公开(公告)号：US20100314611A1

公开(公告)日：2010-12-16

申请号：US12515585

申请日：2007-11-21

申请人： Masaki Murata ,  Nobuhide Yoneya ,  Norio Kimura

发明人： Masaki Murata ,  Nobuhide Yoneya ,  Norio Kimura

IPC分类号： H01L51/30 ,  B32B15/08 ,  C07D401/14 ,  C09D7/00

CPC分类号： H01L51/0095 ,  H01L51/0035 ,  H01L51/0083 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/105 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31692

摘要： A semiconductor device is provided and includes a field effect transistor having a gate electrode, a gate insulating layer, a channel forming region composed of an organic semiconductor material layer and a source/drain electrode made of a metal. A portion of the source/drain electrode in contact with the organic semiconductor material layer comprising the channel forming region is covered with an electrode coating material. Because the electrode coating material is composed of organic molecules having a functional group which can be bound to a metal ion and a functional group that binds to the source/drain electrode composed of the metal, low contact resistance and high mobility can be achieved.

摘要翻译： 提供一种半导体器件，并且包括具有栅电极，栅极绝缘层，由有机半导体材料层构成的沟道形成区域和由金属制成的源极/漏极电极的场效应晶体管。 与包含沟道形成区域的有机半导体材料层接触的源极/漏极电极的一部分被电极涂覆材料覆盖。 由于电极涂层材料由具有与金属离子结合的官能团的有机分子和与由金属构成的源/漏电极结合的官能团构成，所以可以实现低接触电阻和高迁移率。

公开(公告)号：US20080308995A1

公开(公告)日：2008-12-18

申请号：US12155426

申请日：2008-06-04

申请人： Hideki Tobinaga ,  Tatsuaki Nagano ,  Yasuo Kosuga ,  Norio Kimura ,  Takeshi Akai

发明人： Hideki Tobinaga ,  Tatsuaki Nagano ,  Yasuo Kosuga ,  Norio Kimura ,  Takeshi Akai

IPC分类号： B65H5/00

CPC分类号： G03G15/602 ,  G03G2215/00189

摘要： An automatic document feeder, included in an image reading system that can be included in an image forming apparatus, is configured to transfer an original document to an image reader included in the image reading system, and includes a first drive unit configured to include a first motor to drive the document separation and feed unit, a second drive unit configured to include a second motor to drive the document conveyance unit, a third drive unit configured to include a third motor to drive the document discharging unit, where at least two motors of the first, second, and third motors disposed in a substantially in-line arrangement, and a cooling member configured to supply a coolant to the at least two motors disposed in a substantially in-line arrangement, to the first, second, and third motors, in that order.

摘要翻译： 包括在可以包括在图像形成装置中的图像读取系统中的自动文件馈送器被配置为将原始文档传送到包括在图像读取系统中的图像读取器，并且包括第一驱动单元，其被配置为包括第一 电动机驱动文件分离和供给单元，第二驱动单元，被配置为包括驱动文件传送单元的第二电动机;第三驱动单元，被配置为包括第三电动机以驱动文件排出单元，其中至少两个电动机 第一，第二和第三电动机以大致一字排列的方式设置;以及冷却构件，其构造成将冷却剂以大致一字排列的方式设置在所述至少两个电动机上，所述至少两个电动机连接到所述第一，第二和第三电动机 ， 以该顺序。

公开(公告)号：US20070238395A1

公开(公告)日：2007-10-11

申请号：US11806581

申请日：2007-06-01

申请人： Norio Kimura ,  Tatsuya Kohama ,  Makoto Akagi

发明人： Norio Kimura ,  Tatsuya Kohama ,  Makoto Akagi

IPC分类号： B24B1/00 ,  B24B7/00

CPC分类号： H01L21/67051 ,  B24B37/042 ,  B24B49/006 ,  B24B49/16 ,  H01L21/02074 ,  H01L21/0209 ,  H01L21/3212 ,  H01L21/67046 ,  H01L21/7684

