公开(公告)号：US20230257636A1

公开(公告)日：2023-08-17

申请号：US18012852

申请日：2021-06-25

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J123/12 ,  C08K5/5415 ,  B32B7/12 ,  B32B17/10 ,  B32B27/20 ,  B32B37/12 ,  B32B27/32 ,  B32B37/06

CPC classification number: C09J123/12 ,  C08K5/5415 ,  B32B7/12 ,  B32B17/10 ,  B32B27/20 ,  B32B37/1284 ,  B32B27/32 ,  B32B37/06 ,  C08K2003/2296

Abstract: A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.

公开(公告)号：US20230142250A1

公开(公告)日：2023-05-11

申请号：US17915449

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Sou MIYATA

IPC: C09J7/35 ,  C09J11/04 ,  C09J5/06

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J5/06 ,  C09J2425/008 ,  C09J2433/008 ,  C09J2301/304 ,  C09J2301/408

Abstract: A bonding method using adhesive sheets respectively containing first and second thermoplastic resins. The volume content VA1 of the first thermoplastic resin in the adhesive sheet and the volume content VA2 of the second thermoplastic resin in the adhesive sheet are from 60 vol % to 100 vol %. Change rates Vx1 and Vx2 represented by formulae below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first adhesive layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second adhesive layer. The method includes applying a high-frequency wave to the adhesive sheets between adherends to bond them together,


Vx1={(VA1−VB1)/VA1}×100  (Numerical Formula 1)



Vx2={(VA2−VB2)/VA2}×100  (Numerical Formula 2).

公开(公告)号：US20230111471A1

公开(公告)日：2023-04-13

申请号：US17914251

申请日：2021-03-31

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J153/02 ,  C09J5/06 ,  C09J11/04 ,  C08K3/22

Abstract: A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

公开(公告)号：US20200010730A1

公开(公告)日：2020-01-09

申请号：US16484081

申请日：2018-02-08

Applicant: LINTEC Corporation

Inventor： Naoki TAYA ,  Masakazu ISHIKAWA

IPC: C09J7/35 ,  C09J123/08 ,  C09J123/12 ,  C09J123/26 ,  C09J5/06 ,  C09J11/04 ,  C08J7/18 ,  B29C65/04 ,  C08K3/013

Abstract: A dielectric welding film for welding a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including at least one resin selected from the group consisting of an olefin-vinyl acetate copolymer and a maleic anhydride-modified polyolefin, the olefin-vinyl acetate copolymer containing 2 mass % or more constituent unit derived from vinyl acetate.

公开(公告)号：US20190352546A1

公开(公告)日：2019-11-21

申请号：US16484425

申请日：2018-02-08

Applicant: LINTEC Corporation

Inventor： Naoki TAYA ,  Masakazu ISHIKAWA

IPC: C09J123/08 ,  C09J7/35 ,  C09J5/06 ,  C09J9/02

Abstract: A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %.

公开(公告)号：US20170121570A1

公开(公告)日：2017-05-04

申请号：US15318479

申请日：2014-06-18

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Yuki NITO ,  Yusuke MIYATAKE

IPC: C09J7/02 ,  B32B7/12 ,  H01L21/683 ,  B32B27/06

CPC classification number: B32B27/06 ,  B32B7/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/327 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/246 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/54 ,  B32B2307/58 ,  B32B2457/14 ,  C08L23/0869 ,  C09J7/29 ,  C09J2201/122 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2421/006 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2429/006 ,  C09J2431/006 ,  C09J2433/00 ,  C09J2433/006 ,  H01L21/6836 ,  H01L2221/68327 ,  C08L23/12

Abstract: A base film for dicing sheets includes the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film includes a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film is wound up. The second resin layer has a crystallinity of 28% to 45% The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film is 20% to 60%.

公开(公告)号：US20150348819A1

公开(公告)日：2015-12-03

申请号：US14654961

申请日：2013-10-09

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Masashi UEDA ,  Masaharu ITO

IPC: H01L21/683 ,  B32B27/30 ,  C08L23/12 ,  C08L47/00 ,  C08L23/06 ,  B32B27/08 ,  C08L45/00

CPC classification number: H01L21/6836 ,  B32B27/08 ,  B32B27/308 ,  B32B2307/54 ,  C08G2261/3324 ,  C08G2261/3325 ,  C08G2261/418 ,  C08G2261/724 ,  C08L23/06 ,  C08L23/12 ,  C08L45/00 ,  C08L47/00 ,  C09J7/24 ,  C09J7/29 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2433/006 ,  C09J2453/006 ,  H01L21/683 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68381 ,  Y10T428/28 ,  Y10T428/31913 ,  C08L65/00 ,  C08L53/02

