公开(公告)号：US20080315977A1

公开(公告)日：2008-12-25

申请号：US11821540

申请日：2007-06-22

申请人： Ronald Green ,  Belgacem Haba ,  David William Wallis ,  Nicholas J. Colella

发明人： Ronald Green ,  Belgacem Haba ,  David William Wallis ,  Nicholas J. Colella

IPC分类号： H01P3/08 ,  H01P1/18 ,  H01P1/203 ,  H01P5/12 ,  H01P11/00

CPC分类号： H01P3/085 ,  H01P1/184 ,  H01P1/20372 ,  H01P5/16 ,  H01P11/00 ,  H05K1/0219 ,  H05K1/024 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T29/4913

摘要： A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.

摘要翻译： 具有高传播速度和低有效介电损耗的传输结构。 该结构包括电介质，布置在电介质下方的第一参考导体，布置在电介质上方的信号导体和设置在信号导体上的第二参考导体。 第二参考导体具有面向信号导体的凹部，凹部限定第二参考导体和信号导体之间的间隙。 间隙可以填充有大约相当于1（1）的相对介电常数的空气。 由于间隙的物理和介电常数特性，该结构集中在间隙中的电场，导致大约（接近）一（1）的有效介电常数和大约等于零（0）的有效介电损耗。 因此，该结构表现出大致等于光速的传播速度。

公开(公告)号：US20070282358A1

公开(公告)日：2007-12-06

申请号：US11804871

申请日：2007-05-21

申请人： Stan Remiszewski ,  Michael Abrams ,  Dominick Mastri ,  Rich Gambale ,  Jeffrey Radziunas ,  Ronald Green ,  Danial Ferreira

发明人： Stan Remiszewski ,  Michael Abrams ,  Dominick Mastri ,  Rich Gambale ,  Jeffrey Radziunas ,  Ronald Green ,  Danial Ferreira

IPC分类号： A61B17/22

CPC分类号： A61B17/32056 ,  A61B1/0052 ,  A61B1/0055 ,  A61B1/0057 ,  A61B17/00 ,  A61B18/1492 ,  A61B2017/003 ,  A61B2017/00323 ,  A61B2017/00867 ,  A61B2018/00482 ,  A61B2018/00494 ,  A61B2018/00595 ,  A61B2018/1407 ,  A61B2018/144 ,  A61M25/0029 ,  A61M25/0136 ,  A61M25/0138 ,  A61M25/0147 ,  A61M2025/0036 ,  A61M2025/004 ,  A61M2025/0163

摘要： A steerable medical instrument includes a control handle, a shaft, steering control wires, and an end effector at the distal end of the shaft. The end effector is a separate component engineered to distribute the stress and strain of bending moments along the length of the end effector to achieve predicable, repeatable, fine motion control over the distal end of the instrument. The end effector may be customized for any medical application. For example, the end effector may comprise a grasping device, a cutting devise, a snare, a specimen retrieval device, or a wound closure device (such as a stapler).

摘要翻译： 可操纵的医疗器械包括控制手柄，轴，转向控制线和在轴远端的末端执行器。 端部执行器是一个单独的部件，设计用于沿着末端执行器的长度分布弯矩的应力和应变，以实现仪器远端上的可预测的，可重复的精细运动控制。 末端执行器可以针对任何医疗应用进行定制。 例如，末端执行器可以包括抓握装置，切割装置，圈套，样本取出装置或伤口闭合装置（例如吻合器）。

公开(公告)号：US20070138612A1

公开(公告)日：2007-06-21

申请号：US11495287

申请日：2006-07-28

申请人： Michael Warner ,  Ilyas Mohammed ,  Ronald Green ,  John Riley

发明人： Michael Warner ,  Ilyas Mohammed ,  Ronald Green ,  John Riley

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/06 ,  H01L23/04

CPC分类号： H01L25/0657 ,  G01R31/2881 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/3011

摘要： A stackable chip assembly is disclosed, as are different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend or are interspersed between each other. Different connections between the substrates are disclosed, as well as methods of constructing such chip assemblies. In addition, a high G-force testing fixture is also disclosed for use in testing chip packages or the like.

