公开(公告)号：US20180134473A1

公开(公告)日：2018-05-17

申请号：US15352214

申请日：2016-11-15

Applicant: NXP B.V.

Inventor： Jeroen Johannes Maria Zaal ,  Roelf Anco Jacob Groenhuis ,  Leo van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx

IPC: B65D73/02 ,  H01L21/683 ,  H01L23/06 ,  H01L23/053

CPC classification number: B65D73/02 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/053 ,  H01L23/06 ,  H01L2221/68309 ,  H01L2221/68313

Abstract: One example discloses a component carrier, including: a cavity; wherein the cavity includes a set of cavity registration features configured to engage with a set of component registration features on a component; and wherein the cavity registration features are within the cavity.

公开(公告)号：US09466585B1

公开(公告)日：2016-10-11

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/304 ,  H01L21/78 ,  H01L21/683 ,  H01L21/3065

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20160276306A1

公开(公告)日：2016-09-22

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/683 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US09418918B2

公开(公告)日：2016-08-16

申请号：US14667979

申请日：2015-03-25

Applicant: NXP B.V.

Inventor： Roelf Anco Jacob Groenhuis ,  Tim Boettcher

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49524 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/352 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37639 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/84801 ,  H01L2924/00014

Abstract: There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die.

Abstract translation: 公开了一种用于连接到半导体器件裸片的引线，该引线包括夹持部分。 夹持部分包括具有从其延伸的两个或更多个突起的主表面，用于连接到半导体器件裸片的接合焊盘。

公开(公告)号：US09263335B2

公开(公告)日：2016-02-16

申请号：US14607587

申请日：2015-01-28

Applicant: NXP B.V.

Inventor： Tim Boettcher ,  Sven Walczyk ,  Roelf Anco Jacob Groenhuis ,  Rolf Brenner ,  Emiel De Bruin

IPC: H01L21/00 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/05016 ,  H01L2224/05088 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/20 ,  H01L2224/291 ,  H01L2224/32105 ,  H01L2224/32113 ,  H01L2224/32237 ,  H01L2224/33181 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2224/05552

Abstract: Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.

公开(公告)号：US20150287666A1

公开(公告)日：2015-10-08

申请号：US14667979

申请日：2015-03-25

Applicant: NXP B.V.

Inventor： Roelf Anco Jacob Groenhuis ,  Tim Boettcher

IPC: H01L23/495

CPC classification number: H01L23/49524 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/352 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37639 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/84801 ,  H01L2924/00014

Abstract: There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die.

Abstract translation: 公开了一种用于连接到半导体器件裸片的引线，该引线包括夹持部分。 夹持部分包括具有从其延伸的两个或更多个突起的主表面，用于连接到半导体器件裸片的接合焊盘。