Abstract:
For localization of the defects on mask and wafers generated by particle occupation, electron-optical imaging methods have been developed where the subject to be examined is scanned with a focused electron beam. Since the signal-to-noise ratio needed for a reliable defect recognition limits the scan rate, the throughput of inspected subjects remains low. It is therefore proposed that the subject be scanned with a line-shaped electron probe and that the triggered secondary electons be imaged onto a detector with the assistance of an electron optics comprising an immersion lens, whereby one line element of the surface region illuminated by the electron probe is assigned to each detector element.
Abstract:
A method of testing conductor networks on printed circuit boards and wiring modules comprising charging various points on the conductor network with one or more charging beams while simultaneously irridating the conductor network with a large area holding beam which compensates for charge losses during the charge detecting period which determines whether shorts or open circuits occur in the network.
Abstract:
A detector for charged particles includes three grid electrodes arranged approximately parallel to the surface of a specimen and separated from one another by insulating spacers, as well as a charged particle sensitive part nearly completely covering the specimen. The particle sensitive part includes a plurality of rod shaped scintillators or light conductors lying at a high potential for post acceleration of secondary particles and lying in a plane approximately parallel to the surface of the specimen.
Abstract:
Methods and apparatus for determining whether a malfunctioning pixel in a large area substrate, such as a liquid crystal display (LCD) panel, is due to the pixel itself or to the driver circuit for that pixel and for localizing any driver circuit defects are provided. In an effort to localize the driver circuit defects, test pads coupled to the input and/or output of certain driver circuits may be fabricated on the substrate. The voltage or charge of these test pads may be detected using any suitable sensing device, such as an electron beam, an electro-optical sensor, or an electrode in close proximity to the surface of the pixels and/or drivers capacitively coupled to the pixel or driver. For some embodiments, the defective driver circuits may be repaired in the same area as the test area or may be transported via conveyor or robot to a separate repair station.
Abstract:
A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.
Abstract:
The present invention relates to a device for testing an optoelectronic module, comprising a first source for generating an electromagnetic beam or particle beam, a second source for illuminating the optoelectronic module; and a detector. In addition, a method for testing an optoelectronic module is provided comprising illuminating the optoelectronic module, directing an electromagnetic beam or particle beam and detecting defects in the optoelectronic module. The illumination additional to the electromagnetic beam or particle beam makes defects visible which otherwise would not be detected.
Abstract:
A sensing system includes a plurality of probes arranged in a spaced relation around a stage that is adapted to support a substrate. Each probe includes a detection portion adapted to move from a known starting position toward an edge of the substrate that is supported by the stage; detect the edge of the substrate while the substrate is supported by the stage; generate a detection signal following said detection; and stop moving toward the edge of the substrate following said detection. A controller may determine an edge position of the substrate relative to the stage based on the known starting position of each detection portion and based on the detection signal generated by each detection portion. Numerous other aspects are provided.
Abstract:
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.
Abstract:
An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays. The apparatus includes a prober assembly that is movable relative to the large area substrate and may be configured to test various patterns of displays and contact points. The prober assembly is also configured to test fractional sections of the large area substrate. The apparatus also includes a test chamber configured to store at least two prober assemblies within an interior volume.
Abstract:
An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.