公开(公告)号：US09461214B2

公开(公告)日：2016-10-04

申请号：US14554202

申请日：2014-11-26

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method for manufacturing a light emitting device, having; a die bonding step of mounting a light emitting element on a board; a phosphor layer formation step of forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the die bonding step; and a cover layer formation step of forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.

Abstract translation: 一种制造发光器件的方法，具有： 将发光元件安装在基板上的芯片接合工序; 荧光体层形成步骤，在晶片接合步骤之后，通过喷涂在所述基板和所述发光元件的表面上形成含有荧光体的荧光体层; 以及覆盖层形成步骤，在所述基板上的所述荧光体层的表面上形成包含至少一种类型的光反射材料和遮光材料的覆盖层。

公开(公告)号：US11211521B2

公开(公告)日：2021-12-28

申请号：US16897443

申请日：2020-06-10

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu

IPC: H01L33/00 ,  H01L21/66 ,  H01L33/50

Abstract: A method of manufacturing a light-emitting device 1 includes a step of providing first phosphor sheets 11, a step of providing second phosphor sheets 12, a step of providing a light-emitting element 13, a selection step of selecting a combination of one of the first phosphor sheets 11 and one of the second phosphor sheets 12 on the basis of a wavelength conversion characteristic of each of the first phosphor sheets 11 and a wavelength conversion characteristic of each of the second phosphor sheets 12, a step of obtaining a plurality of first phosphor pieces 11c and a plurality of second phosphor pieces 12c from the selected first phosphor sheet 11 and the selected second phosphor sheet 12, and a step of disposing one of the first phosphor pieces 11c and one of the second phosphor pieces 12c on or above the light-emitting element 13.

公开(公告)号：US10825967B2

公开(公告)日：2020-11-03

申请号：US16447935

申请日：2019-06-20

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Teruhito Azuma ,  Suguru Beppu ,  Kunihiro Izuno ,  Tsuyoshi Okahisa

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60

Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

公开(公告)号：US10600942B2

公开(公告)日：2020-03-24

申请号：US16218292

申请日：2018-12-12

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US10381525B2

公开(公告)日：2019-08-13

申请号：US16158080

申请日：2018-10-11

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu

IPC: H01L21/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element on a board; forming a cover layer that contains light reflecting material at a place on the board where the light emitting element is not positioned after the mounting of the light emitting element; and forming a phosphor layer that contains a phosphor by spraying on surfaces of the light emitting element and the cover layer after the forming of the cover layer.

公开(公告)号：US10128416B2

公开(公告)日：2018-11-13

申请号：US15259691

申请日：2016-09-08

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu

IPC: H01L21/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62

Abstract: A method for manufacturing a light emitting device, having mounting a light emitting element on a board, forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the mounting of the light emitting element; and forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.

公开(公告)号：US09978914B2

公开(公告)日：2018-05-22

申请号：US15149640

申请日：2016-05-09

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu

IPC: H01L29/22 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light emitting device includes a board, a light emitting element, a phosphor layer and a cover layer. The light emitting element is mounted on the board. The phosphor layer is in a substantially uniform thickness composed of a plurality of layers formed on a surface of the light emitting element. The cover layer contains light reflecting material at a place on the board where the light emitting element is not mounted. The cover layer covers the phosphor layer.

公开(公告)号：US09735326B2

公开(公告)日：2017-08-15

申请号：US15257067

申请日：2016-09-06

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Suguru Beppu ,  Tatsuya Kanazawa ,  Yoichi Bando

IPC: H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L27/15

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.