公开(公告)号：US20240174849A1

公开(公告)日：2024-05-30

申请号：US18071629

申请日：2022-11-30

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L47/00 ,  C08J5/24

CPC classification number: C08L47/00 ,  C08J5/244 ,  C08J2347/00 ,  C08J2471/12

Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.

公开(公告)号：US20240174779A1

公开(公告)日：2024-05-30

申请号：US18149155

申请日：2023-01-03

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu ,  HungFan Lee

IPC: C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08F236/06 ,  C08G65/48 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5425 ,  C08K9/08

CPC classification number: C08F212/08 ,  C08F210/02 ,  C08F212/36 ,  C08F236/06 ,  C08G65/485 ,  C08K3/36 ,  C08K5/49 ,  C08K5/5425 ,  C08K9/08 ,  C08G2650/04 ,  C08K2201/003

Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.

公开(公告)号：US20240158632A1

公开(公告)日：2024-05-16

申请号：US18074526

申请日：2022-12-05

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L71/12

CPC classification number: C08L71/123 ,  C08L2205/03

Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

公开(公告)号：US20240101485A1

公开(公告)日：2024-03-28

申请号：US17987801

申请日：2022-11-15

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C04B35/628 ,  C08K5/5415

CPC classification number: C04B35/62849 ,  C04B35/62852 ,  C08K5/5415

Abstract: A powder composition includes a first powder, a second powder, and a modified functional group. A particle size range of the first powder is between 1 micron and 100 microns. The second powder and the modified functional group are modified on the first powder. A particle size range of the second powder is between 10 nanometers and 1 micron. A manufacturing method of a powder composition is also provided.

公开(公告)号：US11903127B2

公开(公告)日：2024-02-13

申请号：US17381201

申请日：2021-07-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/03 ,  B32B27/20 ,  B32B27/12 ,  B32B27/32

CPC classification number: H05K1/0366 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/101 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/301 ,  B32B2457/08 ,  H05K2201/015 ,  H05K2201/0275

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

公开(公告)号：US20230167298A1

公开(公告)日：2023-06-01

申请号：US17870818

申请日：2022-07-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Chien Kai Wei ,  Hung-Yi Chang

IPC: C08L75/04 ,  C08L45/00

CPC classification number: C08L75/04 ,  C08L45/00 ,  C08L2205/035 ,  C08L2312/00 ,  C08L2201/02

Abstract: A resin composition includes resin and inorganic filler. The resin includes CE resin and BMI resin, and a purity of the inorganic filler is at least greater than 99%.

公开(公告)号：US11051402B2

公开(公告)日：2021-06-29

申请号：US16664075

申请日：2019-10-25

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/05 ,  H05K1/03

Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 μm to 1 μm. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 μm and 100 μm.

公开(公告)号：US10781297B2

公开(公告)日：2020-09-22

申请号：US15834259

申请日：2017-12-07

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Ying-Te Huang ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08K5/5333 ,  H05K1/09 ,  C08K3/36 ,  C08J5/24 ,  B32B15/14 ,  B32B17/04 ,  B32B15/20 ,  C08L71/12 ,  C08K3/22 ,  C08K5/20 ,  C08K5/3492 ,  C08K5/52 ,  C08K3/26 ,  C08K5/523 ,  C08K5/02

Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.

公开(公告)号：US20250011528A1

公开(公告)日：2025-01-09

申请号：US18452572

申请日：2023-08-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hung-Yi Chang

IPC: C08G61/10 ,  C09D165/02

Abstract: A modified naphthol resin having a structure as shown in [Formula 3] is provided.

公开(公告)号：US20240417557A1

公开(公告)日：2024-12-19

申请号：US18357167

申请日：2023-07-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wei-Ru Huang ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L25/06 ,  C08K13/06 ,  C08L25/16 ,  C08L71/12

Abstract: The invention provides a resin composition that may effectively increase glass transition temperature while maintaining low-k electrical specification. The resin composition includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene, and ethylene, a second resin including a bismaleimide-modified polyphenylene ether resin, a divinylbenzene crosslinking agent, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent.