公开(公告)号：US06812578B2

公开(公告)日：2004-11-02

申请号：US10068628

申请日：2002-02-06

Applicant: Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

Inventor： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

IPC: H01L2348

CPC classification number: H01L24/05 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to various embodiments of the present invention, a bonding pad structure of a semiconductor device reduces damage caused by thermo-mechanical stress in beam lead bonding. A method of fabricating an improved bonding pad structure is also provided. A polysilicon film plate is preferably formed between a bonding pad metal layer and a dielectric layer. The polysilicon film plate absorbs external thermo-mechanical stress and improves the durability of the bonding pad in a bond pull test (BPT). The bonding between the bonding pad metal layer and the dielectric layer is also improved. Other features and advantages are also provided.

Abstract translation: 根据本发明的各种实施例，半导体器件的焊盘结构减少了光束引线接合中由热机械应力引起的损伤。 还提供了一种制造改进的焊盘结构的方法。 优选在接合焊盘金属层和电介质层之间形成多晶硅膜片。 多晶硅薄膜板吸收外部热机械应力，并提高粘合拉伸试验（BPT）中的焊盘的耐久性。 接合焊盘金属层与电介质层之间的接合也得到改善。 还提供了其他特点和优点。

公开(公告)号：US06432746B1

公开(公告)日：2002-08-13

申请号：US09840725

申请日：2001-04-23

Applicant: Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

Inventor： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

IPC: H01L2144

Abstract: A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

公开(公告)号：US08790158B2

公开(公告)日：2014-07-29

申请号：US13033876

申请日：2011-02-24

Applicant: One-Moon Chang ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

Inventor： One-Moon Chang ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

IPC: B24B49/03 ,  B24B49/12 ,  B24B37/04

CPC classification number: B24B41/06

Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

Abstract translation: 化学机械抛光装置包括具有构造成支撑晶片的第一区域的压板和设置在第一区域外的第二区域。 化学机械抛光装置还包括设置在压板上的抛光垫，附接有抛光垫的焊盘头，配置成将浆料供应到晶片上的浆料供应源和设置在压板的第二区域上的注入口 。 注入口被配置为将预定气体注入到晶片的底表面的边缘并朝向晶片的外部。

公开(公告)号：US20130001616A1

公开(公告)日：2013-01-03

申请号：US13361612

申请日：2012-01-30

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H01L33/36 ,  H01L33/58 ,  H01L33/50

CPC classification number: H01L33/44 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed is a light emitting device including a light emitting structure comprising a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, a first electrode disposed on the first conductive type semiconductor layer, a second electrode disposed on the second conductivity type semiconductor layer, and a low temperature oxide film disposed on the light emitting structure, with an irregular thickness.

Abstract translation: 公开了一种发光器件，其包括发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，设置在第一导电类型半导体层上的第一电极，设置在第二导电类型半导体层上的第二电极 型半导体层和设置在发光结构上的低温氧化膜，具有不规则的厚度。

公开(公告)号：US07880289B2

公开(公告)日：2011-02-01

申请号：US11752770

申请日：2007-05-23

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H01L23/48 ,  H01L21/30 ,  H01L21/58

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/105 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/16157 ,  H01L2224/274 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2225/1005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided are a semiconductor package having connection terminals whose side surfaces are exposed and a semiconductor module including such a semiconductor package. Also provided are methods of fabricating the semiconductor package and semiconductor module. According to an embodiment of the present invention, a semiconductor package includes a semiconductor chip including a semiconductor wafer having first and second opposite surfaces and a plurality of conductive pads arranged in a row on the first surface along the edges of the semiconductor wafer such that a side surface of each conductive pad is exposed. An insulating layer is formed on the first surface of the semiconductor wafer and includes openings for exposing parts of the conductive pads. A plurality of connection terminals are respectively arranged on the conductive pads exposed through the openings and a reinforcing member is arranged on the insulating layer to cover a portion of each connection terminal.

Abstract translation: 提供了具有侧表面露出的连接端子和包括这种半导体封装的半导体模块的半导体封装。 还提供了制造半导体封装和半导体模块的方法。 根据本发明的实施例，半导体封装包括半导体芯片，其包括具有第一和第二相对表面的半导体晶片和沿着半导体晶片的边缘在第一表面上排成一行的多个导电焊盘，使得 每个导电焊盘的侧面露出。 绝缘层形成在半导体晶片的第一表面上，并且包括用于暴露导电焊盘部分的开口。 多个连接端子分别布置在通过开口暴露的导电焊盘上，并且在绝缘层上布置加强构件以覆盖每个连接端子的一部分。

公开(公告)号：US20100043301A1

公开(公告)日：2010-02-25

申请号：US12461806

申请日：2009-08-26

Applicant: Sang-Ok Yoon ,  Kwan-Soo Kim ,  Shin Kim ,  Yun-Han Kim

Inventor： Sang-Ok Yoon ,  Kwan-Soo Kim ,  Shin Kim ,  Yun-Han Kim

IPC: C09K3/14

CPC classification number: C10M173/02 ,  C10M2201/041 ,  C10M2201/103 ,  C10M2201/12 ,  C10M2209/04 ,  C10M2209/12 ,  C10N2240/401

Abstract: A water-based cutting fluid includes a water-soluble polymer dissolved in water and ceramic powder dispersed in the water. The cutting fluid further includes water glass. Further, the water-soluble polymer is one selected from a group consisting of polyvinyl alcohol (PVA), cellulose, methyl cellulose, carboxymethyl cellulose (CMC), starch, or a combination thereof.

