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    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    11.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180019383A1

    公开(公告)日：2018-01-18

    申请号：US15643136

    申请日：2017-07-06

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA ,  Tomoichiro TOYAMA

    IPC: H01L33/52 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H01L33/52 ,  H01L33/005 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2933/005

    Abstract: A semiconductor light-emitting device includes a base, a light-emitting element and a sealing resin. The base includes an obverse surface and a reverse surface spaced in a first direction, first side surfaces spaced in a second direction crossing the first direction, and second side surfaces spaced in a third direction crossing the first and second directions. The light-emitting element is on the base obverse surface. The sealing resin for covering the light-emitting element is smaller than the base in plan. The base has a wiring pattern connected to the light-emitting element and including an obverse surface electrode on the base obverse surface. The base also has a resist layer including a pattern-covering portion overlapping with the obverse surface electrode. The pattern-covering portion includes a resin outflow preventing portion, disposed outside the sealing resin in plan and extends continuously from one second side surface to the other.

    LED MODULE
    12.
    发明申请
    LED MODULE 有权

    公开(公告)号：US20170345800A1

    公开(公告)日：2017-11-30

    申请号：US15486834

    申请日：2017-04-13

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA

    IPC: H01L25/075 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L23/4824 ,  H01L23/49503 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/00014

    Abstract: An LED module includes: a substrate having a main surface and a back surface which face in opposite directions from each other in a thickness direction; a first LED chip including a first electrode pad bonded to a surface facing the same direction as the main surface; a first wire having one end bonded to the first electrode pad; and a wiring pattern having a main surface electrode formed in the main surface, wherein the main surface electrode includes a first die pad portion which supports the first LED chip, and when viewed from the thickness direction, the first die pad portion includes a main pad portion to which the first LED chip is bonded and an auxiliary pad portion which protrudes from the main pad portion in a direction toward a position of the first electrode pad from the center position in the first LED chip.

    LED MODULE
    15.
    发明申请
    LED MODULE 审中-公开
    LED模块

    公开(公告)号：US20150311184A1

    公开(公告)日：2015-10-29

    申请号：US14793092

    申请日：2015-07-07

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA ,  Hidekazu TODA

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00

    Abstract: An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LED chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with a bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.

    Abstract translation: LED模块100包括彼此间隔开的LED芯片21,22，以及LED芯片23，其偏离连接LED芯片21和22的直线，并且位于LED芯片21,22之间，LED芯片 21,22间隔开。 模块还包括具有接合部分31a和安装端子表面31d的引线31，具有接合部分32a和安装端子表面32d的引线32以及具有接合部分33a和安装端子表面33d的引线33。 安装端子表面31d，32d，33d彼此齐平。 来自LED芯片21,22,23的光沿安装端子面31d，32d，33d延伸的方向发射。 因此，可以从紧凑的LED模块发射适当混合的不同颜色的光。

    LED MODULE AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    LED MODULE AND METHOD OF MANUFACTURING THE SAME 有权
    LED模块及其制造方法

    公开(公告)号：US20140340887A1

    公开(公告)日：2014-11-20

    申请号：US14275191

    申请日：2014-05-12

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA

    IPC: F21V23/00 ,  H01L25/075 ,  F21K99/00

    CPC classification number: H01L27/0248 ,  H01L25/0753 ,  H01L25/167 ,  H01L29/866 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A compact LED module and a method of manufacturing such an LED module are provided. The LED module includes a first-pole first lead, a first-pole second lead, a first-pole third lead, a second-pole first lead, a second-pole second lead, a second-pole third lead, a first LED chip, a second LED chip, a third LED chip, and a housing. A distal end of the first-pole first lead is offset toward a second-pole side in a first direction with respect to both a distal end of the second-pole second lead and a distal end of the second-pole third lead.

    Abstract translation: 提供了紧凑的LED模块和制造这种LED模块的方法。 LED模块包括第一极第一引线，第一极第二引线，第一极第三引线，第二极第一引线，第二极第二引线，第二极第三引线，第一LED芯片 ，第二LED芯片，第三LED芯片和壳体。 第一极第一引线的远端相对于第二极第二引线的远端和第二极第三引线的远端在第一方向朝向第二极侧偏移。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    17.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
    半导体发光器件

    公开(公告)号：US20140167233A1

    公开(公告)日：2014-06-19

    申请号：US14184173

    申请日：2014-02-19

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA

    IPC: H01L23/495

    CPC classification number: H01L33/62 ,  H01L23/49541 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. (FIG. 1)

    Abstract translation: 半导体发光装置包括引线框架，安装在接合区域的顶表面上的半导体发光元件和引线框架的覆盖部分的壳体。 接合区域的底面暴露于外壳外。 引线框架包括从接合区域延伸的薄延伸部，并且具有与接合区域的顶表面齐平的顶表面。 薄延伸部具有从接合区域的底面向接合区域的上表面偏移的底面。 （图。1）

    LED MODULE
    19.
    发明申请
    LED MODULE 审中-公开

    公开(公告)号：US20200343415A1

    公开(公告)日：2020-10-29

    申请号：US16926940

    申请日：2020-07-13

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA

    IPC: H01L33/44 ,  H01L33/60

    Abstract: An LED module 101 is provided with an LED chip 200 that includes a sub-mount substrate 210 made of Si and a semiconductor layer 220 laminated on the sub-mount substrate 210. The module also includes white resin 280 that does not transmit light from the semiconductor layer 220 and that covers at least part of a side of the sub-mount substrate 210, where the side is connected to the surface on which the semiconductor layer 220 is laminated. These arrangements enhance the brightness of the LED module 101.

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