摘要翻译： 公开了可堆叠的芯片组件，以及与其相关的不同实施例。 芯片组件优选地包括至少两个具有安装在其上的部件的基板。 衬底优选地相对于彼此定位，使得一个衬底上的部件朝向另一个衬底延伸，反之亦然。 每个衬底的组件优选地彼此间隔开或散布。 公开了基板之间的不同连接，以及构造这种芯片组件的方法。 此外，还公开了用于测试芯片封装等的高G力测试夹具。

公开(公告)号：US06422874B1

公开(公告)日：2002-07-23

申请号：US09686775

申请日：2000-10-12

申请人： Ronald Green ,  Len Green

发明人： Ronald Green ,  Len Green

IPC分类号： G09B2332

CPC分类号： G09B23/32

摘要： A vertebral model for illustrating the alignment and misalignment of the spine is disclosed. The model consists of first and second members movably mounted to each other, the first and second members each having a longitudinal axis. The model also has a third member interposed between the first and second members. The first and second members are movable relative to each other between a first position, wherein the first and second members are coaxially aligned, and a second position wherein the first and second members are not coaxially aligned. The model also has a locking mechanism for releasably locking the first and second members in their second position. The first and second members are configured to resemble two adjoining vertebrae, and the third member is configured to resemble an inter-vertebral disc between two adjoining vertebrae. The invention permits the model to illustrate how the vertebra can be placed into and out of alignment.

摘要翻译： 公开了用于说明脊柱的对准和未对准的椎体模型。 该模型由可移动地彼此安装的第一和第二构件组成，第一和第二构件各自具有纵向轴线。 该模型还具有插入在第一和第二构件之间的第三构件。 第一和第二构件可在第一位置和第二位置之间相对移动，第一位置和第二位置在第一位置和第二位置之间，其中第一和第二构件同轴对准，第二位置，其中第一和第二构件不同轴对准。 该模型还具有用于将第一和第二构件可释放地锁定在其第二位置的锁定机构。 第一和第二构件被构造成类似于两个邻接的椎骨，并且第三构件构造成类似于两个邻接的椎骨之间的椎间盘。 本发明允许模型说明如何将椎骨置于或不对齐。

公开(公告)号：US5238445A

公开(公告)日：1993-08-24

申请号：US875985

申请日：1992-04-29

申请人： Ronald Green

发明人： Ronald Green

IPC分类号： A47J37/06

CPC分类号： A47J37/0694

摘要： A campfire skewer consisting of an elongate member having a first end, a second end, a first portion adjacent the first end, and a second portion adjacent the second end. The first portion has a first axis and the second portion is offset from the first axis. The first and has means for impaling food. A hand grip is rotatably mounted on the first portion of the elongate member. By holding the hand grip and manipulating the second portion of the elongate member the elongate member can be made to rotate in a rotisserie-like fashion.

摘要翻译： 由具有第一端，第二端，与第一端相邻的第一部分和与第二端相邻的第二部分的细长构件组成的营火串。 第一部分具有第一轴线，第二部分偏离第一轴线。 第一个并且具有刺激食物的手段。 手柄可旋转地安装在细长构件的第一部分上。 通过握持手柄并操纵细长构件的第二部分，细长构件可以制成为旋转式衣服样旋转。

公开(公告)号：US20080105963A1

公开(公告)日：2008-05-08

申请号：US11881743

申请日：2007-07-27

申请人： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

发明人： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

IPC分类号： H01L23/02

CPC分类号： H05K1/144 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/162 ,  H01L2224/16 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/2036

摘要： A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend between each other. In addition various connections between the substrates are disclosed, as well as methods of constructing such chip assemblies.

