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公开(公告)号：US11495474B2
公开(公告)日：2022-11-08
申请号：US17026389
申请日：2020-09-21
Applicant: SEMES CO., LTD.
Inventor： Yong Hee Lee , Young Hun Lee , Jinwoo Jung , Eui Sang Lim
IPC: H01L21/02 , H01L21/67 , H01L21/687
Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
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公开(公告)号：US20160133454A1
公开(公告)日：2016-05-12
申请号：US14934200
申请日：2015-11-06
Applicant: Semes Co., Ltd.
Inventor： Young Hun Lee , Eui Sang Lim , Jae Myoung Lee
CPC classification number: B08B7/0021 , H01L21/02057 , H01L21/02101 , H01L21/67028 , H01L21/67051 , H01L21/67069
Abstract: Disclosed are systems and methods for treating a substrate. The method may include supplying supercritical carbon dioxide into a chamber to treat a substrate. Here, temperature and pressure of the chamber is maintained to allow carbon dioxide to be directly changed from a gas state to a supercritical state when the carbon dioxide is supplied into the chamber.
Abstract translation: 公开了用于处理基材的系统和方法。 该方法可以包括将超临界二氧化碳供应到室中以处理基底。 这里，保持室的温度和压力，以便当将二氧化碳供应到室中时，使二氧化碳直接从气态改变为超临界状态。
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公开(公告)号：US11942337B2
公开(公告)日：2024-03-26
申请号：US17063820
申请日：2020-10-06
Applicant: SEMES CO., LTD.
Inventor： Eui Sang Lim , Young Hun Lee , Jinwoo Jung , Miso Park , Byongwook Ahn , Yong Hee Lee
CPC classification number: H01L21/67017 , H01J37/32449 , H01J37/32467 , H01J37/32715 , H01J37/32834 , H01J2237/334
Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.
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公开(公告)号：US11923219B2
公开(公告)日：2024-03-05
申请号：US16912762
申请日：2020-06-26
Applicant: SEMES CO., LTD.
Inventor： Youngseop Choi , Young Hun Lee , Yong-Jun Seo , Bok Kyu Lee , Miso Park
CPC classification number: H01L21/67248 , B08B3/08 , B08B7/04 , B08B13/00 , H01L21/67051 , H01L21/67103 , H01L21/6719
Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.
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公开(公告)号：US11145520B2
公开(公告)日：2021-10-12
申请号：US16916246
申请日：2020-06-30
Applicant: SEMES CO., LTD.
Inventor： Young Hun Lee , Eui Sang Lim
Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.
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Patent Agency Ranking
公开(公告)号：US10529595B2
公开(公告)日：2020-01-07
申请号：US15607361
申请日：2017-05-26
Applicant: SEMES CO., LTD.
Inventor： Hyo Won Lee , Young Hun Lee
IPC: H01L21/67 , B05C11/10 , B05C5/00 , B05C5/02 , H01L21/677
Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treating unit that liquid-treats a substrate by supplying a liquid onto a substrate, a weight measuring unit that measures a weight of the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treating unit and the weight measuring unit. Accordingly, the weight of the remained liquid may be measured more promptly.
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公开(公告)号：US10109506B2
公开(公告)日：2018-10-23
申请号：US15604141
申请日：2017-05-24
Applicant: SEMES CO., LTD.
Inventor： Heehwan Kim , Young Hun Lee
Abstract: Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid supply unit for supplying fluid to the treating unit, wherein the fluid supply unit comprises a supply tank in which the fluid is stored, a supply line connecting the supply tank and the treating unit to supply the fluid from the supply tank to the treating unit, a filter installed on the supply line, and an exhaust line branching from the supply line, wherein a branch point of the exhaust line in the supply line is located upstream of the filter.
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公开(公告)号：US20160121374A1
公开(公告)日：2016-05-05
申请号：US14930206
申请日：2015-11-02
Applicant: Semes Co., Ltd
Inventor： Young Hun Lee , Eui Sang Lim , Jae Myoung Lee
CPC classification number: B08B7/0021 , B08B3/02 , B08B2203/0229 , F26B3/04 , F26B5/005 , F26B11/18 , F26B21/14 , H01L21/02101 , H01L21/67028 , H01L21/67051 , H01L21/67103 , H01L21/67126 , H01L21/6719 , H01L21/68742
Abstract: A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.
Abstract translation: 公开了一种基板处理装置。 所述装置可以包括壳体，所述壳体包括彼此联接以限定处理空间的上主体和下体，所述下体设置在所述上身下方，支撑单元联接到所述上身，所述支撑单元支撑 设置在处理空间中的基板，配置成向处理空间供给流体的流体供给单元，设置在上下体之间并与上下体接触的密封构件，密封构件使处理空间与外部空间隔离，以及 安装在密封构件和支撑单元之间的隔离板。 隔离板可以设置成面对密封构件。
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公开(公告)号：US12060942B2
公开(公告)日：2024-08-13
申请号：US17544950
申请日：2021-12-08
Applicant: SEMES CO., LTD.
Inventor： Seung Hoon Oh , Sang Min Lee , Jong Doo Lee , Jin Mo Jae , Young Hun Lee
IPC: F16J15/3204 , B08B7/00
CPC classification number: F16J15/3204 , B08B7/0021
Abstract: A sealing member for use in sealing a chamber for treating a substrate, the sealing member inserted in a groove formed in the chamber, includes a bottom part, a top part opposite the bottom part, an inner part connecting a first side of the bottom part to the top part, an outer part opposite the inner part and connecting a second side of the bottom part to the top part, and a recessed portion between the top part and the outer part.
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公开(公告)号：US12014938B2
公开(公告)日：2024-06-18
申请号：US17955206
申请日：2022-09-28
Applicant: SEMES CO., LTD.
Inventor： Yong Hee Lee , Young Hun Lee , Jinwoo Jung , Eui Sang Lim
IPC: H01L21/67 , H01L21/02 , H01L21/687
CPC classification number: H01L21/67051 , H01L21/02057 , H01L21/02101 , H01L21/67028 , H01L21/67034 , H01L21/6715 , H01L21/68707 , H01L21/68764 , H01L21/6719
Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
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