Abstract:
A semiconductor optical amplifier (SOA) has an overall gain that is substantially polarization independent, i.e., less than 1 dB difference between transverse electric (TE) and transverse magnetic (TM) gain. The SOA includes a residual cladding layer having different thicknesses over different portions of the gain section. Over a first portion of the gain section, the residual cladding layer is thinner than over a second portion of the gain section. This results in the first portion providing more gain to optical energy having a TE polarization state than optical energy having a TM polarization state. In the second portion of the gain section, however, more gain is provided to optical energy having a TM polarization state than energy having a TE polarization state. The resulting gain differences can be designed to offset one another so that the output has a gain that is substantially polarization independent.
Abstract:
A semiconductor optical amplifier (SOA) with efficient current injection is described. Injection current density is controlled to be higher in some areas and lower in others to provide, e.g., improved saturation power and/or noise figure. Controlled injection current can be accomplished by varying the resistivity of the current injection electrode. This, in turn, can be accomplished by patterning openings in the dielectric layer above the current injection metallization in a manner which varies the series resistance along the length of the device.
Abstract:
A semiconductor optical amplifier (SOA) has an overall gain that is substantially polarization independent, i.e., less than 1 dB difference between transverse electric (TE) and transverse magnetic (TM) gain. The SOA includes gain and polarization rotation functions integrated onto a single substrate. According to one exemplary embodiment, a passive polarization rotation section is disposed between two active gain sections.
Abstract:
A resonant coupler has a coupling region having first and second ends, a coupling length, and a tapered variable width, such that a phase matching condition for the waveguide is met within the coupling length. In an exemplary embodiment the first and second ends each have a corresponding variable width which varies at a rate greater than the variable width of the coupling length. In yet another embodiment the coupling region has an electrically sensitive phase matching characteristic and an electrode in operative relation with the coupling region for varying the phase matching characteristic.
Abstract:
An array of bistable devices includes a thin cadmium sulfide platelet having a first portion thereof that is substantially pure and the remaining portion thereof is implanted with atoms that can bind excitons. Such remaining portion can be implanted with ions from a lithium source. Apparatus for providing such an array can include a source of lithium ions and masking means for selectively permitting and for selectively inhibiting passage of ions from the source to pass therethrough and to implant in a pattern onto the platelet. The apparatus operates at temperatures in the neighborhood of liquid helium. A method for producing such an array includes providing a thin, substantially pure, platelet of cadmium sulfide, selectively masking the platelet with a pattern to selectively permit and to selectively inhibit passage of ions onto the platelet, and providing a source of ions. The source of ions, in accordance with certain features, can be lithium ions.
Abstract:
A vehicle comprising a seat defining a driver seat portion and a passenger seat portion, an electronic stability system, adapted to receive inputs from a load sensor, a wheel rotation sensor and a lateral acceleration sensor, the electronic stability system adapted to provide outputs to at least one of the brake system for braking the vehicle, and the engine control unit to change the power output transmitted to the wheels by the engine, the electronic stability system using a first calibration to determine the outputs when the load sensor is in a non-loaded state and a second calibration to determine the outputs when the load sensor is in a loaded state.
Abstract:
A vehicle comprising a seat defining a driver seat portion and a passenger seat portion, an electronic stability system, adapted to receive inputs from a load sensor, a wheel rotation sensor and a lateral acceleration sensor, the electronic stability system adapted to provide outputs to at least one of the brake system for braking the vehicle, and the engine control unit to change the power output transmitted to the wheels by the engine, the electronic stability system using a first calibration to determine the outputs when the load sensor is in a non-loaded state and a second calibration to determine the outputs when the load sensor is in a loaded state.
Abstract:
A semiconductor optical amplifier (SOA) with efficient current injection is described. Injection current density is controlled to be higher in some areas and lower in others to provide, e.g., improved saturation power and/or noise figure. Controlled injection current can be accomplished by varying the resistivity of the current injection electrode. This, in turn, can be accomplished by patterning openings in the dielectric layer above the current injection metallization in a manner which varies the series resistance along the length of the device.
Abstract:
A semiconductor optical amplifier (SOA) with efficient current injection is described. Injection current density is controlled to be higher in some areas and lower in others to provide, e.g., improved saturation power and/or noise figure. Controlled injection current can be accomplished by varying the resistivity of the current injection electrode. This, in turn, can be accomplished by patterning openings in the dielectric layer above the current injection metallization in a manner which varies the series resistance along the length of the device.
Abstract:
A electroless plating method re-metallizes aluminum bond pads so that the re-metallized bond pads include layers of aluminum, zinc, nickel, and gold. The re-metallized bond pads are wire-bondable and solder wettable, and therefore can be flip-chip bonded. Applications include the realization of hybrid smart pixel arrays for optical interconnections, where an optical transmitter and optical detector are flip-chip bonded directly to respective CMOS driver chips.