公开(公告)号：US20220158033A1

公开(公告)日：2022-05-19

申请号：US17525230

申请日：2021-11-12

Applicant: NICHIA CORPORATION

Inventor： Hirofumi NISHIYAMA ,  Shunsuke MINATO

IPC: H01L33/32 ,  H01L33/38 ,  H01L33/62 ,  H01L33/00

Abstract: A light emitting element includes a first light emitting portion and a second light emitting portion. The first light emitting portion includes a first stacked body having a first n-type layer, a first active layer, a first p-type layer, a first tunnel junction layer, and a second n-type layer. The second light emitting portion includes a second stacked body having a third n-type layer, a second p-type layer, a second tunnel junction layer, a fourth n-type layer, a second active layer, a third p-type layer, and a transmissive conductive film. A resistivity of the second n-type layer is higher than a resistivity of the transmissive conductive film. A thickness of the second n-type layer is larger than a thickness of the transmissive conductive film.

公开(公告)号：US20210187928A1

公开(公告)日：2021-06-24

申请号：US17197606

申请日：2021-03-10

Applicant: NICHIA CORPORATION

Inventor： Daisuke SANGA ,  Masatsugu ICHIKAWA ,  Shunsuke MINATO ,  Toru TAKASONE ,  Masahiko SANO

IPC: B32B38/00 ,  B32B37/02 ,  H01L33/58 ,  H01L33/60 ,  H01L33/00

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

公开(公告)号：US20170092813A1

公开(公告)日：2017-03-30

申请号：US15273713

申请日：2016-09-23

Applicant: NICHIA CORPORATION

Inventor： Shunsuke MINATO

IPC: H01L33/38 ,  H01L33/32 ,  H01L33/44 ,  H01L33/00

CPC classification number: H01L33/382 ,  H01L33/0075 ,  H01L33/32 ,  H01L33/44 ,  H01L2933/0016 ,  H01L2933/0025

Abstract: A method of producing a semiconductor light emitting element includes providing a semiconductor stack including a first semiconductor layer, an active layer, a second semiconductor layer, and a first insulating layer. An upper surface of the first insulating layer is partially covered with a mask. The semiconductor stack is etched to expose the first semiconductor layer in a region not covered by the mask. The mask is removed. A second insulating layer covering from the upper surface of the first insulating layer to an exposed region of the first semiconductor layer is provided. The second insulating layer is etched without masking to remove at least a portion of the second insulating layer covering the exposed region to expose the exposed region. A first conducting layer covering from the exposed region of the first semiconductor layer to a region above the upper surface of the first insulating layer is provided.

公开(公告)号：US20140124821A1

公开(公告)日：2014-05-08

申请号：US14072359

申请日：2013-11-05

Applicant: NICHIA CORPORATION

Inventor： Masakatsu TOMONARI ,  Toshiaki OGAWA ,  Shunsuke MINATO

IPC: H01L33/38

CPC classification number: H01L33/38 ,  H01L21/022 ,  H01L21/02304 ,  H01L21/28247 ,  H01L21/76841 ,  H01L23/28 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L24/26 ,  H01L33/42 ,  H01L33/44 ,  H01L2224/022 ,  H01L2224/8092 ,  H01L2924/01322 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A semiconductor light-emitting element capable of increasing a strength of adhesion between an electrode and a protection film.The semiconductor light-emitting element includes a semiconductor structure having an n-type semiconductor layer and a p-type semiconductor layer. A transparent conductive film is disposed on the p-type semiconductor layer. An insulation film is disposed on the transparent conductive film. A p-side electrode layer is disposed on the insulation film. A protection film is disposed over the insulation film, and the protection film covers part of the p-side electrode layer.

Abstract translation: 能够提高电极和保护膜之间的粘合强度的半导体发光元件。 半导体发光元件包括具有n型半导体层和p型半导体层的半导体结构。 透明导电膜设置在p型半导体层上。 绝缘膜设置在透明导电膜上。 p侧电极层设置在绝缘膜上。 保护膜设置在绝缘膜上，保护膜覆盖p侧电极层的一部分。

公开(公告)号：US20230343909A1

公开(公告)日：2023-10-26

申请号：US18344460

申请日：2023-06-29

Applicant: NICHIA CORPORATION

Inventor： Shunsuke MINATO ,  Masahiko SANO

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L33/44

Abstract: A light emitting apparatus includes: a mount substrate; one or more light emitting devices located above the mount substrate; a light conversion member located above the one or more light emitting devices; and a covering member that contains a light reflective material and covers the one or more light emitting devices. The light conversion member includes: a light emission surface facing upward, a lateral surface facing laterally, and a light receiving surface facing downward. The covering member covers the lateral surface of the light conversion member, and is interposed between the mount substrate and the one or more light emitting devices.

公开(公告)号：US20200180292A1

公开(公告)日：2020-06-11

申请号：US16795008

申请日：2020-02-19

Applicant: NICHIA CORPORATION

Inventor： Daisuke SANGA ,  Masatsugu ICHIKAWA ,  Shunsuke MINATO ,  Toru TAKASONE ,  Masahiko SANO

IPC: B32B38/00 ,  B32B37/02 ,  H01L33/00 ,  H01L33/58 ,  H01L33/60

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

公开(公告)号：US20200098960A1

公开(公告)日：2020-03-26

申请号：US16695511

申请日：2019-11-26

Applicant: NICHIA CORPORATION

Inventor： Shunsuke MINATO ,  Masahiko SANO

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/58 ,  H01L33/50

Abstract: A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.

公开(公告)号：US20180069164A1

公开(公告)日：2018-03-08

申请号：US15811622

申请日：2017-11-13

Applicant: NICHIA CORPORATION

Inventor： Shunsuke MINATO ,  Masahiko SANO

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/0568 ,  H01L2224/05684 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/013 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light emitting apparatus includes a mount substrate; two or more light emitting devices mounted on the mount substrate such that adjacent light emitting devices face each other at lateral surfaces thereof; a light transparent member positioned on upper surfaces of the light emitting devices, the light transparent member having a plate shape and being positioned to receive incident light emitted from the light emitting devices; and a covering member. In a plan view, the light transparent member is larger than each of the light emitting devices. The covering member contains a light reflective material and covers at least a lateral surface of the light transparent member.