公开(公告)号：US20180122721A1

公开(公告)日：2018-05-03

申请号：US15661135

申请日：2017-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SON-KWAN HWANG ,  Ho-Jin LEE ,  Kwang-Jin MOON ,  Byung-Lyul PARK ,  Jin-Ho AN ,  Nae-In LEE

IPC: H01L23/48 ,  H01L23/485 ,  H01L21/768 ,  H01L25/065

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/485 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/15311

Abstract: A plug structure of a semiconductor chip includes a substrate, an insulating interlayer disposed on the substrate, wherein the insulating interlayer includes a pad structure disposed therein, a via hole penetrating the substrate and the insulating interlayer, wherein the via hole exposes the pad structure, an insulating pattern formed on an interior surface of the via hole, wherein the insulating pattern includes a burying portion, and the burying portion fills a notch disposed in the substrate at the interior surface of the via hole, and a plug formed on the insulating pattern within the via hole, wherein the plug is electrically connected with the pad structure.

公开(公告)号：US20140057430A1

公开(公告)日：2014-02-27

申请号：US14072777

申请日：2013-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-Jin LEE ,  Tae-Je CHO ,  Dong-Hyeon JANG ,  Ho-Geon SONG ,  Se-Young JEONG ,  Un-Byoung KANG ,  Min-Seung YOON

IPC: H01L21/768

CPC classification number: H01L23/49844 ,  H01L21/76831 ,  H01L21/76844 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/15311

Abstract: In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector.

Abstract translation: 在一个实施例中，半导体器件包括具有第一表面的半导体衬底和与第一表面相对的第二表面。 第二表面限定再分布沟槽。 基板具有贯穿其中的通孔。 半导体器件还包括设置在通孔中的贯通孔。 通孔可以包括依次形成在通孔的内壁上的通孔绝缘层，阻挡层。 通孔还可以包括邻近阻挡层的导电连接器。 半导体器件还包括形成在衬底的第二表面上的绝缘层图案。 绝缘层图案限定了暴露通孔的顶表面的区域的开口。 半导体器件包括设置在沟槽中并与通孔电连接的再分配层。 绝缘层图案与导电连接器的区域重叠。

公开(公告)号：US20240414258A1

公开(公告)日：2024-12-12

申请号：US18811994

申请日：2024-08-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shi-Yun CHO ,  Ji-Hyun JUNG ,  Ho-Jin LEE ,  Young-Min LEE ,  Ho-Seong SEO ,  Youn-Ho CHOI

IPC: H04M1/724 ,  G06F1/16 ,  G06F3/0488 ,  H04B1/3827

Abstract: A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.

公开(公告)号：US20180366671A1

公开(公告)日：2018-12-20

申请号：US15870922

申请日：2018-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yi-Koan HONG ,  Kwang-Jin MOON ,  Nae-In LEE ,  Ho-Jin LEE

IPC: H01L51/44 ,  H01L25/065 ,  H01L23/538 ,  H01L23/532 ,  B82Y99/00

CPC classification number: H01L51/444 ,  B82Y10/00 ,  B82Y99/00 ,  H01L21/768 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53276 ,  H01L23/5329 ,  H01L23/538 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L51/0048 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03616 ,  H01L2224/05007 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05186 ,  H01L2224/05547 ,  H01L2224/05551 ,  H01L2224/05557 ,  H01L2224/05564 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05693 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/08057 ,  H01L2224/0807 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00012

Abstract: A semiconductor device includes a first conductive pattern at an upper portion of a first insulating interlayer on a first substrate, a first plurality of conductive nanotubes (CNTs) extending vertically, a second conductive pattern at a lower portion of a second insulating interlayer beneath a second substrate, and a second plurality of CNTs extending vertically. A lower surface of the second insulating interlayer contacts an upper surface of the first insulating interlayer. At least a portion of a sidewall of each of the first plurality of CNTs is covered by the first conductive pattern, and at least a portion of a sidewall of each of the second plurality of CNTs is covered by the second conductive pattern. The first and second conductive patterns vertically face each other, and at least one of the first plurality of CNTs and at least one of the second plurality of CNTs contact each other.

公开(公告)号：US20180069956A1

公开(公告)日：2018-03-08

申请号：US15811570

申请日：2017-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shi-Yun CHO ,  Ji-Hyun JUNG ,  Ho-Jin LEE ,  Young-Min LEE ,  Ho-Seong SEO ,  Youn-Ho CHOI

IPC: H04M1/725 ,  G06F1/16 ,  G06F3/0488 ,  H04B1/3827

CPC classification number: H04M1/72519 ,  G06F1/163 ,  G06F3/0488 ,  H04B1/385 ,  H04M2250/22

Abstract: A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.