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公开(公告)号：US11496614B2
公开(公告)日：2022-11-08
申请号：US17197922
申请日：2021-03-10
Inventor： Hideyo Fukushima , Masayoshi Ohtani , Taichi Nakamura
Abstract: A hands-free apparatus includes a memory and a hardware processor coupled to the memory. The hardware processor is configured to: connect to a mobile phone to enable a hands-free telephone conversation; receive at least one data of outgoing call history data, incoming call history data, missed call history data, and phonebook data stored in the mobile phone; and execute synchronization permission checking processing to check whether transfer of the at least one data is permitted in the mobile phone before receiving the at least one data from the mobile phone.
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12.发明授权公开(公告)号：US11230475B2
公开(公告)日：2022-01-25
申请号：US16072487
申请日：2017-01-24
Inventor： Takashi Kubo , Taichi Nakamura , Shigeaki Sakatani
IPC: C01B33/159 , D06M11/79 , C01B33/157 , C01B33/146 , C07F7/08
Abstract: A hydrophobic treatment method is used in which at least one sheet filled with a gelled silicic acid is tilted at least two degrees with respect to a horizontal direction in a hydrophobizing solution, and the gelled silicic acid is hydrophobized. A manufacturing method for a sheet-like member is also used. The manufacturing method includes: a sol preparing step of adjusting the pH of a water glass aqueous solution to obtain a sol solution of silicic acid; an adding step of adding the sol solution to a fiber; a gel step of polymerizing and gelling the sol solution; a hydrophobic treatment step of hydrophobizing the gel with the hydrophobic treatment method; and a drying step of drying the hydrophobized gel.
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Patent Agency Ranking
公开(公告)号：US10174441B2
公开(公告)日：2019-01-08
申请号：US15178815
申请日：2016-06-10
Inventor： Taichi Nakamura , Takayoshi Yamaguchi , Hiroto Sumida , Takahiro Kurokawa , Takatoshi Mitsushima
IPC: B01D53/22 , D01D5/00 , B32B5/02 , B32B5/26 , B01D39/16 , B01D39/20 , B32B5/08 , B32B7/02 , B32B7/12
Abstract: A laminated nonwoven fabric (NF) includes a first NF containing first fibers and a second NF containing second fibers and laminated on the first NF, and has a cut-off edge at an end thereof. An average diameter of the first fibers is larger than that of the second fibers not more than 3 μm. 50% by mass to 70% by mass, inclusive, of the second fibers satisfy x≥y, and 5% by mass to 30% by mass, inclusive, thereof satisfy x
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公开(公告)号：US10068869B2
公开(公告)日：2018-09-04
申请号：US14880942
申请日：2015-10-12
Inventor： Kiyohiro Hine , Akio Furusawa , Masato Mori , Taichi Nakamura , Hidetoshi Kitaura
Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
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公开(公告)号：US09707737B2
公开(公告)日：2017-07-18
申请号：US14885527
申请日：2015-10-16
Inventor： Taichi Nakamura , Shigeaki Sakatani
IPC: B32B9/00 , B32B5/22 , G06F1/20 , B32B5/14 , B32B7/04 , B32B5/02 , B32B27/28 , B32B27/32 , B32B27/36 , B32B9/04 , B32B27/12
CPC classification number: B32B9/007 , B32B5/022 , B32B5/142 , B32B5/22 , B32B7/045 , B32B9/04 , B32B9/045 , B32B9/047 , B32B27/12 , B32B27/281 , B32B27/32 , B32B27/36 , B32B2250/04 , B32B2250/44 , B32B2260/021 , B32B2260/04 , B32B2262/0253 , B32B2262/0269 , B32B2262/0276 , B32B2262/0284 , B32B2262/101 , B32B2262/108 , B32B2307/102 , B32B2307/202 , B32B2307/302 , B32B2307/304 , B32B2307/306 , B32B2307/3065 , B32B2307/7265 , B32B2457/00 , G06F1/203
Abstract: A composite material includes: a heat dissipation sheet; a heat insulation material that is placed on one surface of the heat dissipation sheet; and a support layer that is placed on at least one of the other surface of the heat dissipation sheet and the other surface of the heat insulation material, wherein silica aerogel is included between fibers in an inner region of the heat insulation material, an outer peripheral region of the heat insulation material includes the fibers, and the heat dissipation sheet and the heat insulation material are fixed onto each other through the fibers. Furthermore, provided is an electronic apparatus, including a heat generating component; and the above composite material, wherein the composite material is placed between the housing and the heat generating component.
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公开(公告)号：US10328665B2
公开(公告)日：2019-06-25
申请号：US15372794
申请日：2016-12-08
Inventor： Taichi Nakamura , Takayoshi Yamaguchi , Hiroto Sumida
Abstract: A nonwoven fabric contains a plurality of fibers having average fiber diameter Dave in a range from 10 nm to 3 μm, inclusive. The nonwoven fabric has a plurality of fusion portions among the plurality of fibers. The nonwoven fabric has a first principal surface and a second principal surface on an opposite side to the first principal surface. Average number Nh of the fusion portions observed per 500 μm2 on the first principal surface is six or more.
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公开(公告)号：US09789569B2
公开(公告)日：2017-10-17
申请号：US14920772
申请日：2015-10-22
Inventor： Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0
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