摘要翻译： 公开了可堆叠的芯片组件，与其相关的许多不同的实施例也是公开的。 芯片组件优选地包括至少两个具有安装在其上的部件的基板。 衬底优选地相对于彼此定位，使得一个衬底上的部件朝向另一个衬底延伸，反之亦然。 每个基板的部件优选彼此延伸。 此外，公开了基板之间的各种连接以及构造这种芯片组件的方法。

公开(公告)号：US20070145560A1

公开(公告)日：2007-06-28

申请号：US11319961

申请日：2005-12-28

申请人： Ronald Green

发明人： Ronald Green

IPC分类号： H01L23/02

CPC分类号： H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together functioning as a capacitor. In a particular embodiment, the laterally adjacent traces provide shunt capacitance to compensate for an inductance in a signal path to the chip which includes the signal-bearing conductive trace. In a variation thereof, a transmission line or waveguide is provided which includes the signal-bearing conductive trace and reference trace. In further variations, transmission lines are provided which include one or more metal layers of a package element, separated from each other by a thickness of a dielectric element included in the package element or the air gap between the package and a circuit panel.

摘要翻译： 提供了一种封装芯片，其包括封装元件，信号承载导电迹线在该封装元件上具有与电介质元件的同一面上的参考导电迹线（例如，接地迹线）的边缘横向相邻的边缘，两个迹线在一起 用作电容器。 在特定实施例中，横向相邻迹线提供并联电容以补偿包括信号承载导电迹线的芯片的信号路径中的电感。 在其变型中，提供了包括信号承载导电迹线和参考迹线的传输线或波导。 在另外的变型中，提供传输线，其包括一个或多个封装元件的金属层，它们彼此隔开包含在封装元件中的电介质元件的厚度或封装元件与电路板之间的气隙。

公开(公告)号：US20070077677A1

公开(公告)日：2007-04-05

申请号：US11607372

申请日：2006-12-01

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  IIyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  IIyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

摘要翻译： 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖着微电子元件的第一面的柔性基板，以及多个导电柱，其从柔性基板延伸并远离第一面 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US20060176130A1

公开(公告)日：2006-08-10

申请号：US11319849

申请日：2005-12-28

申请人： Ronald Green

发明人： Ronald Green

IPC分类号： H01P7/00

CPC分类号： H01P1/205 ,  H01P7/005

摘要： A cavity resonator is provided which includes a shielded enclosure enclosing a volume and a unitary conductor disposed within the volume, the unitary conductor having a first inductor portion and a transmission line portion. The transmission line portion is included in a transmission line having a reference conductor separated from the transmission line portion by a dielectric element. An active semiconductor device is coupled to the unitary conductor, and is operable to conduct a current to the unitary conductor at a resonant frequency of the unitary conductor.

公开(公告)号：US20060037143A1

公开(公告)日：2006-02-23

申请号：US10921198

申请日：2004-08-18

申请人： Ronald Green

发明人： Ronald Green

IPC分类号： A47C27/14 ,  A47C27/15

CPC分类号： A47C15/004 ,  A47C7/021 ,  A47C16/04

摘要： Mediation sitting cushions and mats allow the user to meditate in comfort for great lengths of time, avoiding stress and pain often caused by traditional meditation cushions and mats. The layered mediation sitting cushions and mats combine a slow recovery visco-elastic foam (“VEF”), having load deformation properties and densities, with one or more base layers of a batting support. The sitting cushions and mats enable a person seated in traditional meditation positions to achieve a comfortable posture, regardless of the meditator's size or weight. The sitting cushions and mats also allow people to meditate in traditional cross-legged or kneeling postures comfortably, without irritation or pain. The mediation sitting cushions and mats also maintain of the pelvis in a neutral or slightly anterior position, resulting in proper alignment of the pelvis and spine, which minimizes the muscular and ligamentous strain caused by sitting in stillness for long periods of time.

摘要翻译： 调音座垫和垫子允许使用者在很长一段时间内舒适地冥想，避免经常由传统冥想垫子和垫子引起的压力和痛苦。 坐垫和垫子的分层调解将具有负载变形性能和密度的缓慢恢复的粘弹性泡沫（“VEF”）与一个或多个击球支架的基层组合。 坐垫和垫子使坐在传统冥想位置的人能够实现舒适的姿势，而不管冥想者的大小或重量如何。 坐垫和垫子还允许人们舒适地坐在传统的腿部或跪姿中，没有刺激或疼痛。 坐在坐垫和垫子上的调停也将骨盆保持在中立或稍微向前的位置，导致骨盆和脊柱的适当对准，从而最大限度地减少长时间坐在静息中引起的肌肉和韧带。