摘要:
The invention comprises an FPGA having a plurality of input reference voltages and/or output voltage supplies. In one embodiment, two or more differential amplifiers in the same configurable input buffer use different input reference voltages. According to a second aspect of the invention, the I/O pad line is configurably connected to the input reference voltage line, so that any configurable Input/Output Block (IOB) can be used to supply the input reference voltage. According to a third aspect of the invention, the reference input of an I/O is configurably connected to any of two or more input reference voltage lines. According to another aspect of the invention, a single input reference voltage and/or a single output voltage supply is applied to each IOB, with the IOBs grouped into sets. Each set of IOBs has a separate input reference voltage and/or a separate output voltage supply.
摘要:
A method and apparatus to test the inter-die interface between two or more semiconductor die in die stacking applications, where a mismatch exists between the number of input and output pads on a base die and the number of input and output pads on a stacked die. In a first embodiment, a number of through-die vias (TDVs) may be used to implement inter-die signal paths using standard or flexible design rules to maintain statistical TDV yield despite the lack of continuity verification of the inter-die signals paths. In alternate embodiments, programmable multiplexers may be utilized to share one or more inter-die connections between the base die and the one or more stacked die so as to facilitate testing and normal operation of each inter-die connection. In other embodiments, spare TDVs are utilized only during test operations, so as to accommodate the mismatch. In yet other embodiments, built-in-test (BIT) circuits are configured to perform logic operations using a plurality of inter-die input/output (I/O) signals to eliminate the need to implement an identical number of input and output ports between the base die and the one or more stacked die to facilitate inter-die testing.
摘要:
Structures and methods of avoiding hold time violations in a design implemented in a PLD. In a programmable device, the delay of a signal path varies, e.g., depending on the separation between the source and destination of the signal. An optional delay element is provided between a programmable interconnect structure and a destination logic element having a clock skew relative to the source. The optional delay element is programmed by the implementation software to introduce a delay on the signal path when necessary to meet the hold time requirements for the destination logic element. The optional delay is designed to be large enough to overcome hold-time violations even for the largest possible clock skew and the smallest possible signal delay. When no hold time violation occurs, the optional delay element is configured to bypass the additional delay, to avoid imposing a large setup requirement on the signal.
摘要:
A programmable integrated circuit (IC) with mirrored interconnect structure. The IC includes a plurality of arrangements, which are horizontally arranged. Each arrangement includes a first logic column, an interconnect column, and a second logic column. Each interconnect column includes programmable interconnect blocks (148), and each of the first and second logic columns includes programmable logic blocks. Each programmable interconnect block provides a plurality of first input and output ports on a first side and a plurality of second input and output ports on a second side. The first ports and the first side of each of the programmable interconnect blocks physically mirror the second ports and the second side of the programmable interconnect block. The ports of the programmable interconnect blocks are coupled to the ports of the programmable logic blocks in the first and second logic columns.
摘要:
An interconnect structure in which “diagonal” and “straight” interconnect lines are interleaved to minimize coupling between adjacent interconnect lines. An interconnect structure for an integrated circuit comprises rows and columns of tiles. Interconnect lines extend at least in part along a first column of the tiles, the interconnect lines including straight and diagonal interconnect lines. A “straight” interconnect line interconnects at least two tiles in the first column, and a “diagonal” interconnect line interconnects a tile in the first column with at least one tile in a different column and row. The interconnect lines are laid out in parallel fashion such that no straight interconnect line is physically adjacent to more than one other straight interconnect line, and no diagonal interconnect line is physically adjacent to more than one other diagonal interconnect line. Optionally, no two physically adjacent interconnect lines drive in the same direction within the first column.
摘要:
A structure that can be used, for example, to implement a lookup table for a programmable logic device (PLD). The structure includes configuration memory cells, pass transistors, and a buffer. The pass transistors pass the output of a selected configuration memory cell to the buffer, and are controlled by data input signals of the structure. The pass transistors have a first oxide thickness and are controlled by a value having a first operating voltage. The memory cells and buffer include transistors having a second oxide thickness thinner than the first oxide thickness, and operate at a second operating voltage lower than the first operating voltage. The data input signals are provided at the first operating voltage. Some embodiments include data generating circuits that include transistors having the first oxide thickness. Gate lengths can also vary between the memory cell transistors, pass transistors, buffer transistors, and data generating circuits.
摘要:
A multiplexer that can be used, for example, in a programmable logic device (PLD). The multiplexer includes a plurality of pass transistors passing a selected one of several input values to an internal node, which drives a buffer that provides the multiplexer output signal. The pass transistors can be controlled, for example, by values stored in memory cells of a PLD. The pass transistors have a first oxide thickness and are controlled by a value having a first operating voltage. The buffer includes transistors having a second and thinner oxide thickness, and is operated at a second and lower operating voltage. Where memory cells are used to control the pass transistors, the memory cells include transistors having the first oxide thickness and operate at the first operating voltage. Some embodiments also include transistors of varying gate length for each of the pass transistors, buffer transistors, and memory cell transistors.
摘要:
The invention comprises an FPGA having a plurality of input reference voltages and/or output voltage supplies. In one embodiment, two or more differential amplifiers in the same configurable input buffer use different input reference voltages. According to a second aspect of the invention, the I/O pad line is configurably connected to the input reference voltage line, so that any configurable Input/Output Block (IOB) can be used to supply the input reference voltage. According to a third aspect of the invention, the reference input of an I/O is configurably connected to any of two or more input reference voltage lines. According to another aspect of the invention, a single input reference voltage and/or a single output voltage supply is applied to each IOB, with the IOBs grouped into sets. Each set of IOBs has a separate input reference voltage and/or a separate output voltage supply.
摘要:
Structures and methods of avoiding hold time violations in a design implemented in a PLD. In a programmable device, the delay of a signal path varies, e.g., depending on the separation between the source and destination of the signal. An optional delay element is provided between a programmable interconnect structure and a destination logic element having a clock skew relative to the source. The optional delay element is programmed by the implementation software to introduce a delay on the signal path when necessary to meet the hold time requirements for the destination logic element. The optional delay is designed to be large enough to overcome hold-time violations even for the largest possible clock skew and the smallest possible signal delay. When no hold time violation occurs, the optional delay element is configured to bypass the additional delay, to avoid imposing a large setup requirement on the signal.
摘要:
Structures enabling the efficient testing of interconnect in programmable logic devices (PLDS), and methods utilizing these structures. A PLD includes a non-homogeneous array of programmable logic blocks and an array of standardized interconnect blocks, where the same interconnect block is used for different types of logic blocks. Coupled between each of the interconnect blocks and the associated logic block is a standardized test structure, allowing the same test configuration to be used for each interconnect block even though the interconnect blocks are associated with logic blocks of different types. In some embodiments, one or more types of logic blocks are not associated with standardized test structures. These logic blocks are coupled directly to their associated interconnect blocks, and are preferably of a type that can be configured to emulate the standardized test structure. Thus, by a correct application of configuration data all of the interconnect blocks display the same behavior.