公开(公告)号：US20240038429A1

公开(公告)日：2024-02-01

申请号：US17873785

申请日：2022-07-26

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Vivek Arora

IPC: H01F17/00 ,  H01F27/28 ,  H01L23/48 ,  H01L23/64

CPC classification number: H01F17/0033 ,  H01F17/0013 ,  H01F27/2804 ,  H01L23/481 ,  H01L23/645 ,  H01F2027/2809 ,  H01F2017/0086 ,  H01F2017/0073 ,  H01F2017/002

Abstract: An electronic device with an integrated transformer including a first substrate having a first patterned conductive feature with multiple turns that form a first winding, and a first molded magnetic material that encloses a portion of the first patterned conductive feature, and an adhesive layer on a side of the first substrate. The transformer also includes a second substrate having a second patterned conductive feature with multiple turns that form a second winding, and a second molded magnetic material that encloses a portion of the second patterned conductive feature, the second substrate extending on the adhesive layer to magnetically couple the first and second windings. The electronic device includes a package structure that encloses the first and second substrates.

公开(公告)号：US10763230B2

公开(公告)日：2020-09-01

申请号：US16228962

申请日：2018-12-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiroyuki Sada ,  Shoichi Iriguchi ,  Genki Yano ,  Luu Thanh Nguyen ,  Ashok Prabhu ,  Anindya Poddar ,  Yi Yan ,  Hau Nguyen

IPC: H01L21/78 ,  H01L21/683 ,  H01L23/00 ,  H01L23/495

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

公开(公告)号：US20250096084A1

公开(公告)日：2025-03-20

申请号：US18471223

申请日：2023-09-20

Applicant: Texas Instruments Incorporated

Inventor： Vijaylaxmi Khanolkar ,  Yi Yan

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/07

Abstract: A microelectronic device includes a die pad having a first surface and a second, opposite, surface. A first component is directly attached to the first surface of the die pad through a first thermally conductive material. A second component is directly attached to the second surface of the die pad through a second thermally conductive material. At least a portion of the second component overlaps at least a portion of the first component. The microelectronic device further includes a first thermal shunt connecting the die pad to a first lead, and a second thermal shunt connecting the die pad to a second lead. The first thermal shunt is closer to a center of the first component than to a center of the second component. The second thermal shunt is closer to a center of the second component than to a center of the first component.

公开(公告)号：US11869855B2

公开(公告)日：2024-01-09

申请号：US17953162

申请日：2022-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F27/28 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

CPC classification number: H01L23/645 ,  H01F17/04 ,  H01F27/022 ,  H01F27/28 ,  H01F41/0206 ,  H01F41/06 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L28/10

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20240006259A1

公开(公告)日：2024-01-04

申请号：US17852979

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Otake ,  Yuki Sato ,  Takafumi Ando ,  Jeffrey Morroni ,  Anton Winkler ,  Yi Yan

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L49/02 ,  H01L21/56 ,  H01F27/32 ,  H01F41/00

CPC classification number: H01L23/295 ,  H01L24/16 ,  H01L23/3128 ,  H01L25/165 ,  H01L28/10 ,  H01L2224/81447 ,  H01L24/81 ,  H01L21/561 ,  H01F27/327 ,  H01F41/005 ,  H01L2224/16227 ,  H01L28/40

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.

公开(公告)号：US11488914B2

公开(公告)日：2022-11-01

申请号：US16581033

申请日：2019-09-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US11367699B2

公开(公告)日：2022-06-21

申请号：US17009664

申请日：2020-09-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiroyuki Sada ,  Shoichi Iriguchi ,  Genki Yano ,  Luu Thanh Nguyen ,  Ashok Prabhu ,  Anindya Poddar ,  Yi Yan ,  Hau Nguyen

IPC: H01L23/00 ,  H01L21/78 ,  H01L21/683 ,  H01L23/495

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.