公开(公告)号：US09455383B2

公开(公告)日：2016-09-27

申请号：US13932096

申请日：2013-07-01

Applicant: NICHIA CORPORATION

Inventor： Kunihito Sugimoto ,  Keisuke Sejiki

IPC: H01L33/64 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.

Abstract translation: 一种模制包装，包括：模制树脂，具有用于容纳发光元件的凹部; 设置在所述凹部的底部的陶瓷基板，所述陶瓷基板具有从所述凹部的底部露出的一个表面，从所述模制树脂的后表面露出的另一个表面; 以及设置在所述模制树脂的下部的引线，所述发光元件安装在所述陶瓷基板的一个表面上，所述引线与所述陶瓷基板的至少一个侧表面接触以保持所述陶瓷基板。

公开(公告)号：US10367129B2

公开(公告)日：2019-07-30

申请号：US15620730

申请日：2017-06-12

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto

IPC: H01L25/16 ,  H01L27/15 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075

Abstract: A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.

公开(公告)号：US10283688B2

公开(公告)日：2019-05-07

申请号：US15680984

申请日：2017-08-18

Applicant: NICHIA CORPORATION

Inventor： Akira Goto ,  Kunihito Sugimoto

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  F21V19/00 ,  H01L25/075 ,  F21Y115/10

Abstract: A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.

公开(公告)号：US10186633B2

公开(公告)日：2019-01-22

申请号：US15683238

申请日：2017-08-22

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto ,  Kenji Ozeki ,  Shogo Abe

IPC: H01L33/20 ,  H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L25/16 ,  H01L33/54 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: forming a light-transmissive member that is substantially rectangular in a plan view to cover an upper surface of a light emitting element mounted on a base member; and forming a frame body so as to surround the light-transmissive member, wherein, in the step of forming the frame body, the frame body is formed such that a distance from an upper surface of the base member to an upper end of the frame body is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member.

公开(公告)号：US20180053886A1

公开(公告)日：2018-02-22

申请号：US15680984

申请日：2017-08-18

Applicant: Nichia Corporation

Inventor： Akira Goto ,  Kunihito Sugimoto

IPC: H01L33/64 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09 ,  F21V19/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/647 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/09636 ,  H05K2201/10106 ,  H05K2201/10674

Abstract: A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.