公开(公告)号：US20180226550A1

公开(公告)日：2018-08-09

申请号：US15943432

申请日：2018-04-02

Applicant: NICHIA CORPORATION

Inventor： Masakazu SAKAMOTO ,  Yoshiki SATO ,  Yasuo KATO

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 μm to 0.5 μm.

公开(公告)号：US20170162766A1

公开(公告)日：2017-06-08

申请号：US15439948

申请日：2017-02-23

Applicant: NICHIA CORPORATION

Inventor： Yoshiki SATO

IPC: H01L33/56 ,  H01L33/50 ,  H01L33/54 ,  H01L33/44

CPC classification number: H01L33/56 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for producing a light emitting device includes spraying a resin mixture onto a light emitting element using a pulse spraying method to deposit the resin mixture on the light emitting element. The resin mixture includes a thixotropy imparting agent. The resin mixture is cured to form a light transmissive member via which light emitted from the light emitting element is to transmit to an outside of the light emitting device.

公开(公告)号：US20150159836A1

公开(公告)日：2015-06-11

申请号：US14590520

申请日：2015-01-06

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Takayoshi WAKAKI ,  Tadao HAYASHI ,  Yoshiki SATO ,  Daisuke OYAMATSU ,  Takafumi SUGIYAMA ,  Takao KOSUGI

IPC: F21V9/16 ,  F21K99/00 ,  C23C16/455 ,  F21V13/08

CPC classification number: F21V9/30 ,  B05D5/06 ,  C23C16/45525 ,  F21K9/60 ,  F21V7/00 ,  F21V13/08 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L31/055 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05B33/12 ,  Y02E10/52 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/24421 ,  H01L2924/00014

Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.

Abstract translation: 波长转换无机部件可以在基体上包括基体和无机粒子层。 无机粒子层可以包括被配置为吸收第一波长的光并发射与第一波长不同的第二波长的光的无机波长转换物质的粒子。 无机颗粒层可以包括多个颗粒的附聚物。 多个颗粒中的每一个与至少一个其它颗粒或基体接触。 覆盖层包括无机材料，并且覆盖层连续地覆盖基体的表面和颗粒的表面。 无机颗粒层具有由颗粒包围的空隙，或由颗粒和基体和覆盖层之一组成的间隙。

公开(公告)号：US20140369052A1

公开(公告)日：2014-12-18

申请号：US14299065

申请日：2014-06-09

Applicant: NICHIA CORPORATION

Inventor： Yukiko OSHIMA ,  Yoshiki SATO ,  Toshiyuki OKAZAKI ,  Takayoshi WAKAKI

IPC: F21V15/01

CPC classification number: H01L33/44 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y10T29/49002

Abstract: A light emitting device has a light emitting element, a package, a lead, and a cover film. The package is arranged to form at least part of an inner peripheral face of a recess portion. The light emitting element is housed in the recess portion. The lead is disposed on a bottom face of the recess portion. The lead is electrically connected to the light emitting element. The cover film is arranged to cover the inner peripheral face of the recess portion. The cover film has light transmissive and electrical insulation. The package includes a base material and a plurality of particles. The base material includes a resin. A coefficient of thermal expansion of the particles is different from a coefficient of thermal expansion of the base material. The particles are disposed at least near the inner peripheral face of the recess portion.

Abstract translation: 发光器件具有发光元件，封装，引线和覆盖膜。 所述包装被配置成形成凹部的内周面的至少一部分。 发光元件容纳在凹部中。 引线设置在凹部的底面上。 引线电连接到发光元件。 盖膜布置成覆盖凹部的内周面。 覆盖膜具有透光和电绝缘。 包装包括基材和多个颗粒。 基材包括树脂。 颗粒的热膨胀系数与基材的热膨胀系数不同。 颗粒至少设置在凹部的内周面附近。