Abstract translation: 水性切削液包括溶于水的水溶性聚合物和分散在水中的陶瓷粉末。 切削液还包括水玻璃。 此外，水溶性聚合物是选自聚乙烯醇（PVA），纤维素，甲基纤维素，羧甲基纤维素（CMC），淀粉或其组合中的一种。

公开(公告)号：US20090050885A1

公开(公告)日：2009-02-26

申请号：US12222350

申请日：2008-08-07

Applicant: Yun-rae Cho ,  Young-min Lee ,  Min-keun Kwak ,  Shin Kim

Inventor： Yun-rae Cho ,  Young-min Lee ,  Min-keun Kwak ,  Shin Kim

IPC: H01L23/58 ,  H01L21/66

CPC classification number: H01L22/32 ,  H01L21/78 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor wafer includes a plurality of unitary semiconductor chips formed on a semiconductor substrate. Scribe lane region separate the unitary semiconductor chips from each other. Test element group (TEG) pads are configured to apply testing signals for testing respective test elements. A TEG pad is arranged such that an acute angle formed at an intersection of a line extending from portion of a perimeter of the TEG pad and at least a portion of the outer edge of a corresponding scribe lane region is greater than 0° and less than or equal to 60°.

Abstract translation: 半导体晶片包括形成在半导体衬底上的多个单位半导体芯片。 划线通道区域将单位半导体芯片彼此分开。 测试元件组（TEG）焊盘被配置为应用测试信号来测试相应的测试元件。 TEG垫被布置成使得形成在从TEG垫的周边的一部分延伸的线和相应划线路区域的外边缘的至少一部分的交点处形成的锐角大于0°并小于 或等于60°。

公开(公告)号：US20070029674A1

公开(公告)日：2007-02-08

申请号：US11375760

申请日：2006-03-14

Applicant: Dong-Kil Shin ,  Se-Young Yang ,  Shin Kim ,  Wang-Ju Lee

Inventor： Dong-Kil Shin ,  Se-Young Yang ,  Shin Kim ,  Wang-Ju Lee

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/3157 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a board-on-chip package and stack package using the same to reduce the likelihood that bonding wires in an encapsulant may be damaged due to mechanical stresses applied during a package stacking process. A semiconductor package may have a spacer provided along the opposing sides of an encapsulant. The spacer may be spaced away from bonding wires embedded in the encapsulant. The height of the spacer may be greater than the height of the encapsulated bonding wire from the bottom surface of the semiconductor package. The spacer may be formed of a bar or a protrusion. In a stack package using the semiconductor package, the spacer may be provided between a semiconductor chip of a lower semiconductor package and an encapsulant of an upper semiconductor package.

Abstract translation: 提供了一种使用其的片上封装和堆叠封装，以减少由于在封装堆叠过程中施加的机械应力而使密封剂中的接合线可能被损坏的可能性。 半导体封装可以具有沿密封剂的相对侧设置的间隔件。 间隔件可以与嵌入密封剂中的接合线间隔开。 间隔件的高度可以大于封装的接合线从半导体封装的底表面的高度。 间隔件可以由杆或突起形成。 在使用半导体封装的堆叠封装中，间隔件可以设置在下半导体封装的半导体芯片和上半导体封装的封装件之间。

公开(公告)号：US06183589B2

公开(公告)日：2001-02-06

申请号：US09035965

申请日：1998-03-06

Applicant: Shin Kim ,  Byung Man Kim ,  Il Heung Choi ,  Jeong Ho Bang

Inventor： Shin Kim ,  Byung Man Kim ,  Il Heung Choi ,  Jeong Ho Bang

IPC: B32B3100

CPC classification number: H01L24/27 ,  H01L23/4951 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/53178 ,  Y10T156/17 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method for manufacturing lead-on-chip (LOC) semiconductor packages includes steps of preparing a lead frame having inner leads and outer leads, and applying a liquid adhesive having a certain viscosity to the bottom surfaces of the inner leads. The method also includes positioning a semiconductor chip under the lead frame, to expose electrode pads through the space defined between opposing rows of inner leads. The inner leads are then attached to the active surface of the semiconductor chip by means of the liquid adhesive. The adhesive applying step may be carried out using a tool having discharge projections through which liquid adhesive is discharged from a reservoir. The liquid adhesive under the lead frame may be cured and then turned into a solid adhesive layer by thermocompression. The liquid adhesive is a thermosetting resin or a thermoplastic resin.

Abstract translation: 一种制造芯片上芯片（LOC）半导体封装的方法包括制备具有内引线和外引线的引线框架的步骤，以及向内引线的底表面施加具有一定粘度的液体粘合剂。 该方法还包括将半导体芯片定位在引线框架下方，以通过在相应的内引线行之间限定的空间露出电极焊盘。 然后通过液体粘合剂将内部引线附接到半导体芯片的有源表面。 粘合剂施加步骤可以使用具有从贮存器排出液体粘合剂的排出突起的工具进行。 引线框架下方的液体粘合剂可以固化，然后通过热压变成固体粘合剂层。 液体粘合剂是热固性树脂或热塑性树脂。

公开(公告)号：USD700758S1

公开(公告)日：2014-03-04

申请号：US29427778

申请日：2012-07-23

Applicant: Jaeyoul Jeong ,  Dong Hun Lee ,  Sungjin Park ,  Shin Kim

Designer： Jaeyoul Jeong ,  Dong Hun Lee ,  Sungjin Park ,  Shin Kim