Abstract: A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a norbornene-based resin (a1) that is a thermoplastic resin containing a structural unit derived from a norbornene-based compound; a styrene-based elastomer (a2); and an olefin-based thermoplastic resin (a3) other than the norbornene-based resin (a1) and other than the styrene-based elastomer (a2). The dicing sheet base film suppresses the occurrence of dicing debris, in particular filament-like dicing debris, during the dicing of a cut object without imparting physical energy such as electron rays and γ rays, and has sufficient expandability in the expanding process.

Abstract translation: 切割片基膜包括树脂层（A）。 树脂层（A）含有作为含有来自降冰片烯系化合物的结构单元的热塑性树脂的降冰片烯系树脂（a1） 苯乙烯类弹性体（a2）; 以及除了降冰片烯系树脂（a1）以外的烯烃类热塑性树脂（a3），而不是苯乙烯系弹性体（a2）。 切割片基膜在切割物体的切割期间抑制切割碎屑，特别是丝状切割碎屑的发生，而不会施加诸如电子射线和γ射线的物理能量，并且在膨胀过程中具有足够的可扩展性。

公开(公告)号：US20240392166A1

公开(公告)日：2024-11-28

申请号：US18696248

申请日：2022-09-21

Applicant: LINTEC Corporation

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J9/00 ,  C09J11/08

Abstract: A high-frequency dielectric heating adhesive contains a thermoplastic resin and a cyano group-containing organic compound, and the high-frequency dielectric heating adhesive satisfies (1) below: (1) the high-frequency dielectric heating adhesive has a total luminous transmittance of 50% or more as measured in accordance with JIS K 7361-1:1997.

公开(公告)号：US20220180773A1

公开(公告)日：2022-06-09

申请号：US17442752

申请日：2020-03-19

Applicant: LINTEC CORPORATION

Inventor： Yumiko AMINO ,  Naoki TAYA

IPC: G09F3/00 ,  C09J7/38 ,  C09J7/24 ,  G09F3/03 ,  G09F3/10

Abstract: The present invention relates to a peel detection label that is a laminate having a backing, a pattern layer formed on a part of a surface of the backing, and a pressure sensitive adhesive laminate in this order, the pressure sensitive adhesive laminate having at least an intermediate layer and a pressure sensitive adhesive layer, wherein a tensile modulus Et at 23° C. of the backing is 50 MPa or greater and 1000 MPa or less.

公开(公告)号：US20170036431A1

公开(公告)日：2017-02-09

申请号：US15125624

申请日：2015-03-11

Applicant: LINTEC CORPORATION

Inventor： Junichi NAKAMURA ,  Yusuke MIYATAKE ,  Naoki TAYA ,  Takeshi KONDO

IPC: B32B27/32 ,  B32B27/08 ,  C09J7/02 ,  B32B7/12

CPC classification number: B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B27/325 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/51 ,  B32B2307/54 ,  B32B2457/14 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2421/006 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2423/106

Abstract: Base film for a dicing sheet comprises a cutting-fragment suppression layer and an expandable layer laminated on one main surface of the cutting-fragment suppression layer. The expandable layer comprises at least one resin-based unit layer. The at least one resin-based unit layer includes a resin-based unit layer that is disposed nearest to the cutting-fragment suppression layer. The resin-based unit layer comprises a linear polyethylene, polypropylene, and thermoplastic elastomer. The cutting-fragment suppression layer comprises a ring-containing resin that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The base film for such a dicing sheet is excellent in the expandability and recoverability.

Abstract translation: 用于切割片的基底膜包括层压在切割片段抑制层的一个主表面上的切割片段抑制层和可扩展层。 可膨胀层包括至少一个基于树脂的单元层。 至少一个基于树脂的单元层包括最靠近切割片断抑制层设置的基于树脂的单元层。 树脂基单元层包含线性聚乙烯，聚丙烯和热塑性弹性体。 切割片抑制层包括含有环氧树脂，其为具有至少一种芳族系列基环和脂族系列基环的热塑性树脂和作为烯烃类热塑性塑料的非环状烯烃类树脂 除含环树脂以外的树脂。 用于这种切割片的基膜具有优异的可扩展性和可恢复性。