Ion control for a plasma source
    11.
    发明授权
    Ion control for a plasma source 有权
    等离子体源的离子控制

    公开(公告)号:US09198274B2

    公开(公告)日:2015-11-24

    申请号:US13932632

    申请日:2013-07-01

    Abstract: One embodiment is directed to a plasma source comprising a cavity and at least first and second electrodes. The plasma source is configured to, during a first portion of each cycle, bias the first electrode as a cathode and use the second electrode as an anode, during a second portion of each cycle, apply an ion flush bias to the first and second electrodes, during a third portion of each cycle, bias the second electrode as a cathode and use the first electrode as an anode, and during a fourth portion of each cycle, apply an ion flush bias to the first and second electrodes. Other embodiments are disclosed.

    Abstract translation: 一个实施例涉及包括空腔和至少第一和第二电极的等离子体源。 等离子体源被配置为在每个周期的第一部分期间,将第一电极作为阴极偏置并且使用第二电极作为阳极,在每个周期的第二部分期间,向第一和第二电极施加离子冲洗偏压 在每个周期的第三部分期间,将第二电极偏置为阴极,并使用第一电极作为阳极,并且在每个周期的第四部分期间,对第一和第二电极施加离子冲洗偏压。 公开了其他实施例。

    ION CONTROL FOR A PLASMA SOURCE
    13.
    发明申请
    ION CONTROL FOR A PLASMA SOURCE 有权
    离子控制等离子体源

    公开(公告)号:US20140007813A1

    公开(公告)日:2014-01-09

    申请号:US13932632

    申请日:2013-07-01

    Abstract: One embodiment is directed to a plasma source comprising a cavity and at least first and second electrodes. The plasma source is configured to, during a first portion of each cycle, bias the first electrode as a cathode and use the second electrode as an anode, during a second portion of each cycle, apply an ion flush bias to the first and second electrodes, during a third portion of each cycle, bias the second electrode as a cathode and use the first electrode as an anode, and during a fourth portion of each cycle, apply an ion flush bias to the first and second electrodes. Other embodiments are disclosed.

    Abstract translation: 一个实施例涉及包括空腔和至少第一和第二电极的等离子体源。 等离子体源被配置为在每个周期的第一部分期间,将第一电极作为阴极偏置并且使用第二电极作为阳极,在每个周期的第二部分期间,向第一和第二电极施加离子冲洗偏压 在每个周期的第三部分期间,将第二电极偏置为阴极,并使用第一电极作为阳极,并且在每个周期的第四部分期间,对第一和第二电极施加离子冲洗偏压。 公开了其他实施例。

    Magnetic force release for sputtering sources with magnetic target materials

    公开(公告)号:US10727034B2

    公开(公告)日:2020-07-28

    申请号:US15678962

    申请日:2017-08-16

    Abstract: A magnet bar assembly for a rotary target cathode comprises a support structure, a magnet bar structure movably attached to the support structure and including a plurality of magnets, and a positioning mechanism operatively coupled to the support structure and the magnet bar structure. The positioning mechanism is configured to move the magnet bar structure between a retracted position and a deployed position while inside a magnetic target material cylinder. The retracted position substantially reduces a magnetic force between the magnets and a magnetic target material of a target cylinder when the magnet bar assembly is inserted into the target cylinder or removed from the target cylinder. The deployed position substantially increases the magnetic force between the magnets and the magnetic target material when the magnet bar assembly is in the target cylinder, and allows a magnetic field from the magnet bar structure to penetrate through the magnetic target material.

    Sputtering apparatus
    15.
    发明授权

    公开(公告)号:US09758862B2

    公开(公告)日:2017-09-12

    申请号:US14016693

    申请日:2013-09-03

    Abstract: One embodiment is directed to a magnetron assembly comprising a plurality of magnets, and a yoke configured to hold the plurality of magnets in at least four straight, parallel, independent linear arrays. The plurality of magnets is arranged in the yoke so as to form a pattern comprising an outer portion and an inner portion, wherein the outer portion substantially surrounds the perimeter of the inner portion. The end portions of the linear array comprise a pair of turnaround sections, wherein each turnaround section substantially spans respective ends of the pair of elongated sections of the outer portion. The magnets in each turnaround section are arranged to form at least two or more different curves in the magnetic field that are offset from each along the target rotation axis.

    Sputtering apparatus
    16.
    发明授权
    Sputtering apparatus 有权
    溅射装置

    公开(公告)号:US09418823B2

    公开(公告)日:2016-08-16

    申请号:US14019877

    申请日:2013-09-06

    Abstract: A magnetron assembly for a rotary target cathode comprises a rigid support structure, a magnet bar structure movably attached to the rigid support structure, and at least one actuation mechanism coupled to the rigid support structure and configured to change a distance of the magnet bar structure from a surface of a rotatable target cylinder. The magnetron assembly also includes a position indicating mechanism operative to measure a position of the magnet bar structure relative to the surface of the rotatable target cylinder. A communications device is configured to receive command signals from outside of the magnetron assembly and transmit information signals to outside of the magnetron assembly.

    Abstract translation: 用于旋转目标阴极的磁控管组件包括刚性支撑结构,可移动地附接到刚性支撑结构的磁棒结构,以及联接到刚性支撑结构并被配置为改变磁棒结构与轴承结构的距离的至少一个致动机构 可旋转目标气缸的表面。 磁控管组件还包括位置指示机构,其可操作以测量磁棒结构相对于可旋转目标气缸的表面的位置。 通信设备被配置为从磁控管组件的外部接收命令信号,并将信息信号发送到磁控管组件的外部。

    DECENTRALIZED PROCESS CONTROLLER
    17.
    发明申请
    DECENTRALIZED PROCESS CONTROLLER 审中-公开
    分散过程控制器

    公开(公告)号:US20150120001A1

    公开(公告)日:2015-04-30

    申请号:US14068267

    申请日:2013-10-31

    Abstract: A decentralized process controller comprises at least two programmable interface modules in operative communication with each other. Each of the interface modules includes a processor and is configurable for connection to separate field devices comprising at least one sensor device and at least one actuator device. The at least two programmable interface modules are configurable as a stand-alone process control loop when one of the interface modules is connected to the sensor device, and the other of the interface modules is connected to the actuator device.

    Abstract translation: 分散式过程控制器包括彼此可操作地通信的至少两个可编程接口模块。 每个接口模块包括处理器,并且可配置为连接到包括至少一个传感器装置和至少一个致动器装置的分离的现场装置。 当其中一个接口模块连接到传感器设备,另一个接口模块连接到致动器装置时,至少两个可编程接口模块可配置为独立的过程控制回路。

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