公开(公告)号：US20250031299A1

公开(公告)日：2025-01-23

申请号：US18711599

申请日：2022-11-22

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Shun IGARASHI ,  Ichiro KUWAYAMA ,  Suguru YAMAGISHI ,  Hiroshi UEDA ,  Satoshi KIYA

IPC: H05K1/02 ,  H05K1/11

Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer and a second conductor layer.

公开(公告)号：US20250016909A1

公开(公告)日：2025-01-09

申请号：US18711596

申请日：2022-11-22

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Shun IGARASHI ,  Ichiro KUWAYAMA ,  Suguru YAMAGISHI ,  Hiroshi UEDA ,  Satoshi KIYA

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern and a first ground pattern disposed on the second main surface and extending along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer side and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer.

公开(公告)号：US20170327630A1

公开(公告)日：2017-11-16

申请号：US15520135

申请日：2015-10-13

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Satoshi KIYA ,  Sumito UEHARA ,  Kousuke MIURA

IPC: C08G59/30 ,  H05K3/26 ,  H05K3/12 ,  C08J7/16 ,  B32B27/38 ,  H05K3/38 ,  B32B27/30

CPC classification number: C08G59/30 ,  B32B27/30 ,  B32B27/38 ,  C08J7/12 ,  C08J7/123 ,  C08J7/16 ,  C08J2327/12 ,  C09J163/00 ,  H05K3/1208 ,  H05K3/26 ,  H05K3/281 ,  H05K3/285 ,  H05K3/38 ,  H05K3/381 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/015

Abstract: A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.

公开(公告)号：US20170118837A1

公开(公告)日：2017-04-27

申请号：US15311601

申请日：2015-05-12

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kousuke MIURA ,  Satoshi KIYA ,  Sumito UEHARA

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0313 ,  H05K1/034 ,  H05K1/09 ,  H05K3/381 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4661 ,  H05K2201/09509 ,  H05K2203/072

Abstract: An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

公开(公告)号：US20160250830A1

公开(公告)日：2016-09-01

申请号：US15027323

申请日：2014-10-08

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Satoshi KIYA ,  Sumito UEHARA ,  Kousuke MIURA ,  Makoto NAKABAYASHI

IPC: B32B27/32 ,  H05K3/38 ,  H05K1/02 ,  H05K3/20 ,  B32B7/12 ,  H05K1/03

CPC classification number: B32B27/322 ,  B32B7/12 ,  B32B27/30 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/0274 ,  H05K1/034 ,  H05K1/0366 ,  H05K3/007 ,  H05K3/067 ,  H05K3/20 ,  H05K3/281 ,  H05K3/285 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0326 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/0278 ,  H05K2203/0376 ,  H05K2203/0769 ,  H05K2203/1173

Abstract: A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

Abstract translation: 含氟树脂作为主要成分的氟树脂基材在其表面的至少部分区域上具有改性层，所述改性层含有硅氧烷键和亲水性有机官能团，所述改性层的表面具有接触角 90°以下。