摘要:
Disclosed is a semiconductor storage device comprising a semiconductor substrate, a first and a second impurity diffusion layer formed in the semiconductor substrate, a gate insulating film formed on the semiconductor substrate, and a first gate electrode formed on the semiconductor substrate via the gate insulating film. The gate insulating film has a nitrogen-containing silicon oxide film inside, and a silicon oxide film is so arranged on both sides of the nitrogen-containing silicon oxide film as to sandwich the nitrogen-containing silicon oxide film. In addition, the nitrogen composition in the nitrogen-containing silicon oxide film is increased from the semiconductor substrate side to the first gate electrode side.
摘要:
A variable resistance memory device includes upper interconnections on a substrate, first and second word lines provided between the substrate and the upper interconnections and vertically spaced apart from each other, a first bit line disposed between the first and second word lines and intersecting the first and second word lines, memory cells provided in an intersecting region of the first word line and the first bit line and an intersecting region of the second word line and the first bit line, a first word line contact directly connecting the first word line to a corresponding one of the upper interconnections, and a second word line contact directly connecting the second word line to a corresponding one of the upper interconnections.
摘要:
A semiconductor storage device is provided for solving the problem of the inability to simultaneously realize high reliability and decreased cell area. A selection electrode (106) is formed to sandwich an insulating film (105) with a p-type semiconductor region (102). A first n-type semiconductor region (103) and a second n-type semiconductor region (104) are formed in the p-type semiconductor region (102) at two sides of the selection electrode (106). A first resistance-changing layer (107) is connected to the first n-type semiconductor region (103), and a second resistance-changing layer (109) is connected to the second n-type semiconductor region (104). In addition, a first wiring layer (108) is connected to the second resistance-changing layer (109), and a second wiring layer (110) is connected to the second resistance-changing layer (109).
摘要:
In a case of writing to a trap type non-volatile memory cell that includes: a laminated insulating film, containing a charge accumulation layer, that is formed on a semiconductor substrate where source, drain and well regions are formed; and a first gate electrode formed on the laminated insulating film, charge injections that are carried on a single memory node multiple times under two or more different writing conditions, the writing condition is a combination of a well voltage applied to the well, a drain voltage applied to the drain and a gate voltage is applied to the first gate. Thereby, it is possible to form a trapezoid-shaped electron distribution in the charge accumulation layer, and thus prevent the charge retention characteristic from deteriorating.
摘要:
In a case where a DRAM and a ReRAM are mounted together, a manufacturing cost thereof is reduced while maintaining performance of a capacitance element and a variable resistance element. A semiconductor memory device includes a variable resistance element and a capacitance element. The variable resistance element has a cylinder type MIM structure with a first depth, and is designed for a variable resistance type memory. The capacitance element has a cylinder type MIM structure with a second depth deeper than the first depth, and is designed for a DRAM.
摘要:
A semiconductor device includes at least first and second electrodes, and a layer including a transition metal oxide layer sandwiched between the first and second electrodes. The transition metal oxide layer includes first and second transition metal oxide layers formed of different first and second transition metals, respectively. The first transition metal oxide layer is provided on the first electrode side, the second transition metal oxide layer is provided on the second electrode side, the first transition metal oxide layer and the second transition metal oxide layer are in contact with each other, the first transition metal oxide layer has an oxygen concentration gradient from the interface between the first transition metal oxide layer and the second transition metal oxide layer toward the first electrode side, and the oxygen concentration at the interface is greater than the oxygen concentration on the first electrode side.
摘要:
Provided is a semiconductor device including: source-drain regions formed on a silicon substrate with a channel forming region sandwiched therebetween; a word gate electrode formed on the channel forming region via a word gate insulating film not including a charge storage layer; a control gate formed on the silicon substrate on one side of the word gate electrode via a trap insulating film including a charge storage layer; and a control gate formed on the silicon substrate on the other side of the word gate electrode via a trap insulating film including a charge storage layer. A bottom of the word gate electrode is made to be higher than the control gate and a bottom of the control gate, and a level difference between the bottoms of the electrodes is made to be larger than a physical film thickness of the word gate insulating film.
摘要:
Disclosed is a resistance change type nonvolatile memory that has an insulation film structure, is advantageous for the implementation of high integration, and achieves a stable switching characteristic, and a manufacturing method therefor. The memory includes at least an MIM (Metal/Insulator/Metal) structure including an insulation film (2) sandwiched between metal electrodes (1) and (3), and the insulation film (2) includes a laminated structure including a Ta2O5 film and a TiO2 film with a thickness of less than 30 nm. The Ta2O5 film is a stoichiometric amorphous film.
摘要翻译:公开了具有绝缘膜结构的电阻变化型非易失性存储器,有利于实现高集成度,并实现稳定的开关特性及其制造方法。 存储器至少包括夹在金属电极(1)和(3)之间的绝缘膜(2)的MIM(金属/绝缘体/金属)结构,绝缘膜(2)包括层叠结构,其包括Ta 2 O 5膜和 厚度小于30nm的TiO 2膜。 Ta2O5膜是化学计量的非晶膜。
摘要:
There is provided a trap memory device suppresses electric charges from flowing from the outside into a charge accumulation region and accumulated electric charges from diffusing to the outside or flowing out due to a defect. A gate conductor 6 is formed through a laminate insulating film including a first gate insulating film 3, a charge accumulation layer 4 and a second gate insulating film 5 on a silicon substrate 1. The laminate insulating film (3 to 5) projects outside the gate conductor 6 and extends to under the outer end of a side wall 8. The charge accumulation layer 4 includes a high trap surface-density region 4a immediately under the gate conductor and a low trap surface-density region 4b outside the gate conductor.
摘要:
The present invention provides an interconnection area decision processor for deciding vertical widths of areas employed for interconnection of a gate array. The interconnection area decision processor predicts which interconnection area each signal net passes on the basis of previously created data on cell arrangement and data on arrangement of transistor rows on a chip to estimate interconnection congestion per channel on the basis of the result of prediction and decide the number of transistor rows to be assigned to each channel on the basis of the estimated interconnection congestion, thereby to create data on the vertical width of each channel. Thus, density of integration can be improved by increasing the number of tracks of channels having large numbers of interconnections and decreasing the number of tracks of channels having small numbers of interconnections.