公开(公告)号：US20220376466A1

公开(公告)日：2022-11-24

申请号：US17750732

申请日：2022-05-23

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/02315 ,  H01S5/02355 ,  H01S5/02345

Abstract: A light emitting device includes: at least one semiconductor laser element; a submount; and a base portion having a mounting surface. The submount includes: a first lateral face being located at a side of an exiting lateral surface of the semiconductor laser element, the first lateral face intersecting the upper face of the submount, and the first lateral face being above and separated from the mounting surface; a lower face being set back inside of the submount relative to an edge at which the upper face and the first lateral face intersect in a top view; and a second lateral face being located at the same side as the first lateral face and intersecting the lower face. A portion of a bonding material protrudes from the lower face and extends outward of an edge at which the lower face and the second lateral face intersect.

公开(公告)号：US20210167576A1

公开(公告)日：2021-06-03

申请号：US17108872

申请日：2020-12-01

Applicant: NICHIA CORPORATION

Inventor： Yoshihiro KIMURA ,  Tadaaki MIYATA

IPC: H01S5/0683 ,  H01S5/022 ,  H01S5/40

Abstract: A light source device includes: first and second laser diodes; a reflector having: first and second reflecting faces configured to reflect a portion of light from the respective first and second laser diodes and to transmit a portion of the light from the respective first and second laser diodes, and first and second exit faces configured to allow the portions of the light transmitted through the respective first and second reflecting faces to exit; and a photodetector including: first and second light receiving element configured to receive light exiting the first and second exit faces, respectively. The reflector is configured such that the light transmitted through the first reflecting face is hindered from exiting the second exit face and the light transmitted through the second reflecting face is hindered from exiting the first exit face.

公开(公告)号：US20180366903A1

公开(公告)日：2018-12-20

申请号：US16007964

申请日：2018-06-13

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/022

CPC classification number: H01S5/02292 ,  H01S5/0216 ,  H01S5/02216 ,  H01S5/02296

Abstract: A light source device includes: a base member; a semiconductor laser mounted on an upper surface of the base member; a lateral wall portion having: a lower surface facing the upper surface of the base member and being a non-reflecting surface, and a reflecting surface that reflects light emitted from the semiconductor laser, is connected to the lower surface of the lateral wall portion at a lower end portion of the reflecting surface, and is inclined with respect to the upper surface of the base member; a first bonding film that is a metal film disposed in a region on the upper surface of the base member facing the lower surface of the lateral wall portion; a second bonding film that is a metal film disposed on the lower surface of the lateral wall portion; and a metal bonding member fuse-bonded to the first bonding film and the second bonding film to each other. An end portion of the first bonding film at a reflecting-surface side and an end portion of the second bonding film at the reflecting-surface side are located separately from the lower end portion of the reflecting surface. A distance between the end portion of the first bonding film at the reflecting-surface side and the lower end portion of the reflecting surface is different from a distance between the end portion of the second bonding film at the reflecting-surface side and the lower end portion of the reflecting surface.

公开(公告)号：US20140183575A1

公开(公告)日：2014-07-03

申请号：US14141728

申请日：2013-12-27

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01L33/48

CPC classification number: H01L22/22 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/08 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K3/225 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2924/00

Abstract: The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains after removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.

Abstract translation: 发光装置具有安装在基板上的一个或多个布线图案上的多个发光元件。 替代有缺陷的元件的新的发光元件安装在安装有缺陷元件的相同布线图案上。 去除有缺陷的元件后残留的缺陷元件或痕迹被新的发光元件密封的相同密封构件密封。

公开(公告)号：US20140177220A1

公开(公告)日：2014-06-26

申请号：US14135625

申请日：2013-12-20

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: F21V21/00 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16225 ,  H05K1/141 ,  H05K1/181 ,  H05K3/225 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2203/176 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.

