THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING

    公开(公告)号:US20230038363A1

    公开(公告)日:2023-02-09

    申请号:US17848844

    申请日:2022-06-24

    Abstract: Provided is a three-dimensional storage device using wafer-to-wafer bonding. A storage device includes a first chip including a first substrate and a peripheral circuit region including a first control logic circuit configured to control operation modes of the non-volatile memory device and a second chip including a second substrate and three-dimensional arrays of non-volatile memory cells. The second chip may be vertically stacked on the first chip so that a first surface of the first substrate faces a first surface of the second substrate, and a second control logic circuit is configured to control operation conditions of the non-volatile memory device and is arranged on a second surface of the second substrate, the second surface of the second substrate being opposite to the first surface of the second substrate of the second chip.

    MEMORY DEVICE, OPERATING METHOD OF MEMORY DEVICE AND MEMORY SYSTEM

    公开(公告)号:US20240311054A1

    公开(公告)日:2024-09-19

    申请号:US18595769

    申请日:2024-03-05

    Abstract: Provided is a memory device including a plurality of memory blocks including of at least one subblock, wherein the memory block includes a first subblock configured to store first data including of at least one bit, and a second subblock configured to perform an erase operation independently of the first subblock and store second data including of at least one bit. The memory device is configured to perform a read operation on the second data in response to a write operation being performed on the second data in the second subblock. The memory device is configured to perform a write operation on the first data in the first subblock in response to a read operation being performed on the second data in the second subblock.

    STORAGE DEVICE AND METHOD OF OPERATING STORAGE DEVICE

    公开(公告)号:US20230207017A1

    公开(公告)日:2023-06-29

    申请号:US17810894

    申请日:2022-07-06

    CPC classification number: G11C16/102 G11C16/28 G11C16/3495 G11C16/08 G11C16/32

    Abstract: A storage device includes a nonvolatile memory device and a storage controller to control operation of the nonvolatile memory device. The storage controller assigns a program operation associated with data to be programmed, to one of a first program operation or a second program operation, controls the nonvolatile memory device to perform the first program operation on first memory blocks and to perform the second program operation on at least one second memory block, and controls the nonvolatile memory to select one of the first program operation on a third memory block in an erase state or the second program operation on the second memory block, and to perform the selected program operation after the first program operation on the first memory blocks is completed.

    MEMORY SYSTEM FOR PERFORMING RECOVERY OPERATION, MEMORY DEVICE, AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20230153202A1

    公开(公告)日:2023-05-18

    申请号:US17965091

    申请日:2022-10-13

    CPC classification number: G06F11/1068 G06F11/076 G06F11/0793

    Abstract: A method of operating a memory system that comprises a memory device including a plurality of memory blocks and a memory controller, includes detecting a first memory block having a degradation count greater than or equal to a first reference value by the memory controller. A first command for the first memory block is transmitted to the memory device by the memory controller. A first voltage is applied to all of a plurality of word lines connected to the first memory block and a second voltage to a bit line connected to the first memory block in response to the first command by the memory device. The first voltage is greater than a voltage applied to turn on memory cells connected to all of the plurality of word lines. The second voltage is greater than a voltage applied to the bit line during program, read or erase operations.

    MEMORY DEVICE PERFORMING DATA COMPARISON WRITE AND MEMORY SYSTEM INCLUDING THE SAME

    公开(公告)号:US20200185030A1

    公开(公告)日:2020-06-11

    申请号:US16545765

    申请日:2019-08-20

    Inventor: Eun Chu OH

    Abstract: A memory device includes a memory cell array including a plurality of memory cells and a control logic to control a write operation on the memory cell array. When operating in a first data comparison write (DCW) mode, data is written to first memory cells in which data values are changed, in a first region, data is written to second memory cells in which data values are not changed, and, in a second region, data write is skipped for second memory cells in which data values are not changed.

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