摘要:
A manufacturing method of a semiconductor device includes preparing a first semiconductor substrate having a first integrated circuit formed therein and including a plurality of first through substrate vias, and a second semiconductor substrate having a second integrated circuit formed therein and including a plurality of second through substrate vias, forming a solid-electrolytic layer on an upper surface of the first semiconductor substrate, mounting the second semiconductor substrate on the solid-electrolytic layer such that a lower surface of the second semiconductor substrate comes into contact with the solid-electrolytic layer, and applying a voltage between the plurality of first through substrate vias and the plurality of second through substrate vias, to form in the solid-electrolytic layer a plurality of connection electrodes, which are respectively connecting the plurality of second through substrate vias adjacent to the plurality of first through substrate vias to the plurality of first through substrate vias.
摘要:
A 3-dimensional integrated circuit designing method includes forming a temporary layout region for an original integrated circuit on an XY plane, the plane being short in an X direction and long in a Y direction perpendicular to the X direction, dividing the temporary layout region into 2N (N is an integral number of not smaller than 2) or more subregions in the Y direction, configuring one block for every successive N subregions to prepare a plurality of blocks, and forming N layers of layout by alternately folding each of the blocks in the Y direction in units of one subregion to selectively set a kN-th (k is an integral number not less than 1) subregion and (kN+1)th subregion of each block to one of an uppermost layer and lowermost layer.
摘要:
A random number test circuit includes a counting unit to count number of repetitions of a certain-value bit in a random number sequence, the repetitions occurring in series, a detecting unit to detect a plurality of numbers corresponding to a kind of bits in the random number sequence, and a determining unit to determine whether the random number sequence is normal, based on the numbers.
摘要:
A random number generation device includes: a first source region; a first drain region; a first channel region provided between the first source region and the first drain region; a first insulating film provided on the first channel region; and a first gate electrode provided on the first insulating film. The first insulating film has a trap capturing and releasing a charge, and a tensile or compressive stress is applied in a direction of a gate length to at least one of the first channel region and the first insulating film.
摘要:
The objective is to provide a random number generating device having a smaller circuit size and a smaller value of output bias. The random number generating device includes a pair of first and second current paths arranged in parallel with each other, and a pair of first and second fine particles, which can mutually exchange charges, and are located in the vicinity of the first and second current paths.
摘要:
The objective is to provide a random number generating device having a smaller circuit size and a smaller value of output bias. The random number generating device includes a pair of first and second current paths arranged in parallel with each other, and a pair of first and second fine particles, which can mutually exchange charges, and are located in the vicinity of the first and second current paths.
摘要:
A random number generating circuit receives as input a first digital random number signal generated at a first generating rate and produces as output a second digital random number signal having a second generating rate that is twice as high as the first generating rate. A semiconductor integrated circuit, an IC card and an information terminal device comprising the random number circuit is provided.
摘要:
According to one embodiment, a cache system includes a tag memory includes a volatile memory device, the tag memory includes ways and storing a tag for each line, a data memory includes a nonvolatile memory device including sense amplifiers for reading data, the data memory includes ways and storing data for each line, a comparison circuit configured to compare a tag included in an address supplied from an external with a tag read from the tag memory, and a controller configured to turn off a power of a sense amplifier for a way which is not accessed based on a comparison result of the comparison circuit.
摘要:
One embodiment provides a semiconductor integrated circuit, including: a substrate; a plurality of nonvolatile memory portions formed in the substrate, each including a first nonvolatile memory and a second nonvolatile memory; and a plurality of logic transistor portions formed in the substrate, each including at least one of logic transistor, wherein the logic transistors include: a first transistor which is directly connected to drains of the first and second nonvolatile memories at its gate; and a second transistor which is not directly connected to the drains of the first and second nonvolatile memories, and wherein a bottom surface of the gate of each of the logic transistors sandwiching the first and second nonvolatile memories is lower in height from a top surface of the substrate than a bottom surface of the control gate of each of the first and second nonvolatile memories.
摘要:
In a three-dimensional integrated circuit apparatus 80 in which a first wafer 101 and a second wafer 102 having respective integrated circuits according to an embodiment are directly bonded, the second wafer 102 is provided with a through hole 10 aligned with a via 5a of the first wafer 101 by use of an alignment marker of the first wafer 101, and connected to the via 5a. The surrounding of the through hole 10 is provided with an insulating film 8.