摘要： A substrate polishing apparatus wherein a semiconductor substrate is held by a top ring 10-2 or 11-2 and is pressed against a polishing surface of a polishing table 10-1 or 10-2. A surface to be polished of the semiconductor substrate is polished by a relative movement between the semiconductor substrate and the polishing surface. The apparatus includes a pressing force changing mechanism for changing a pressing force for pressing the semiconductor substrate, a relative movement seed changing mechanism for changing the number of revolutions of the top ring and/or the polishing table, and a control mechanism. The control mechanism performs the polishing through plural polishing processes on the polishing table 10-1 or 10-2 while changing the pressing force and the number of revolutions.

摘要翻译： 一种衬底抛光装置，其中半导体衬底由顶环10-2或11-2保持并且被压靠在抛光台10-1或10-2的抛光表面上。 通过半导体衬底和抛光表面之间的相对运动来抛光半导体衬底的待抛光表面。 该装置包括用于改变用于按压半导体衬底的按压力的按压力改变机构，用于改变顶环和/或抛光台的转数的相对运动种子改变机构和控制机构。 控制机构通过在研磨台10-1或10-2上进行多次研磨处理而进行研磨，同时改变按压力和转速。

公开(公告)号：US07169235B2

公开(公告)日：2007-01-30

申请号：US10844317

申请日：2004-05-13

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： C23G1/02

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US07108589B2

公开(公告)日：2006-09-19

申请号：US11187944

申请日：2005-07-25

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US20060027452A1

公开(公告)日：2006-02-09

申请号：US11235335

申请日：2005-09-27

申请人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

发明人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

IPC分类号： C25D5/02 ,  C25D17/00

CPC分类号： H01L21/67109 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67778 ,  H01L21/681

摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

摘要翻译： 基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。 基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人 底物处理单元。 装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。 装载/卸载单元具有可水平旋转的旋转台​​，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。

公开(公告)号：USRE38826E1

公开(公告)日：2005-10-11

申请号：US09589388

申请日：2000-06-08

申请人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

发明人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

IPC分类号： B24B37/30 ,  B24B49/16 ,  B24B1/00

CPC分类号： B24B37/30 ,  B24B49/16

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环，并且在第一次压制下将工件压靠在抛光表面上。 抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口，用于喷射从加压流体源供应的加压流体。 每个具有开口的多个区域被限定在保持表面上，使得加压流体可以选择性地从相应区域中的开口排出。

公开(公告)号：US06626736B2

公开(公告)日：2003-09-30

申请号：US09893625

申请日：2001-06-29

申请人： Manabu Tsujimura ,  Norio Kimura

发明人： Manabu Tsujimura ,  Norio Kimura

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B21/04 ,  B24B37/005 ,  B24B49/12

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面，并且允许抛光垫被自动更换，而不会停止抛光台的旋转或循环运动。 抛光装置包括用于进行旋转或循环运动的抛光台，可垂直移动地设置在抛光台上方的用于可移除地保持待抛光工件的顶环，可绕其自身轴线旋转并可与抛光台一起移动的一对辊 以及抛光垫，其被卷绕在其中一个辊上并且被供给到抛光台的上表面朝向另一个辊。

公开(公告)号：USRE38228E1

公开(公告)日：2003-08-19

申请号：US08789304

申请日：1997-01-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B37/26

摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

公开(公告)号：US06558229B2

公开(公告)日：2003-05-06

申请号：US09760823

申请日：2001-01-17

申请人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

发明人： Norio Kimura ,  Hideji Isobe ,  Kazuo Shimizu ,  Hiroyuki Osawa

IPC分类号： B24B4910

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/10 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

摘要翻译： 抛光装置用于抛光诸如半导体晶片的基板，并且具有能够连续地检测导电层的厚度的传感器。 抛光装置包括具有抛光表面的抛光台和用于将基板保持并压靠在抛光表面上以抛光基板的表面的顶环。 诸如涡电流传感器的传感器设置在抛光台的抛光表面下方，用于测量在基板表面上形成的导电层的厚度。