公开(公告)号：US07527723B2

公开(公告)日：2009-05-05

申请号：US11035373

申请日：2005-01-14

申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

IPC分类号： B23H7/36 ,  B23H1/10 ,  B23H3/10

CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.

摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。

公开(公告)号：US07476303B2

公开(公告)日：2009-01-13

申请号：US10914190

申请日：2004-08-10

申请人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

发明人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

IPC分类号： C25F3/16 ,  B23H5/06 ,  B23H5/10 ,  B23H5/14

CPC分类号： C25F7/02

摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.

摘要翻译： 提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。 电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触 在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

公开(公告)号：US20080171440A1

公开(公告)日：2008-07-17

申请号：US12007786

申请日：2008-01-15

申请人： Akira Kodera ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Itsuki Kobata

发明人： Akira Kodera ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Itsuki Kobata

IPC分类号： H01L21/304 ,  C23F11/14 ,  B23H3/00

CPC分类号： H01L21/3212 ,  C09G1/04

摘要： A pre-polishing treatment solution has a prominent corrosion inhibiting effect, and can be used in pre-polishing treatments for interconnect substrates. The pre-polishing treatment solution comprises a corrosion inhibitor dissolved in an organic solvent.

摘要翻译： 预抛光处理溶液具有显着的腐蚀抑制作用，可用于互连基板的预抛光处理。 预抛光处理溶液包含溶解在有机溶剂中的腐蚀抑制剂。

公开(公告)号：US07255778B2

公开(公告)日：2007-08-14

申请号：US10828346

申请日：2004-04-21

申请人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata ,  Takayuki Saito

发明人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata ,  Takayuki Saito

IPC分类号： C25D17/00 ,  C25F3/16 ,  B23H3/08

CPC分类号： B23H3/00 ,  B23H3/08

摘要： An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.

摘要翻译： 电化学加工装置包括用于保持超纯水的加工室，浸没在保持在加工室中的超纯水中的阴极/阳极和用于将工件保持在距离阴极/阳极预定距离的工件保持部分， 被加工的工件与超纯水接触。 电化学加工装置还包括阳极/阴极接触件，其与由工件保持部分保持的工件接触，使得工件用作阳极/阴极，具有强碱性阴离子交换功能或强酸性阳离子交换功能的催化剂 用于在阴极/阳极和工件之间施加电压的电源，以及用于相对移动工件和催化剂的移动机构。 催化剂设置在阴极/阳极和被工件保持部分保持的工件之间。

公开(公告)号：US20070181432A1

公开(公告)日：2007-08-09

申请号：US11723934

申请日：2007-03-22

申请人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Ikutaro Noji ,  Kaori Yoshida

发明人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Ikutaro Noji ,  Kaori Yoshida

IPC分类号： C25D5/10

CPC分类号： C25F7/00 ,  B23H3/00 ,  B23H3/04 ,  B23H3/08 ,  B23H5/08 ,  B24B37/04 ,  C25F3/00 ,  C25F5/00 ,  H01L21/32115 ,  H01L21/3212

摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.

摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或基板与供电电极之间的至少一个的离子交换器，用于在存在的工件的表面上电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。

公开(公告)号：US20060234508A1

公开(公告)日：2006-10-19

申请号：US10513399

申请日：2003-05-16

申请人： Mitsuhiko Shirakashi ,  Hozumi Yasuda ,  Masayuki Kumekawa ,  Itsuki Kobata

发明人： Mitsuhiko Shirakashi ,  Hozumi Yasuda ,  Masayuki Kumekawa ,  Itsuki Kobata

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/02087 ,  B23H5/04 ,  B23H5/08 ,  B24B37/345 ,  C25F3/00 ,  C25F7/00 ,  H01L21/0209 ,  H01L21/32115 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76873

摘要： There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.

摘要翻译： 提供了一种基板处理装置，其可以通过使用电解处理方法来处理基板，同时尽可能减少CMP处理时的负载。 本发明的基板处理装置包括：电解处理单元，用于电解去除在所述表面上形成的待处理膜的基板W的表面，所述单元包括来自的进料部分（373） 与基板W的所述表面接触; 斜面蚀刻单元（48），用于在电解处理单元（36）中与已经与供电部分（373）接触的部分处去除未处理的被处理膜; 化学机械抛光单元（34），用于化学和机械地抛光衬底的表面。

公开(公告)号：US20050067289A1

公开(公告)日：2005-03-31

申请号：US10948320

申请日：2004-09-24

申请人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

发明人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

IPC分类号： C25C7/06 ,  C25F7/00

CPC分类号： C25F7/00

摘要： An electrolytic processing apparatus can detect the endpoint of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus including: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss, said sensor being disposed not in contact with or separately by an insulator from the processing electrode and/or the feeding electrode.

摘要翻译： 电解处理装置能够以高精度和相对简单的结构稳定地检测电解加工的终点。 该电解处理装置包括：处理电极，其能够接近或与处理对象接触; 用于向处理对象供电的馈电电极; 流体供应部分，用于在处理对象与处理电极和馈送电极中的至少一个之间提供流体; 用于在处理电极和馈电电极之间施加电压的处理电源; 驱动部，其用于使处理对象与所述处理电极和所述馈送电极中的至少一个相对移动; 以及涡流传感器，用于根据涡流损耗的变化来检测加工对象的厚度，所述传感器被设置成不与处理电极和/或馈电电极接触或分离。

公开(公告)号：US20090107851A1

公开(公告)日：2009-04-30

申请号：US12285615

申请日：2008-10-09

申请人： Akira Kodera ,  Xinming Wang ,  Itsuki Kobata ,  Yasushi Toma

发明人： Akira Kodera ,  Xinming Wang ,  Itsuki Kobata ,  Yasushi Toma

IPC分类号： H01L21/3063 ,  H01L21/67

CPC分类号： H01L21/32125 ,  B23H5/08 ,  C25F3/30

摘要： An electrolytic polishing method of a substrate having a barrier film and an interconnect metal layer on a surface to be processed under the presence of an electrolytic solution, including a barrier film electrolytic polishing process which removes the barrier film by applying a voltage between a cathode and an anode, with the surface to be processed serving as the cathode, and causing relative motion between the surface to be processed and a polishing pad which faces and makes contact with the surface to be processed.

摘要翻译： 一种在电解液存在下在待加工表面上具有阻挡膜和互连金属层的基板的电解抛光方法，该方法包括：通过在阴极与阴极之间施加电压来除去阻挡膜的阻挡膜电解抛光工艺; 阳极，待处理的表面用作阴极，并且引起待处理表面与抛光垫之间的相对运动，所述抛光垫面向并与待处理表面接触。

公开(公告)号：US20090078583A1

公开(公告)日：2009-03-26

申请号：US12007956

申请日：2008-01-17

申请人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

发明人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

IPC分类号： B23H5/06 ,  B23H11/00 ,  C25F3/16 ,  C25F7/00

CPC分类号： C25F3/00 ,  B23H5/08 ,  B24B37/013 ,  B24B49/105 ,  H01L21/32125

摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.

摘要翻译： 复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。 电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。

公开(公告)号：US20080314763A1

公开(公告)日：2008-12-25

申请号：US12222733

申请日：2008-08-14

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiro Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiro Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

IPC分类号： C25F1/00 ,  C25F7/00

CPC分类号： C25F3/00 ,  B01J49/30 ,  C25F7/00

摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

摘要翻译： 用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。 再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。