UV LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20180175245A1

    公开(公告)日:2018-06-21

    申请号:US15883774

    申请日:2018-01-30

    CPC classification number: H01L33/32 H01L33/007 H01L33/06

    Abstract: Exemplary embodiments provide a UV light emitting diode and a method of fabricating the same. The method of fabricating a UV light emitting diode includes growing a first n-type semiconductor layer including AlGaN, wherein growth of the first n-type semiconductor layer includes changing a growth pressure within a growth chamber and changing a flow rate of an n-type dopant source introduced into the growth chamber. A pressure change during growth of the first n-type semiconductor layer includes at least one cycle of a pressure increasing period and a pressure decreasing period over time, and change in flow rate of the n-type dopant source includes increasing the flow rate of the n-type dopant source in the form of at least one pulse. The UV light emitting diode fabricated by the method has excellent crystallinity.

    UV LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME
    14.
    发明申请
    UV LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME 有权
    紫外线发光二极管及其制造方法

    公开(公告)号:US20170033263A1

    公开(公告)日:2017-02-02

    申请号:US15294563

    申请日:2016-10-14

    CPC classification number: H01L33/32 H01L33/007 H01L33/06

    Abstract: Exemplary embodiments provide a UV light emitting diode and a method of fabricating the same. The method of fabricating a UV light emitting diode includes growing a first n-type semiconductor layer including AlGaN, wherein growth of the first n-type semiconductor layer includes changing a growth pressure within a growth chamber and changing a flow rate of an n-type dopant source introduced into the growth chamber. A pressure change during growth of the first n-type semiconductor layer includes at least one cycle of a pressure increasing period and a pressure decreasing period over time, and change in flow rate of the n-type dopant source includes increasing the flow rate of the n-type dopant source in the form of at least one pulse. The UV light emitting diode fabricated by the method has excellent crystallinity.

    Abstract translation: 示例性实施例提供了一种UV发光二极管及其制造方法。 制造UV发光二极管的方法包括生长包括AlGaN的第一n型半导体层,其中第一n型半导体层的生长包括改变生长室内的生长压力并改变n型的流速 掺杂剂源引入生长室。 第一n型半导体层的生长期间的压力变化包括至少一个增压周期和随时间推移的压力降低周期,并且n型掺杂剂源的流量变化包括增加 n型掺杂剂源,其形式为至少一个脉冲。 通过该方法制造的UV发光二极管具有优异的结晶度。

    UV LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME
    16.
    发明申请
    UV LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME 有权
    紫外线发光二极管及其制造方法

    公开(公告)号:US20160027964A1

    公开(公告)日:2016-01-28

    申请号:US14810464

    申请日:2015-07-27

    CPC classification number: H01L33/32 H01L33/007 H01L33/06

    Abstract: Exemplary embodiments provide a UV light emitting diode and a method of fabricating the same. The method of fabricating a UV light emitting diode includes growing a first n-type semiconductor layer including AlGaN, wherein growth of the first n-type semiconductor layer includes changing a growth pressure within a growth chamber and changing a flow rate of an n-type dopant source introduced into the growth chamber. A pressure change during growth of the first n-type semiconductor layer includes at least one cycle of a pressure increasing period and a pressure decreasing period over time, and change in flow rate of the n-type dopant source includes increasing the flow rate of the n-type dopant source in the form of at least one pulse. The UV light emitting diode fabricated by the method has excellent crystallinity.

    Abstract translation: 示例性实施例提供了一种UV发光二极管及其制造方法。 制造UV发光二极管的方法包括生长包括AlGaN的第一n型半导体层,其中第一n型半导体层的生长包括改变生长室内的生长压力并改变n型的流速 掺杂剂源引入生长室。 第一n型半导体层的生长期间的压力变化包括至少一个增压周期和随时间推移的压力降低周期,并且n型掺杂剂源的流量变化包括增加 n型掺杂剂源,其形式为至少一个脉冲。 通过该方法制造的UV发光二极管具有优异的结晶度。

    Substrate recycling method
    17.
    发明授权
    Substrate recycling method 有权
    基材回收方法

    公开(公告)号:US09048086B2

    公开(公告)日:2015-06-02

    申请号:US14264924

    申请日:2014-04-29

    Abstract: Exemplary embodiments of the present disclosure relate to a substrate recycling method and a recycled substrate. The method includes separating a first surface of a substrate from an epitaxial layer; forming a protective layer on an opposing second surface of the substrate; electrochemically etching the first surface of the substrate; and chemically etching the electrochemically etched first surface of the substrate.

