiconductor substrate, first and second external terminals, a first impurity diffusion region connected to the first external terminal, and second and third impurity diffusion regions forming a MIS transistor, one of the second and third impurity diffusion regions facing the first impurity region is connected to the second external terminal. The distance between the first diffusion region and the MIS transistor is substantially smaller than a certain value compared to conventional device.
摘要:
A semiconductor device according to this invention comprises a first power supply (Vcc) wiring, a second power supply (Gnd) wiring, a first, a second and a third protective elements (3-1, 3-2 and 3-3), a first connecting wiring which connects in common one ends of the first, the second and the third protective elements, a second connecting wiring which connects the other ends of the first, the second and the third protective elements, and a third connecting wiring which connects the first connecting wiring and the first power supply wiring. The third connecting wiring has a resistance which is higher than that of the first connecting wiring.
摘要:
An input/output protection device for protecting an internal circuit of an integrated circuit formed on a P-type substrate, from an electrostatic discharge (ESD), includes a thyristor connected between a terminal connected to the internal circuit and a common wiring conductor. The protection device comprises a N-well formed in the P-type substrate, a first P-type diffused region formed in the N-well and connected to the terminal, a first N-diffused region formed to adjoin the first N-well, a second P-type diffused region formed in close proximity to the first N-type diffused region, and a second N-type diffused region formed in the P-type substrate and connected to the common wiring conductor. An external resistor is connected between the first P-type diffused region and the first N-type diffused region, and another external resistor is connected between the second P-type diffused region and the second N-type diffused region. A diode is constituted of the first N-diffused region and the second P-type diffused region in close proximity to each other, so that the diode has a low parasitic resistance. Thus, when a negative electrostatic pulse is applied to the terminal, the diode allows a forward current to flow from the common wiring conductor to the terminal through a low impedance path including the first resistor, the diode and the second resistor.
摘要:
A dynamic random access memory comprises a p-type semiconductor substrate and a plurality of first n-type diffused regions embedded in the substrate so that they extend along a first axis of the substrate parallel with first and second, opposed major surfaces of the substrate to form parallel bit lines. A matrix array of insulated gate electrodes extend along a second axis of the substrate normal to the first axis from the first major surface into the first n-type diffused regions, so that those of the insulated gate electrodes which are arranged along rows of the matrix are connected together by the parallel bit lines. Second n-type diffused regions are embedded in the substrate adjacent to the first major surface as well as to corresponding ones of the insulated gate electrodes. Parallel conductors extend along a third axis of the substrate for electrically connecting those of the gate electrodes which are arranged along columns of the matrix array to respective word lines, the third axis being perpendicular to both of the first and second axes. Capacitors are stacked on the insulated gate electrodes, respectively. Each of the capacitors has a cell electrode coupled to one of the second n-type diffused regions, a common electrode and a charge storage layer interposed therebetween.
摘要:
In a n-channel MOS transistor of LDD structure with sidewall spacers, a p-type diffusion layer is formed to be on the surface of a n.sup.- drain layer just underneath the sidewall spacer and to be separated from the channel region. The low impurity concentration drain layer therefore becomes separated from the sidewall spacer, and thus degradation incident to LDD due to injection of hot carriers into the sidewall spacer can be prevented.
摘要:
A process for producing a carbon nanotube resistor that is capable of providing a highly reliable resistor or fuse. The process comprises the step of introducing a carbon nanotube in a volatile solvent to a first concentration and conducting ultrasonic treatment thereof to thereby obtain an initial solution; the dilution step of stepwise diluting the initial solution with a volatile solvent under ultrasonication so as to adjust the same to a second concentration, thereby obtaining a coating solution; and the step of applying the coating solution between a first electrode and a second electrode, wherein the first concentration is 1(E10−4 g/ml or higher and the second concentration lower than 1(E10−5 g/ml.
摘要:
Provided is a variable capacitance device including a nanomaterial layer made of a plurality of kinds of nanomaterials having characteristics different from each other, a first conductive layer electrically connected to at least a part of the nanomaterial layer, and a second conductive layer facing the nanomaterial layer and the first conductive layer through an insulating film.
摘要:
According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.