公开(公告)号：US20230074731A1

公开(公告)日：2023-03-09

申请号：US17929714

申请日：2022-09-05

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hsin-Lun SU ,  Min-Che TSAI ,  Jo-Hsiang CHEN

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/62

Abstract: A pixel unit includes a substrate, a wiring layer and three light-emitting elements. The wiring layer includes first electrode wires and second electrode wires. The first electrode wires and the second electrode wires are arranged side by side and separated from each other by a spacing. A first blocking wall structure is at a first end portion of each of the first electrode wires, the first end portion is near the corresponding second electrode wires, and a second blocking wall structure is at a second end portion of each of the second electrode wires, the second end portion is near the corresponding first electrode wires. Three light-emitting elements emit red light, green light and blue light respectively. The light-emitting elements are in a flip chip configuration and are connected to one of the first electrode wires and one of the second electrode wires adjacent to each other respectively.

公开(公告)号：US20220037569A1

公开(公告)日：2022-02-03

申请号：US16944131

申请日：2020-07-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US20210367113A1

公开(公告)日：2021-11-25

申请号：US16879787

申请日：2020-05-21

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hui-Ru WU ,  Jo-Hsiang CHEN ,  Jian-Chin LIANG ,  Ai-Sen LIU

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

公开(公告)号：US20240204159A1

公开(公告)日：2024-06-20

申请号：US18590915

申请日：2024-02-28

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/165 ,  H01L25/167 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

公开(公告)号：US20230261165A1

公开(公告)日：2023-08-17

申请号：US18303578

申请日：2023-04-20

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/0095 ,  H01L2933/0066 ,  H01L2933/0058

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

公开(公告)号：US20230070973A1

公开(公告)日：2023-03-09

申请号：US17939799

申请日：2022-09-07

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Wei-Yuan MA ,  Hui-Ru WU ,  Min-Che TSAI ,  Shiou-Yi KUO ,  Jian-Chin LIANG

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/00

Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

公开(公告)号：US20220190225A1

公开(公告)日：2022-06-16

申请号：US17653462

申请日：2022-03-03

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US20220093578A1

公开(公告)日：2022-03-24

申请号：US17313023

申请日：2021-05-06

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Chien-Nan YEH ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/60

Abstract: Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first and second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

公开(公告)号：US20140268877A1

公开(公告)日：2014-09-18

申请号：US14077655

申请日：2013-11-12

Applicant: Lextar Electronics Corporation

Inventor： Kuang-Neng YANG ,  Kun-Hua WU ,  Jo-Hsiang CHEN ,  Chih-Hao LIN ,  Che-Wei HSU ,  Tzong-Liang TSAI

IPC: H01L25/075 ,  F21V8/00

CPC classification number: H01L25/0753 ,  G02B6/0083 ,  H01L33/505 ,  H01L33/507 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connector. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors.

Abstract translation: 发光元件包括散热板，主体，多个LED芯片，第一连接器和第二连接器。 散热板包括芯片接合区域和与芯片接合区域相对的散热区域。 主体围绕散热板，并且包括与第一主体表面相对的第一主体表面和第二主体表面。 第一体表包括露出芯片接合区域的凹部。 第二体表面包括露出散热区域的开口。 LED芯片安装在芯片接合区域上。 第一和第二连接器设置在主体上，并且它们可以可插拔地连接到外部电源或其它连接器。 LED芯片连接到第一和第二连接器中的电输入端子。

公开(公告)号：US20240268019A1

公开(公告)日：2024-08-08

申请号：US18424225

申请日：2024-01-26

Applicant: Lextar Electronics Corporation

Inventor： Hsin-Lun SU ,  Jo-Hsiang CHEN ,  Chun-Min LIN

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/036 ,  H05K1/116 ,  H05K1/181 ,  H05K2201/0212 ,  H05K2201/10106

Abstract: A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.