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Patent Agency Ranking
公开(公告)号：US20160225728A1
公开(公告)日：2016-08-04
申请号：US15094125
申请日：2016-04-08
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC classification number: H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。
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公开(公告)号：US09289846B2
公开(公告)日：2016-03-22
申请号：US14085981
申请日：2013-11-21
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Wei-Sheng Lin , Lung-Tang Hung , Meng-Hung Yeh , Zhi-Lun Hsieh , Yude Chu
CPC classification number: B23K20/007 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4848 , H01L2224/85012 , H01L2224/85051 , H01L2224/8517 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/00015 , H01L2224/05599
Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
Abstract translation: 公开了一种用于制造引线接合结构的方法，其包括：提供具有多个接合焊盘的基板; 并且通过沿着焊盘周围的路径进行擦洗处理，使接合线的球端部发泡在至少一个接合焊盘上，从而防止小尺寸的球端部从焊盘剥离。
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公开(公告)号：US20160079198A1
公开(公告)日：2016-03-17
申请号：US14584463
申请日：2014-12-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Wei-Sheng Lin , Lien-Chen Chiang , Lung-Tang Hung , Meng-Hung Yeh , Yude Chu
CPC classification number: H01L24/43 , B23K20/004 , B23K20/007 , B23K20/233 , B23K2101/34 , B23K2101/40 , B23K2101/42 , B23K2103/08 , B23K2103/18 , B23K2103/26 , B23K2103/42 , H01L24/45 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/437 , H01L2224/43985 , H01L2224/45144 , H01L2224/85045 , H01L2224/85444 , H01L2224/85455 , H01L2224/859 , H01L2924/00014 , H01L2924/3701 , H01L2924/386 , H01L2224/45015 , H01L2924/207 , H01L2924/01079 , H01L2224/05599
Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.
Abstract translation: 提供一种消除缺陷接合线的方法，包括如果接合部件的接合线有缺陷，则将接合部件从载体的第一区域移动到载体的第二区域，并且协作地操作移动部件和接合 从而导致不良接合线从接合部件移除并结合到载体的第二区域，从而自动调试接合部件并提高生产效率。
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公开(公告)号：US20150028081A1
公开(公告)日：2015-01-29
申请号：US14085981
申请日：2013-11-21
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
Inventor： Wei-Sheng Lin , Lung-Tang Hung , Meng-Hung Yeh , Zhi-Lun Hsieh , Yude Chu
IPC: B23K20/10
CPC classification number: B23K20/007 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/4848 , H01L2224/85012 , H01L2224/85051 , H01L2224/8517 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/00015 , H01L2224/05599
Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
Abstract translation: 公开了一种用于制造引线接合结构的方法，其包括：提供具有多个接合焊盘的基板; 并且通过沿着焊盘周围的路径进行擦洗处理，使接合线的球端部发泡在至少一个接合焊盘上，从而防止小尺寸的球端部从焊盘剥离。
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公开(公告)号：US20140203395A1
公开(公告)日：2014-07-24
申请号：US14087554
申请日：2013-11-22
Applicant: Siliconware Precision industries Co., Ltd
Inventor： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC classification number: H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。
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