    Abstract translation: 本公开的示例性实施方案涉及基材回收方法和再循环基材。 该方法包括从外延层分离衬底的第一表面; 在所述基板的相对的第二表面上形成保护层; 电化学蚀刻衬底的第一表面; 以及化学蚀刻所述基板的电化学蚀刻的第一表面。

    UV light emitting diode and method of fabricating the same

    公开(公告)号:US10319882B2

    公开(公告)日:2019-06-11

    申请号:US15883774

    申请日:2018-01-30

    Abstract: Exemplary embodiments provide a UV light emitting diode and a method of fabricating the same. The method of fabricating a UV light emitting diode includes growing a first n-type semiconductor layer including AlGaN, wherein growth of the first n-type semiconductor layer includes changing a growth pressure within a growth chamber and changing a flow rate of an n-type dopant source introduced into the growth chamber. A pressure change during growth of the first n-type semiconductor layer includes at least one cycle of a pressure increasing period and a pressure decreasing period over time, and change in flow rate of the n-type dopant source includes increasing the flow rate of the n-type dopant source in the form of at least one pulse. The UV light emitting diode fabricated by the method has excellent crystallinity.

    UV LIGHT EMITTING DIODE
    19.
    发明申请

    公开(公告)号:US20180090641A1

    公开(公告)日:2018-03-29

    申请号:US15563538

    申请日:2016-03-29

    Abstract: Disclosed herein is a UV light emitting diode. The UV light emitting diode includes a first conductive type semiconductor layer; a first stress adjustment layer disposed on the first conductive type semiconductor layer, and including a first nitride layer including Al and a second nitride layer disposed on the first nitride layer and having a lower Al composition ratio than the first nitride layer; an active layer disposed on the first stress adjustment layer; and a second conductive type semiconductor layer disposed on the active layer, wherein the first stress adjustment layer includes an Al delta layer inserted in the first nitride layer, and a lower surface of the first nitride layer in which the Al delta layer is inserted has greater average tensile stress than a lower surface of the second nitride layer directly disposed on the first nitride layer.

    UV light emitting diode and method of fabricating the same
    20.
    发明授权
    UV light emitting diode and method of fabricating the same 有权
    UV发光二极管及其制造方法

    公开(公告)号:US09496455B2

    公开(公告)日:2016-11-15

    申请号:US14810464

    申请日:2015-07-27

    CPC classification number: H01L33/32 H01L33/007 H01L33/06

    Abstract: Exemplary embodiments provide a UV light emitting diode and a method of fabricating the same. The method of fabricating a UV light emitting diode includes growing a first n-type semiconductor layer including AlGaN, wherein growth of the first n-type semiconductor layer includes changing a growth pressure within a growth chamber and changing a flow rate of an n-type dopant source introduced into the growth chamber. A pressure change during growth of the first n-type semiconductor layer includes at least one cycle of a pressure increasing period and a pressure decreasing period over time, and change in flow rate of the n-type dopant source includes increasing the flow rate of the n-type dopant source in the form of at least one pulse. The UV light emitting diode fabricated by the method has excellent crystallinity.

    Abstract translation: 示例性实施例提供了一种UV发光二极管及其制造方法。 制造UV发光二极管的方法包括生长包括AlGaN的第一n型半导体层,其中第一n型半导体层的生长包括改变生长室内的生长压力并改变n型的流速 掺杂剂源引入生长室。 第一n型半导体层的生长期间的压力变化包括至少一个增压周期和随时间推移的压力降低周期,并且n型掺杂剂源的流量变化包括增加 n型掺杂剂源,其形式为至少一个脉冲。 通过该方法制造的UV发光二极管具有优异的结晶度。

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