Abstract translation: 发光装置包括具有通孔的第一基板，布置在第一基板上的多个第一发光元件，附接到第一基板以覆盖第一基板的通孔的第二基板 衬底和布置在第二衬底上的第二发光元件，并且电连接到第一衬底的布线。

公开(公告)号：US20240204477A1

公开(公告)日：2024-06-20

申请号：US18555662

申请日：2022-02-25

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/024 ,  H01S5/02315 ,  H01S5/0237 ,  H01S5/042

CPC classification number: H01S5/02469 ,  H01S5/02315 ,  H01S5/0237 ,  H01S5/04256

Abstract: A light source device is provided with: a substrate having a support surface; a first sub-mount having a first upper surface and a first mounting surface opposing the support surface; one or more laser diodes positioned between the substrate and the first sub-mount and having a p-side electrode surface and an n-side electrode surface; a side wall section provided on the substrate, having a second upper surface and an inner wall surface, and defining by the inner wall surface a space in which the laser diode is housed; a heat dissipation member provided on the first sub-mount; and a metal member joined to the heat dissipation member and the second upper surface to seal the space. The height from the support surface to the first upper surface is different from the height from the support surface to the second upper surface. One of the p-side electrode surface and then-side electrode surface is directly or indirectly joined to the support surface. The other of the p-side electrode surface and the n-side electrode surface is joined to the first mounting surface.

公开(公告)号：US20220344903A1

公开(公告)日：2022-10-27

申请号：US17730101

申请日：2022-04-26

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/10 ,  H01S5/40

Abstract: A light emitting device includes: laser diodes (LDs); a planar lightwave circuit (PLC) including optical waveguides; and a lens. The optical waveguides include: a first optical waveguide to receive first light emitted from a first LD and to emit the first light from a first light-exiting end; and a second optical waveguide to receive second light emitted from a second LD and to emit the second light from a second light-exiting end. The first light-exiting end causes refraction such that the first light exits in a first direction. The second light-exiting end causes refraction such that the second light exits in a second direction. A distance from the first light-exiting end to the lens along the first direction is shorter than a distance from the second light-exiting end to the lens along the second direction.

公开(公告)号：US20210119409A1

公开(公告)日：2021-04-22

申请号：US17060881

申请日：2020-10-01

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/026 ,  H01S5/022 ,  H01S5/062

Abstract: A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; a glass cap secured to the substrate and covering the laser diode, the glass cap comprising a front glass wall configured to transmit the laser light that is emitted from the laser diode, the front glass wall having an incident surface on which the laser light is incident and an emission surface from which the laser light exits; and a photodetector directly or indirectly supported by the substrate and located outside of the glass cap. The photodetector is configured to detect light reflected at the front glass wall and is transmitted through the glass cap.

公开(公告)号：US20210091532A1

公开(公告)日：2021-03-25

申请号：US17021855

申请日：2020-09-15

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

IPC: H01S5/022 ,  C03C4/00 ,  C03C27/06

Abstract: A light source device includes: a laser diode; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode. The cap includes a first glass portion configured to transmit laser light that is emitted from the laser diode, and a second glass portion. At least one of the first glass portion and the second glass portion includes an alkaline glass region.
The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region.

公开(公告)号：US20190296520A1

公开(公告)日：2019-09-26

申请号：US16357910

申请日：2019-03-19

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/022 ,  G02B6/42 ,  H01S5/026 ,  G02F1/35 ,  G02F1/39 ,  H01L31/0232

Abstract: There is provided an optical module comprising a semiconductor laser element; and a planar lightwave circuit (PLC) in which a waveguide is formed on a substrate. A position of a light-emitting point of the semiconductor laser element is approximately aligned with a position of a core of the waveguide. In a plan view, a first line segment representing an emission surface of the semiconductor laser element and a second line segment corresponding to the first line segment and representing an incident surface of the waveguide are arranged oblique to each other, and the light-emitting point of the semiconductor laser element is disposed closer to an intersection point of an extension line of the first line segment and the second line segment or an extension line of the second line segment than a center of the first line segment.